118results about How to "Avoid excessive temperature" patented technology

A feedthrough filter capacitor assembly includes a conductive terminal pin which extends through a first passageway of a capacitor in conductive relation with a first set of electrode plates, and through a conductive ferrule and an insulator in non-conductive relation. The insulator includes ground plates conductively coupled to the ferrule. A second set of electrode plates of the capacitor are conductively coupled to the insulator ground plates, such as by a ground pin extending through the capacitor in relation with the second set of electrode plates, and at least partially extending through a second passageway of the insulator in conductive relation with the ground plates. In this manner, the exterior electrical/mechanical connection between the capacitor and ferrule or other ground member is eliminated.

The present invention describes a method and apparatus for forming a uniform silicon containing film in a single wafer reactor. According to the present invention, a silicon containing film is deposited in a resistively heated single wafer chamber utilizing a process gas having a silicon source gas and which provides an activation energy less than 0.5 eV at a temperature between 750° C.-550° C.

Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25 DEG C. This technique involves depositing a material in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment. This moderate heat treatment differs from other commonly employed "stress relief" heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. Coating a shape and heat treating provides a shaped deposit with improved material properties. Coating a shape with a portion connected to a base and a portion detached therefrom can provide a resilient, conductive contact useful for electronic applications.

It is an object of the present invention to provide an improved orthopedic implant system with satisfied biological, mechanical and morphological compatibilities. Solid metal femoral stem (entirely or partially) and solid metal acetabular head (entirely or partially) are covered with diffusion-bonded foamed-shaped sheet made of commercially pure titanium or titanium alloy(s). The open-cells in said foamed metal sheet are impregnated with biocompatible polymethyl methacrylate resin cement, which is reinforced with selected oxides (e.g., alumina, magnesia, zirconia, or a combination of these oxides) along with an application of a small amount of a metal primer agent.

Liquid crystal display device 1 includes pixels PX, individual and common electrodes PE and CE provided for pixels PX and flicker compensation circuit 8. Flicker compensation circuit 8 changes a central level of common voltage Vcom for common electrode CE. Flicker compensation circuit 8 is provided with capacitor 31, variable resistor 32, switch 34, arithmetic operation circuit 33 and buffer amplifier 35. Capacitor 31 supplies common voltages Vcom from common voltage generation circuit 6. Variable resistor 32 changes common voltages Vcom while switch 34 selects one of two different voltages VCC1 and VCC2. Arithmetic operation circuit 33 combines an output of variable resistor 32 with that of switch 34 and buffer amplifier 35 supplies thus combined outputs V'com to common electrode CE as compensated common voltages.

The embodiment of the invention provides thermal protection method and device and equipment with the thermal protection function, relates to the technical field of thermal protection, and is applied to avoid over-high temperature generation of equipment under the continuous use conditions and improve the user experience. The method comprises the following steps of: arranging temperature sensors in at least one temperature measurement position of the equipment and obtaining a measured temperature in each temperature measurement position; obtaining a preset temperature in each temperature measurement position; comparing the measured temperature with the corresponding preset temperature in each temperature measurement position; if the first measured temperature is higher than the corresponding preset temperature in the first temperature measurement position, determining the abnormal temperature level of the first measured temperature; and if the first measured temperature is of the first abnormal temperature level, reducing the performance parameters of the processing unit of the equipment in the first temperature measurement position.

A process for making a tufted article from a thermoplastic material comprises controlling injection pressure according to a pressure-dominated algorithm including detecting at least 100 melt-pressure measurements per second upstream a front end of a mold cavity. An apparatus comprises a pressure-control mechanism for monitoring and adjusting an injection pressure according to the pressure-dominated algorithm, wherein the pressure-control mechanism comprises at least one high-frequency pressure sensor located upstream the mold cavity's front end.

A valve pin bushing for a valve gated injection molding apparatus having, a back plate, a valve pin bushing, and a manifold, with axially aligned respective valve pin bores. The valve pin bushing includes a back plate contacting surface and an opposite manifold contacting surface for bearing against the back plate and manifold, respectively. The back plate contacting surface has a surface area larger than a surface area of the manifold contacting surface to draw heat from the valve pin bushing to the cooler back plate. An air gap, which may be sealed by an optional sealing portion, is formed where the flange is spaced away from a central portion of the valve pin bushing near the manifold. The valve pin bushing also includes a tubular member for positioning within the manifold valve pin bore, which defines a portion of the manifold melt passageway.

