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450 results about "Adamite" patented technology

Adamite is a zinc arsenate hydroxide mineral, Zn₂AsO₄OH. It is a mineral that typically occurs in the oxidized or weathered zone above zinc ore occurrences. Pure adamite is colorless, but usually it possess yellow color due to Fe compounds admixture. Tints of green also occur and are connected with copper substitutions in the mineral structure. Olivenite is a copper arsenate that is isostructural with adamite and there is considerable substitution between zinc and copper resulting in an intermediate called cuproadamite. Zincolivenite is a recently discovered mineral being an intermediate mineral with formula CuZn(AsO₄)(OH). Manganese, cobalt, and nickel also substitute in the structure. An analogous zinc phosphate, tarbuttite, is known.

Online self-sharpening metallic bond and super-hard abrasive precision grinding pellet and preparation method thereof

The invention provides an online self-sharpening metallic bond and super-hard abrasive precision grinding pellet and a preparation method thereof and belongs to the technical field of precision grinding pellets. Raw materials of the precision grinding pellet comprise a super-hard abrasive and a metallic bond, wherein the super-hard abrasive is diamond micro-powder; the diamond concentration falls within a range of 75-100 %; and the metallic bond uses a multicomponent alloy bond whose main components are copper powder, tin powder, aluminum powder, copper-clad ball shaped graphite powder, silicon dioxide and ferroferric oxide powder. The preparation method comprises the following steps: uniformly mixing and stirring the diamond micro-powder as well as the copper powder, the tin powder and the aluminum powder; adding polyvinyl alcohol to a mixture and mixing the polyvinyl alcohol and the mixture; adding the silicon dioxide, the copper-clad ball shaped graphite powder and the ferroferric oxide powder to an obtained mixture and mixing these materials and the obtained mixture; filling the mixture into a graphite mold; maintaining the pressure of the graphite mold for 5-10 minutes after pressurizing the graphite mold to 100-250 MPa; and carrying out hot pressing sintering on the graphite mold in a sintering furnace, wherein the sintering atmosphere is ammonia decomposition gas. Through the adoption of the online self-sharpening metallic bond and super-hard abrasive precision grinding pellet provided by the invention, online automatic sharpening can be achieved without blockage and offline repairing.
Owner:BEIJING UNIV OF TECH

Diamond surface chemical mechanical combined machining method and device thereof

InactiveCN101972979AImprove the efficiency of graphitizationGuaranteed grinding qualityLapping machinesGraphiteAdamite
The invention relates to a diamond surface chemical mechanical combined grinding and polishing method. Composite material is adopted as a tool millstone used for grinding and polishing, the tool millstone is heated to appropriate temperature, and then high speed rotational motion is carried out; certain pressure is utilized to press a diamond film / block to be processed onto the surface of the millstone, so that high speed friction is produced between the diamond film / block and the surface of the millstone, and high efficiency grinding and polishing on the surface of the diamond is realized under the chemical-mechanical combined circulation action of friction region. The method adopts a chemical-mechanical combined way, and the grinding process includes a catalytic surface graphitizing process and a mechanical graphite scraping process. In the combined circulation process of chemical action and mechanical action, diamond surface material is efficiently removed. The related device integrates heating and loading functions, a combined millstone is used as a tool millstone, and the beneficial effects include that processing efficiency is high, mechanical acting force is small and processing quality is good. The invention also relates to a diamond surface chemical mechanical combined grinding and polishing device.
Owner:NANJING UNIV OF AERONAUTICS & ASTRONAUTICS

Diamond as a polish-stop layer for chemical-mechanical planarization in a damascene process flow

A method of using diamond or a diamond-like carbon layer as a polish-stop for patterning a metal level into an inter-level dielectric substrate using a damascene process flow. The diamond or diamond-like carbon layer is deposited onto the surface of the substrate before patterning the metal level. A protective layer is then deposited over the diamond or diamond-like carbon polish-stop layer, wherein such protective layer may act as an additional polish-stop layer. Together, the diamond or diamond-like carbon polish-stop layer and the protective layer are used as a hard-mask for patterning the trenches that will become the metal features, wherein such protective layer protects the diamond or diamond-like carbon polish-stop layer during the patterning process. After deposition of a conductive metal layer, the dielectric substrate is polished to remove excess conductive material, as well as topography. In the polishing process, the diamond or diamond-like carbon polish-stop layer and any remaining protective layer are used as polish-stop layers. The diamond or diamond-like carbon polish-stop layer allows for an improved planar surface, thereby resulting in a sufficient decrease in topography at the surface of the inter-level dielectric.
Owner:QIMONDA +1

Nano diamond-macromolecular composite abrasive for solidifying abrasive polishing pad

