Backboard and communication device

Abstract

The invention relates to the technical field of communication systems and discloses a backboard and a communication device. The backboard comprises at least one fixing plate, a plurality of connectors and a plurality of flexible cables, the corresponding connectors are in signal connection through the flexible cables, each connector in the connectors is provided with a shell and a plurality of signal inserting pins mounted in the shell, the shells are mounted on the fixing plates and are provided with sockets used for being connected with connectors of a daughter card in the communication device, one end of each signal inserting pin stretches into the corresponding socket, and the other end of each signal inserting pin is connected with one flexible cable in the flexible cables. The face, facing the daughter card in the communication device, of each fixing plate is the inserting connecting face of the fixing plate, and the flexible cables are located on the sides, apart from the inserting connecting faces, of the fixing plates. When the communication device with the backboard transmits high-speed signals, the transmission quality and the transmission speed of the high-speed signals are not constrained by the technology for manufacturing traditional PCBs, and the transmission quality and the transmission speed of the high-speed signals of the communication device are high.

Description

Technical field [0001] The present invention relates to the technical field of communication systems, in particular to a backplane and communication equipment. Background technique [0002] In the communication system, the backplane is an important part of the communication equipment. It is generally composed of multi-layer printed circuit boards, PCB boards, connectors, etc., which provide electrical signal connections and physical support for the various daughter cards and modules in the communication system. . [0003] With the continuous development of communication system technology, the demand for large-capacity communication systems requires higher and higher signal transmission rates in the backplane, and the channels for signal transmission are getting larger and larger, which in turn affects the conductive pattern layer in the PCB board in the backplane. The number, size, density, etc. requirements are getting higher and higher, and the high-speed transmission rate has h...

AI Technical Summary

Problems solved by technology

[0005] Although the backplane with the above structure separates the wiring of high-speed signals into the small backplane 02, the signal transmission rate in the small backplane 02 is still limited by the traditional PCB board manufacturing process, which leads to the high-speed signal in the communication equipment. Poor transmission quality, low transmission rate, and inflexible signal channel layout

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