The invention discloses a
Schottky diode device and a preparation method thereof, and belongs to the technical field of power semiconductors. The
Schottky diode device comprises an N-type substrate layer, an N-type buffer layer, a first N-type epitaxial layer, a first P-type region, a second N-type epitaxial layer, a second P-type region, an
anode ohmic
metal contact layer, an
anode Schottky
metal contact layer, an
anode metal layer and a
cathode metal layer. Wherein the upper surface of the second N-type epitaxial layer comprises a plurality of grooves, so that the Schottky metal contact area and the ohmic metal contact area are increased, the conduction
voltage drop can be reduced, and the anti-surge capability of the device is improved. According to the double-layer epitaxial structure, the
doping concentration at the interface of Schottky metal and a
semiconductor is improved, a depletion layer on the Schottky contact surface is narrowed, the
hot electron emission current is increased, the effective barrier height is reduced, the tunneling effect is enhanced, and the conduction
voltage drop is reduced. While low conduction
voltage drop and low
reverse leakage current are taken into consideration, the stability and reliability of the device under high surge current are remarkably improved.