The invention provides a method for preparing a diamond-macromolecular composite abrasive. The cores of composite abrasive particles are diamond powder prepared by a mechanical crushing method, an explosive synthesis method or a static pressure method, and the particle diameter range of the powder is 1 to 100 nanometers; the powder serving as the core is modified to form an intermediate transition layer through a silane coupling agent, and the intermediate transition layer is grafted and wrapped to form the composite abrasive by using epoxy resin and polyacrylate, wherein the mass of the silane coupling agent is 0.2 to 2 percent of that of the nano particles; and the mass of the epoxy resin and the polyacrylate is 0.2 to 2 percent of that of inorganic nano particles. The compatibility between the abrasive and a polishing pad base body is improved, and the nano diamond composite abrasive treated by different macromolecules can be selected according to different polishing pad base bodies. By introducing groups to the surface of the diamond abrasive, the bonding force between the diamond abrasive and the polishing pad base body is improved, drop of the diamond abrasive is reduced, and surface damage of a machined workpiece due to drop of the diamond abrasive in the polishing process is prevented.
Owner:ANHUI UNIVERSITY OF TECHNOLOGY

Diamond as a polish-stop layer for chemical-mechanical planarization in a damascene process flow

A method of using diamond or a diamond-like carbon layer as a polish-stop for patterning a metal level into an inter-level dielectric substrate using a damascene process flow. The diamond or diamond-like carbon layer is deposited onto the surface of the substrate before patterning the metal level. A protective layer is then deposited over the diamond or diamond-like carbon polish-stop layer, wherein such protective layer may act as an additional polish-stop layer. Together, the diamond or diamond-like carbon polish-stop layer and the protective layer are used as a hard-mask for patterning the trenches that will become the metal features, wherein such protective layer protects the diamond or diamond-like carbon polish-stop layer during the patterning process. After deposition of a conductive metal layer, the dielectric substrate is polished to remove excess conductive material, as well as topography. In the polishing process, the diamond or diamond-like carbon polish-stop layer and any remaining protective layer are used as polish-stop layers. The diamond or diamond-like carbon polish-stop layer allows for an improved planar surface, thereby resulting in an sufficient decrease in topography at the surface of the inter-level dielectric.
Owner:IBM CORP +1

Silicified diamond/SiC composite material preparation method

The invention discloses a silicified diamond/SiC composite material preparation method, which belongs to the field of electronic packaging materials. Diamond particles and silicon powder are firstly subjected to wet mixing, sintering is carried out after thorough grinding, the diamond surface and the silicon powder react, and a layer of silicon carbide coating is generated; then, the diamond particles with the surface coated with the silicon carbide and the silicon powder are mixed, an organic binder is added at the same time, grinding is carried out, mixing on a mixer is carried out, and uniform composite particles are obtained; the composite particles are subjected to prepressing and debinding and are transferred to a vacuum infiltration furnace, a silicon burial method is adopted for vacuum infiltration, and a compact diamond/SiC composite material is prepared. The silicon powder is adopted to modify the diamond particles, the interfacial bonding between diamond and silicon is improved, the compactness of the obtained diamond/SiC composite material is more than 95%, the hardness is above HRA 80, the bending strength exceeds 200 MPa, the thermal conductivity reaches 600 W/mK, andthe thermal expansion coefficient 1.5 to 4*10<-6>/K. Thus, multiple products with complex characters, complex curvature and large size can be prepared at one time, the production efficiency is high,and the cost is low.
Owner:UNIV OF SCI & TECH BEIJING

Compound metal and ceramic bonding agent diamond grinding wheel

The invention relates to the technical field of abrasive grinding of grinding tools, and in particular to a compound metal and ceramic bonding agent diamond grinding wheel. The compound metal and ceramic bonding agent diamond grinding wheel is prepared from, by weight, 50-70 parts of surface titanium-coated diamond abrasive, 4-10 parts of tin powder, 10-20 parts of copper powder, 10-18 parts of aluminum powder, 11-18 parts of silicon dioxide, 5-10 parts of boric oxide, 5-8 parts of zinc oxide, 2-6 parts of calcium oxide, 0.01-1 part of lanthanum powder and 1-4 parts of aluminum oxide. Due to the fact that the surface of diamond is coated with titanium so that oxidization resistance can be achieved; titanium is slowly dissolved in a bonding agent in subsequent reactions and forms a transition layer with the diamond abrasive, and therefore the bonding force of the bonding agent on the abrasive is improved; the lanthanum powder is added so that the mechanical performance of a matrix of the grinding wheel can be effectively improved, and the bonding strength of a matrix material on diamond is improved and strengthened; and the aluminum oxide is added so that the pore forming function can be achieved. The compound metal and ceramic bonding agent diamond grinding wheel maintains the good self-sharpening performance of a ceramic bonding agent grinding wheel and also has the good characteristics of high rigidity and good shape maintenance of a metal bonding agent grinding wheel; and formulas are in cooperation, so that the forming performance of the grinding wheel is good, and the service life is long.
Owner:蓬莱市超硬复合材料有限公司
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