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Nano diamond-macromolecular composite abrasive for solidifying abrasive polishing pad

A composite abrasive and polymer technology, applied in abrasives, grinding tools, metal processing equipment, etc., to achieve good dispersion stability and adhesion, and reduce hardness

Inactive Publication Date: 2012-07-04
ANHUI UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention patent with the publication number CN101096080A discloses that the acrylate prepolymer on the surface of the abrasive is cured by ultraviolet light to form a fixed abrasive polishing pad. The fly in the ointment is that the abrasive can only form a specific type of polishing pad matrix after treatment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Disperse the nano-diamond particles with an average particle size of 10nm in an absolute ethanol solution containing 0.2% of the particle mass ratio of the silane coupling agent KH550, condense and reflux at the boiling point for 5 hours; centrifuge, wash 3 times, and then use 0.2% particles The anhydrous ethanol dispersion liquid of the epoxy resin of mass ratio is condensed and refluxed at the boiling point for 5 hours; centrifuged, washed 3 times, and vacuum-dried at 110°C for 6 hours to obtain a composite abrasive; The ratio is mixed evenly, screen-printed on the polycarbonate polymer matrix, and cured at room temperature for 12 hours to form an abrasive layer with a thickness of 0.8mm. The above-mentioned composite layer is pasted on the elastic matrix to form a fixed abrasive polishing pad.

[0014] Attach the fixed abrasive polishing pad to the UNIPOL-1000 grinding and polishing machine to perform a polishing test on the sapphire substrate. The polishing liquid do...

Embodiment 2

[0016] Disperse the nano-diamond particles with an average particle size of 50nm in an anhydrous ethanol solution containing 1% particle mass ratio of silane coupling agent KH560, condense and reflux at the boiling point for 5 hours; centrifuge, wash 3 times, and then use 1% particle mass ratio The absolute ethanol dispersion of polyacrylate with a mass ratio is condensed and refluxed at the boiling point for 5 hours; centrifuged, washed 3 times, and vacuum-dried at 110°C for 6 hours to obtain a composite abrasive; then the composite abrasive and thermoplastic polyurethane are 4:96 The ratio is mixed evenly, screen-printed on the polycarbonate polymer matrix, and cured at room temperature for 12 hours to form an abrasive layer with a thickness of 0.8mm. The above-mentioned composite layer is pasted on the elastic matrix to form a fixed abrasive polishing pad.

[0017] Attach the fixed abrasive polishing pad to the UNIPOL-1000 grinding and polishing machine to perform a polishin...

Embodiment 3

[0019] Disperse the nano-diamond particles with an average particle size of 100nm in an absolute ethanol solution containing 2% particle mass ratio of silane coupling agent KH550, condense and reflux at the boiling point for 5 hours; centrifuge, wash 3 times, and then use 2% particle mass ratio The anhydrous ethanol dispersion liquid of the epoxy resin of mass ratio is condensed and refluxed at the boiling point for 5 hours; centrifuged, washed 3 times, and vacuum-dried at 110°C for 6 hours to obtain a composite abrasive; The ratio is mixed evenly, screen-printed on the polycarbonate polymer matrix, and cured at room temperature for 12 hours to form an abrasive layer with a thickness of 0.8mm. The above-mentioned composite layer is pasted on the elastic matrix to form a fixed abrasive polishing pad.

[0020] Attach the fixed abrasive polishing pad to the UNIPOL-1000 grinding and polishing machine to perform a polishing test on the sapphire substrate. The polishing liquid does n...

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Abstract

The invention provides a method for preparing a diamond-macromolecular composite abrasive. The cores of composite abrasive particles are diamond powder prepared by a mechanical crushing method, an explosive synthesis method or a static pressure method, and the particle diameter range of the powder is 1 to 100 nanometers; the powder serving as the core is modified to form an intermediate transition layer through a silane coupling agent, and the intermediate transition layer is grafted and wrapped to form the composite abrasive by using epoxy resin and polyacrylate, wherein the mass of the silane coupling agent is 0.2 to 2 percent of that of the nano particles; and the mass of the epoxy resin and the polyacrylate is 0.2 to 2 percent of that of inorganic nano particles. The compatibility between the abrasive and a polishing pad base body is improved, and the nano diamond composite abrasive treated by different macromolecules can be selected according to different polishing pad base bodies. By introducing groups to the surface of the diamond abrasive, the bonding force between the diamond abrasive and the polishing pad base body is improved, drop of the diamond abrasive is reduced, and surface damage of a machined workpiece due to drop of the diamond abrasive in the polishing process is prevented.

Description

Technical field: [0001] The invention relates to a diamond-macromolecule composite abrasive for preparing a bonded abrasive chemical mechanical polishing pad. By grafting a polymer with a specific reactive functional group on the surface of nano-diamond, it can react with the polishing pad matrix to improve the diamond abrasive and The bonding force between the polishing pad substrates reduces the shedding of diamond abrasives and prevents the surface damage of the workpiece caused by the shedding of diamond abrasives during the polishing process. Background technique: [0002] Chemical mechanical polishing technology has become a key technology in the chip manufacturing process, almost the only technology for global planarization in chip manufacturing, and is currently also used in the surface planarization of semiconductor wafers. [0003] Traditional chemical mechanical polishing requires a polishing liquid containing abrasives. The used polishing liquid contains a large ...

Claims

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Application Information

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IPC IPC(8): B24B37/24B24D3/28
Inventor 储向峰乔红斌董永平张王兵陈同云汤丽娟朱小华
Owner ANHUI UNIVERSITY OF TECHNOLOGY
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