Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Single-sided circuit board made by arranging flat wires side by side and making method thereof

A flat wire and circuit board technology, which is applied in the directions of printed circuits connected with non-printed electrical components, printed circuit manufacturing, and assembling printed circuits with electrical components, can solve the problems of low efficiency, serious pollution, and high cost, and achieve elimination of Effects of chemical pollution

Active Publication Date: 2013-09-11
王定锋
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the former is costly and polluting, while the latter is too inefficient to be mass-produced

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Single-sided circuit board made by arranging flat wires side by side and making method thereof
  • Single-sided circuit board made by arranging flat wires side by side and making method thereof
  • Single-sided circuit board made by arranging flat wires side by side and making method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] The details of one or more embodiments of the invention are set forth in the following description of the accompanying drawings and the detailed description. Other features, objects and advantages of the invention will be apparent from the description, drawings and claims.

[0049] Several specific embodiments of the method of manufacturing a single-sided circuit board by juxtaposing flat wires according to the present invention will be described in more detail below.

[0050] (1) Fabrication of rigid circuit board

[0051] 1. The production of the flat wire 2: the copper foil is cut into strips or the flat wire 2 is rolled with a flat wire calender or a flat wire 2 of a certain width and thickness (such as image 3 shown). This process is a traditional process and will not be described in detail here.

[0052] 2. Fabrication of juxtaposed groove molds: use mirror surface stainless steel plates such as etching or mechanical processing to process juxtaposed grooves 11...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A single-side circuit board and a method for making the same are provided. Flat wires (2) are arranged in parallel trench (11) on the surface of a mold. The flat wires (2) are bonded to an insulating sheet (1) with adhesive by heating and pressure. The flat wires (2) are cut off where the flat wires (2) are desired to break off. A solder resist layer (3) is formed on the flat wires (2) by printing solder resist ink or by heating and pressing a cover film with solder pad openings. The bridge connection (6, 14) between the flat wires (2) is formed by printing conductive ink or by soldering conductor. When mounting of pin devices is desired, the holes (15) for mounting the pins of devices are formed at the position of solder pads by drilling or punching. The etching step is not necessary during the process of making circuit board.

Description

technical field [0001] The invention belongs to the circuit board industry. The flat wires are juxtaposed and hot-pressed on insulating materials with adhesive properties, and then the positions of the flat wires to be disconnected are cut and processed to make the circuit board. The invention enables the fabrication of circuit boards without chemical etching. Therefore, compared with the traditional method of making circuit boards, the present invention is a very environmentally friendly, energy-saving and material-saving new technology. Background technique [0002] Traditional circuit board wires are usually etched with copper clad laminates, or laser and milling cutters are used to remove unnecessary copper lines. However, the former are costly and polluting, while the latter are too inefficient to be produced in large quantities. [0003] According to the characteristics of circuit boards with simple circuits and large consumption, the present invention directly adopt...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/34H05K1/00H05K1/18F21V23/06F21Y101/02
CPCH05K2201/0305H05K3/386H05K3/222H05K2203/033H05K2201/10106H05K2203/173H05K3/103
Inventor 王定锋徐文红
Owner 王定锋
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products