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Method of Optimizing PCB Microstrip Line Structure Based on Response Surface Method and Genetic Algorithm

A technology of response surface method and genetic algorithm, applied in the field of signal integrity of microelectronic packaging, can solve problems such as noise and interference of transmission signals, and achieve the effects of simple calculation, excellent robust performance, and convenient parameter optimization design.

Active Publication Date: 2021-02-23
GUILIN UNIV OF ELECTRONIC TECH
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Problems solved by technology

Parasitic effects can cause noise and interference on the transmitted signal, making signal integrity problems of high-speed interconnect structures more and more prominent

Method used

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  • Method of Optimizing PCB Microstrip Line Structure Based on Response Surface Method and Genetic Algorithm
  • Method of Optimizing PCB Microstrip Line Structure Based on Response Surface Method and Genetic Algorithm
  • Method of Optimizing PCB Microstrip Line Structure Based on Response Surface Method and Genetic Algorithm

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Embodiment

[0040] The method for optimizing the PCB microstrip line structure based on the response surface method and the genetic algorithm specifically includes the following steps:

[0041] (1) Establish the microstrip line simulation analysis model of HFSS, and the model substrate size is shown in Table 1;

[0042] (2) Obtain the return loss S11 and insertion loss S21 at a frequency of 1GHz-5GHz, such as figure 1 , 2 shown;

[0043] (3) Obtain the influencing factors affecting the microstrip line as follows: substrate thickness H1, microstrip line width t, microstrip line thickness H2, and substrate dielectric constant E; select three levels for each factor respectively, and the factor levels are as follows As shown in Table 2;

[0044] (4) Using BOX-Behnken's central combination design model, there are 29 groups of simulation model level combinations, of which 24 groups are analysis factors, and 5 groups are zero-point factors, that is, the parameter level combinations are the sa...

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Abstract

The method for optimizing the PCB microstrip line by adopting response surface method-genetic algorithm of the present invention comprises: establishing the electromagnetic simulation model of the PCB microstrip line based on HFSS software, obtaining the return loss and the insertion loss of the microstrip line based on the model, and With substrate thickness, microstrip line width, microstrip line thickness, and dielectric constant as design parameters, and return loss as target value, 29 sets of test calculations and simulations are designed, and the response surface method is used to analyze the return loss under the condition of 5GHZ. The relationship between its influencing factors is fitted, and the advantage of searching the global optimal solution of genetic algorithm is used to optimize the fitting function, and the combination parameters with the minimum return loss are obtained. The accuracy of the optimization results is verified by HFSS simulation simulation, and this method also has a guiding effect on the optimization design of other interconnect structures.

Description

technical field [0001] The invention relates to the technical field of microelectronic packaging signal integrity, in particular to a method for optimizing a PCB microstrip line structure based on a response surface method and a genetic algorithm. Background technique [0002] With the rapid development of large-scale integrated circuits in the direction of high speed, high frequency and high density, the clock frequency can reach hundreds of MHz or even several GHz, the data rate can reach more than Gbps, and even tens of thousands of electronic components are integrated on the circuit board. . The transmission of signals between devices and between chips is inseparable from the interconnection structure, but as the density of components increases, the density of the interconnection structure becomes more compact, especially the microstrip line. The spacing has reached the um level. As the frequency increases, the density of the interconnection structure increases, and th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/392G06N3/12
CPCG06N3/126G06F30/30G06F2111/06
Inventor 黄春跃黄根信
Owner GUILIN UNIV OF ELECTRONIC TECH
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