9 results about "HFSS" patented technology

The application discloses a kind of litz wire winding intelligent design optimization methods, and the litz wire winding ac resistance and porosity are obtained by neural network and hfss, the model of litz wire winding is constructed using hfss simulation software to simulate the ac resistance of litz wire winding under different materials, different number of turns, different litz wire winding radius and different frequency, to complete the training data and test data used to litz wire winding neural network model. Manual grid division is used to simplify the solving steps and time, and the accuracy is ensured. The litz wire winding neural network model is used to automatically train and test using particle swarm optimization algorithm to improve the network model, and finally the litz wire winding neural network model can quickly and accurately obtain the required litz wire winding ac resistance. The application can be used to quickly and accurately obtain the litz wire winding ac resistance under different requirements, reduce the amount of calculation and working time, greatly improve the efficiency.

The invention relates to a simulation method for the influence of a radiation environment on the signal transmission characteristics of a microsystem device, and the method comprises the following steps: S1, constructing a three-dimensional model of the microsystem device, and splitting the three-dimensional model into independent grid files according to the types of materials; s2, setting a particle type, energy and an incident region in Geant4, simulating particle bombardment, and outputting single-particle energy deposition data, energy deposition distribution and linear energy transfer (LET) data; s3, establishing a material damage model in MATLAB, and calculating the post-radiation conductivity sigma (t) and relative dielectric constant epsilon r based on particle and substance action mechanism analysis; and S4, updating the material parameters calculated in the step S3 to a device model in the HFSS, simulating a signal transmission characteristic curve in a radiation environment, and analyzing an influence mechanism of radiation on signal transmission. The electrical performance of the micro-system device can be accurately evaluated in different radiation environments, a scientific basis is provided for design and optimization of the micro-system device in a high-radiation environment, and the anti-radiation capability and reliability of the device are effectively improved.

The invention discloses a design method of an LC filter based on integration of HFSS Maxwell 3D and circuit calculation software, and aims to establish a complete and appropriate printed board model through the HFSS Maxwell 3D software to obtain accurate circuit distribution parameters, so that a circuit prototype model of the LC filter is optimized, accurate parameters of components such as a capacitor and an inductor are further obtained, and the design method of the LC filter based on integration of the HFSS Maxwell 3D and the circuit calculation software is realized. The method and the device are used for improving design accuracy.

The utility model discloses a cavity-backed resonant coplanar waveguide antenna working in a K wave band, and belongs to the technical field of cavity-backed resonant coplanar waveguide antennas. The utility model relates to a cavity-backed coplanar waveguide antenna working in a K wave band. The antenna structure is divided into three layers and is mainly formed by tightly connecting an upper concentric annular radiation patch, a feed band line, a grounding plate, a middle dielectric plate and a lower resonant cavity, and the main transmission mode of the antenna is coplanar waveguide. The metal patch is made of copper, Roger RO3010 with the dielectric constant of 10.2 is selected as the dielectric plate, an Al2O3 ceramic resonant cavity is carried, good resonance characteristics are achieved, and the gain characteristics of the antenna are improved. According to the utility model, the process and the result of structure optimization are mainly displayed, and the HFSS and the CST are adopted as simulation tools to realize structure optimization and impedance matching. According to the design, the problems of high loss and low gain when the antenna works at high frequency are solved, and more possibilities are provided for the antenna in the fields of wireless communication, modern radar, base station antennas, unmanned driving and the like due to the good matching characteristic of the antenna.

This invention belongs to the field of electromagnetic simulation design, specifically a method for HFSS mesh format conversion. Addressing the challenges of complex HFSS proprietary mesh data structures, closed formats, and a lack of public interfaces, this invention proposes a systematic analytical and reconstruction method. This method achieves complete extraction and accurate mapping of mesh topological relationships, material properties, and boundary features. While maintaining the geometric accuracy and topological consistency of the original mesh, it efficiently and accurately converts proprietary format data into standardized, universal mesh format files. This effectively breaks down data barriers between different simulation software, constructing a unified data representation system that can be shared across solution platforms. This provides a unified and reliable mesh data foundation for cross-platform simulation verification, multi-tool result comparison, and multi-physics collaborative analysis.

