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25G DFB laser high-frequency interconnection method

A laser and high-frequency technology, which is applied in the field of optical fiber communication, can solve the problems of high-frequency interconnection return loss, eye diagram degradation, etc., and achieve the effect of reducing high-frequency return loss and optimizing design parameters

Active Publication Date: 2021-11-09
南京光通光电技术有限公司
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Problems solved by technology

[0004] Purpose of the invention: This invention aims to provide a method for high-frequency interconnection of 25G DFB lasers to solve the problem of eye diagram degradation caused by high-frequency interconnection of 25G DFB lasers with high return loss

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Embodiment Construction

[0026] The technical solution of the present invention will be further described below with the case of TO 56 in conjunction with the accompanying drawings, and this technical solution is also applicable to TO 38.

[0027] Considering the characteristics of the material used in the 25G DFB TO tube base and the cost of the mold opening of the TO tube base, the 25G DFB TO tube base used in the present invention still uses the more typical 25G TO DFB TO tube base used in the industry today .

[0028] The 25G DFB laser high-frequency interconnection method of the present invention comprises the following steps

[0029] 1. Execute one or more designs in steps (1)-(5).

[0030] (1) Design the shape and size of the microstrip line on the ceramic substrate. The ceramic substrate microstrip line includes a left microstrip line and a right microstrip line. The left microstrip line and the right microstrip line are asymmetrical in design, and the gap between the left microstrip line an...

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Abstract

The invention discloses a 25G DFB laser high-frequency interconnection method. The method comprises the following steps: (1) designing one or more of the shape and size of a ceramic substrate microstrip line, a mounting position of a DFB laser diode chip, a geometric shape and asize of a bonding gold wire, a driving source and an impedance value of a load terminal; and (2) establishing a high-frequency 3D structure HFSS simulation model of the DFB laser diode chip, verifying one or more designs in the step (1) through the simulation model, and then optimizing design parameters. Through verification of a simulation model, the optimized DFB laser high-frequency interconnection design has the advantages that the high-frequency return loss of the 25G DFB laser is reduced, the yield of devices and modules is improved, and the cost is reduced, and the high-frequency return loss of the optimized TO5625G TO tube DFB laser high-frequency interconnection design is restrained to be about-15dB.

Description

technical field [0001] The invention relates to the technical field of optical fiber communication, in particular to a method for high-frequency interconnection of 25G DFB lasers. Background technique [0002] With the advent of the global 5G era, 25G 12-wave WDM technology has become a popular choice for 5G base stations, and this has brought about an explosion in the market demand for 25G high-speed optical modules. As the core part of the high-speed optical module, the 25G DFB laser is a device that has attracted much attention in the industry. Considering the low cost factor, in the application of optical modules, 25G DFB lasers are mostly packaged in the form of TO tubes. The high-frequency connection inside and outside the TO tube has basically adopted the structure of bead glass, that is, the high-frequency lead is insulated with a special glass material and airtightly sintered on the TO tube seat. Its high-frequency structure is similar to the high-frequency coaxial...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/20H01S5/12
CPCG06F30/20H01S5/12
Inventor 张耐
Owner 南京光通光电技术有限公司
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