The invention relates to a light-emitting
diode (LED)
printed circuit board and a preparation method of an
amorphous diamond heat dissipation and insulation film layer thereof, in particular to an LED
printed circuit board and a preparation method of a heat dissipation and insulation dual-
efficacy film layer thereof. In the invention, the problem of poor heat dissipation effect of the existing LED
printed circuit board because the hard-and-fast requirement of electric insulation is limited is solved, and an LED printed circuit board and a preparation method of an
amorphous diamond heat dissipation and insulation film layer thereof are provided. The circuit board is formed by adding the
amorphous diamond heat dissipation and insulation film layer between a printed circuit board and a
copper circuit. The preparation method comprises the following concrete steps: (1) cleaning: cleaning the LED printed circuit board by deionized water, and blow-
drying the LED printed circuit board; (2)
etching:
etching the amorphous
diamond depositing surface of the LED printed circuit board by a Kaufman
ion gun; and (3) depositing: alternately depositing carbon ions by adopting different
negative bias to gradually form the heat dissipation and insulation dual-
efficacy film layer of an amorphous
diamond film formed by alternately constructing a sub-film layer with
low stress and a sub-film layer with high sp3 hybridization content. The invention is suitable for printed circuit boards.