The invention discloses a radio frequency relay optimization design method fusing big language model priori knowledge and Kriging-IAGA. The method comprises the following steps: firstly, screening out key structure parameters and material parameters which influence insertion loss through HFSS simulation and single factor analysis; then constructing a sample library by using a method of combining single factor analysis with an orthogonal experiment, and establishing a high-precision Kriging agent model; further introducing an improved IAGA to carry out multi-parameter collaborative global optimization, and adopting an HFSS to regularly check and correct the proxy model; lLM is further introduced to serve as a process constraint device, an electromagnetic performance-process implementation dual evaluation system is constructed, semantic scoring is conducted on manufacturability of an optimal solution through the LLM, and a fitness function is corrected. According to the method, the problems of long simulation period, difficulty in processing nonlinear coupling in an orthogonal test and the like in the traditional relay optimization design are solved, the insertion loss of a high frequency band is effectively reduced, and the consistency and radio frequency performance of a product are improved.

The invention relates to a simulation method for importing an HFSS model in a 3D layout, and the method comprises the steps: independently opening a connector 3D model in HFSS software, and presetting two ports for the connector 3D model to form a connector HFSS engineering model; the HFSS engineering model of the connector is imported into 3D Layout simulation software; performing port alignment on the connector HFSS engineering model and the PCB layout to form a combined structure with a continuous signal transmission path; deleting redundant ports in the combined structure, and respectively arranging a signal input simulation port and a signal output simulation port at the signal input end of the connector HFSS engineering model and the wiring tail end of the PCB layout; and executing simulation. According to the method, coaxial connector and board-level joint simulation which is the same as that of HFSS software can be completed, the simulation precision reaches the precision level of the HFSS software, meanwhile, the simulation speed is superior to that of the HFSS software, and the simulation precision and the simulation efficiency are both considered.

The application discloses a multi-mode electromagnetic vortex wave array optimization method based on full-wave simulation, which comprises the following steps: step 1, determining initial array configuration parameters according to a fitting statistical formula of a vortex wave beam opening angle and a circular array radius, wherein the initial array configuration parameters comprise the radius and the number of array elements of each circle in the circular ring array; step 2, establishing a target function to be optimized based on HFSS full-wave simulation data; step 3, optimizing the target function based on the HFSS full-wave simulation data by using an IWO-PSO optimization algorithm; and step 4, setting a convergence condition of the IWO-PSO optimization algorithm, repeating steps 1 to 3 until the convergence condition is met, at this time, the optimal array configuration is considered to be obtained, and the optimal electromagnetic vortex wave beam is output. The application establishes a target function based on HFSS / CST full-wave simulation data, and realizes multi-mode low-sidelobe same-direction vortex wave beams through optimization algorithm and HFSS / CST multiple iterations, thus breaking through the generation difficulty of the multi-mode low-sidelobe same-direction vortex wave beams of electromagnetic vortex waves, and having high practical value.

The invention belongs to the field of electronic packaging reliability, and provides a TSV interconnection structure thermal vibration stress and return loss multi-objective optimization method. The method comprises the following steps: firstly, establishing a 3D-TSV laminated chip packaging interconnection structure simulation analysis model based on ANSYS and HFSS; carrying out thermal structure coupling analysis, random vibration loading analysis and return loss analysis; determining a parameter level of the TSV interconnection structure; 17 TSV interconnection structure parameter response surface test groups are designed, and a corresponding simulation model is established and analyzed; fitting a non-linear relation mapping relational expression between the TSV interconnection structure parameters and thermal structure coupling stress, random vibration stress and return loss according to response surface test data; and carrying out multi-objective optimization on the TSV interconnection structure by using an NSWOA optimization algorithm, calculating the weight of thermal structure coupling stress, random vibration stress and return loss by using an entropy weight theory, and sorting an optimal solution set by using a rank sum ratio synthesis method to obtain an optimal parameter level combination. And certain guidance is provided for the reliability design of the TSV interconnection structure.