Single-sided circuit board made by arranging flat wires side by side and making method thereof

A flat wire and circuit board technology, which is applied in the directions of printed circuits connected with non-printed electrical components, printed circuit manufacturing, and assembling printed circuits with electrical components, can solve the problems of low efficiency, serious pollution, and high cost, and achieve elimination of Effects of chemical pollution

CN102340928BActive Publication Date: 2013-09-11王定锋
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2013-09-11

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Abstract

A single-side circuit board and a method for making the same are provided. Flat wires (2) are arranged in parallel trench (11) on the surface of a mold. The flat wires (2) are bonded to an insulating sheet (1) with adhesive by heating and pressure. The flat wires (2) are cut off where the flat wires (2) are desired to break off. A solder resist layer (3) is formed on the flat wires (2) by printing solder resist ink or by heating and pressing a cover film with solder pad openings. The bridge connection (6, 14) between the flat wires (2) is formed by printing conductive ink or by soldering conductor. When mounting of pin devices is desired, the holes (15) for mounting the pins of devices are formed at the position of solder pads by drilling or punching. The etching step is not necessary during the process of making circuit board.
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Description

technical field

[0001] The invention belongs to the circuit board industry. The flat wires are juxtaposed and hot-pressed on insulating materials with adhesive properties, and then the positions of the flat wires to be disconnected are cut and processed to make the circuit board. The invention enables the fabrication of circuit boards without chemical etching. Therefore, compared with the traditional method of making circuit boards, the present invention is a very environmentally friendly, energy-saving and material-saving new technology. Background technique

[0002] Traditional circuit board wires are usually etched with copper clad laminates, or laser and milling cutters are used to remove unnecessary copper lines. However, the former are costly and polluting, while the latter are too inefficient to be produced in large quantities.

[0003] According to the characteristics of circuit boards with simple circuits and large consumption, the present invention directly adopt...

Examples

Embodiment Construction

[0048] The details of one or more embodiments of the invention are set forth in the following description of the accompanying drawings and the detailed description. Other features, objects and advantages of the invention will be apparent from the description, drawings and claims.

[0049] Several specific embodiments of the method of manufacturing a single-sided circuit board by juxtaposing flat wires according to the present invention will be described in more detail below.

[0050] (1) Fabrication of rigid circuit board

[0051] 1. The production of the flat wire 2: the copper foil is cut into strips or the flat wire 2 is rolled with a flat wire calender or a flat wire 2 of a certain width and thickness (such as image 3 shown). This process is a traditional process and will not be described in detail here.

[0052] 2. Fabrication of juxtaposed groove molds: use mirror surface stainless steel plates such as etching or mechanical processing to process juxtaposed grooves 11...