There are provided a metal film-carrying substrate including a substrate and a metal film with good adhesion to the substrate and being less dependent on temperature or humidity, and a method for preparation thereof. There are also provided a metal pattern material having a patterned metal portion with good adhesion to a substrate, being less dependent on temperature or humidity, and providing highly reliable insulation for a region where the patterned metal portion is not formed, and a method for preparation thereof. The method for preparing the metal film-carrying substrate includes: (a1) forming a polymer layer on a substrate, the polymer layer including a polymer that has a non-dissociating multidentate functional group capable of interacting with a plating catalyst or a precursor thereof and is directly and chemically bonded to the substrate; (a2) applying a multidentate plating catalyst or a precursor thereof to the polymer layer; and (a4) performing plating on the multidentate plating catalyst or precursor thereof; and (a3) optionally adding a metal to the polymer layer after the step (a2), the metal being different from the multidentate plating catalyst or precursor thereof.

Substrates having increased thermal conductivity are provided, comprising a body having opposed surfaces and a cavity that opens on at least one surface, the cavity containing at least one material having a greater thermal conductivity than the body. Devices are provided comprising a substrate and a semiconductor over a surface of the substrate. Methods of forming devices according to the invention are also provided.

A chemically amplified positive resist composition for EB or EUV lithography is provided comprising (A) a polymer or a blend of polymers wherein a film of the polymer or polymer blend is insoluble in alkaline developer, but turns soluble under the action of acid, (B) an acid generator, (C) a basic compound, and (D) a solvent. The basic compound (C) is a polymer comprising recurring units bearing a side chain having a secondary or tertiary amine structure as a basic active site and constitutes a part or the entirety of the polymer or polymers as component (A).

An apparatus and method for bending and/or tempering glass substrate(s) are provided. The amount of near-IR radiation which reaches the glass to be bent and/or tempered is limited (e.g., via filtering or any other suitable technique). Thus, the IR radiation (used for heating the glass) which reaches the glass to be bent and/or tempered includes mostly mid-IR and/or far-IR radiation, and not much near-IR. In such a manner, coating(s) provided on the glass can be protected and kept at lower temperatures so as to be less likely to be damaged during the bending and/or tempering process. Heating efficiency can be improved. A ceramic (e.g., aluminosilicate) filter or baffle may be used in certain embodiments in order to reduce the amount of mid-IR and/or far-IR radiation reaching the glass to be tempered and/or bent.

A method for making thermally conductive high aspect ratio large area contact between devices while reducing the heating of the devices. The method of the invention includes the use of reactive foils to solder two devices together at room temperature while imparting significantly less temperature rise and resultant residual stress in the bulk devices when compared with conventional reflow solder techniques.

Induction heating is utilized to braze together a plurality of components for a heat exchanger. The induction heater is provided with flux concentrators that raise the applied temperature at locations on the heat exchanger components which require a higher temperature. In this manner, a relatively small inductor heater can replace the relatively massive furnaces of the prior art.

The invention relates to a method for operating a firing furnace, in particular for the dental sector, in which the temperature is measured and, based on the measured temperature, a temperature control is performed. If appropriate, the temperature integral, recorded at discrete points, is determined over the course of time and in particular stored, and is used, if appropriate in addition to the temperature, for controlling the firing furnace.

A semiconductor device according to the present invention includes: a substrate; a plurality of trenches formed in the substrate; and a plurality of functional element forming regions arrayed along each of the trenches, including a channel forming region as a current path, wherein the plurality of functional element forming regions includes a first functional element forming region in which the area of the channel forming region per unit area is relatively small and a second functional element forming region in which the area of the channel forming region per unit area is relatively large, and the first functional element forming region is provided at a region where heat generation should be suppressed.

Pneumatic rubber tire intended for heavy duty service having a cap/base configured tread with a silica-containing specialized cis 1,4-polybutadiene rubber-rich tread cap rubber layer.

According to some embodiments, a multimode optical fiber comprises a graded index glass core with refractive index Δ1, a maximum refractive index delta Δ1_MAX, and a core radius between 10 and 40 microns; and cladding region surrounding the core comprising refractive index Δ4, wherein the fiber exhibits an overfilled bandwidth exhibits an overfilled bandwidth of at least 3 GHz-km at a wavelength of 850 nm and an overfilled bandwidth of at least 1.2 GHz-km at one or more wavelengths between 980 and 1060 nm.