Single-sided circuit board made by arranging flat wires side by side and making method thereof

A technology of flat wires and circuit boards, which is applied to printed circuits connected with non-printed electrical components, printed circuit manufacturing, and printed circuits assembled with electrical components. It can solve problems such as low efficiency, inability to produce in large quantities, and serious pollution. , to achieve the effect of eliminating chemical pollution

Active Publication Date: 2012-02-01
王定锋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the former is costly and polluting, while the latter is too inefficient to be mass-produced

Method used

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  • Single-sided circuit board made by arranging flat wires side by side and making method thereof
  • Single-sided circuit board made by arranging flat wires side by side and making method thereof
  • Single-sided circuit board made by arranging flat wires side by side and making method thereof

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Embodiment Construction

[0048] The details of one or more embodiments of the invention are set forth in the following description of the accompanying drawings and the detailed description. Other features, objects and advantages of the invention will be apparent from the description, drawings and claims.

[0049] Several specific embodiments of the method of manufacturing a single-sided circuit board by juxtaposing flat wires according to the present invention will be described in more detail below.

[0050] (1) Fabrication of rigid circuit board

[0051] 1. The production of the flat wire 2: the copper foil is cut into strips or the flat wire 2 is rolled with a flat wire calender or a flat wire 2 of a certain width and thickness (such as image 3 shown). This process is a traditional process and will not be described in detail here.

[0052] 2. Fabrication of juxtaposed groove molds: use mirror surface stainless steel plates such as etching or mechanical processing to process juxtaposed grooves 11...

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PUM

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Abstract

The invention relates to a single-sided circuit board made by arranging flat wires side by side and a making method thereof. Specifically, according to the invention, flat wires are arranged on an insulating material with a gluing property side by side through hot pressing, parts of the flat wires, which need to be disconnected are then cut off, soldering resisting ink is printed or a covering film which is previously provided with a solder pad window is hot-pressed and used as a soldering resisting layer, and bridging connection is realized through printing electricity conducting ink or soldering conductors. When a jack element needs to be arranged, soldering installation can be realized as long as a hole is directly drilled in a soldered spot or a hole is punched by a die. The circuit board can be made without etching. Compared with the traditional circuit board making technology, the novel technology has the advantages of excellent environment friendliness, energy saving and material saving.

Description

technical field [0001] The invention belongs to the circuit board industry. The flat wires are juxtaposed and hot-pressed on insulating materials with adhesive properties, and then the positions of the flat wires to be disconnected are cut and processed to make the circuit board. The invention enables the fabrication of circuit boards without chemical etching. Therefore, compared with the traditional method of making circuit boards, the present invention is a very environmentally friendly, energy-saving and material-saving new technology. Background technique [0002] Traditional circuit board wires are usually etched with copper clad laminates, or laser and milling cutters are used to remove unnecessary copper lines. However, the former are costly and polluting, while the latter are too inefficient to be produced in large quantities. [0003] According to the characteristics of circuit boards with simple circuits and large consumption, the present invention directly adopt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/34H05K1/00H05K1/18F21V23/06F21Y101/02
CPCH05K2203/173H05K3/222H05K3/103H05K2201/0305H05K2203/033H05K2201/10106H05K3/386
Inventor 王定锋徐文红
Owner 王定锋
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