The invention provides a
chip appearance defect identification method based on an improved
random forest algorithm, and aims to meet the requirements of high precision and high efficiency on
chip quality control in the
semiconductor manufacturing industry. According to the method,
feature selection and parameter configuration of the
random forest algorithm are optimized, so that efficient and accurate detection of
chip appearance defects is realized. The method comprises the following specific steps: firstly, preprocessing a chip image, including size
standardization, graying and
noise removal, so as to improve the
image quality and ensure the effectiveness of subsequent analysis; thirdly, simplifying decision-making trees in the
random forest by utilizing a
mutual information technology, and removing redundant decision-making trees with relatively low classification performance, so as to improve the efficiency and accuracy of the model; then, optimizing the weight of the simplified
decision tree by adopting a
genetic algorithm, reducing the over-fitting risk, and enhancing the generalization ability of the model; furthermore, key parameters (including the number of trees, the
maximum depth and the like) of the random forest are further optimized by using a grid search method, so that the overall performance of the model is improved; and finally, evaluating model performance under different parameter configurations by using
cross validation so as to select an optimal configuration. The chip appearance defect detection accuracy and efficiency can be remarkably improved, and the method is suitable for an automatic detection
system in the
semiconductor manufacturing industry, and is particularly suitable for application scenes which have extremely high accuracy requirements and need quick response.