This invention discloses a TDR-based
system and method for measuring the thickness of multilayer
dielectric materials, relating to the field of
microwave testing technology, enabling thickness measurement of multilayer
dielectric materials in a non-destructive environment. The
system includes: a vector network analyzer, an antenna module, and a
metal calibration plate. The vector network analyzer emits
microwave pulses at a set frequency to the multilayer
dielectric material under test. The antenna module focuses the
reflected waves generated by the
microwave pulses as they pass through the multilayer dielectric material. The
metal calibration plate is placed on the starting layer of the multilayer dielectric material to generate the first corresponding time-domain
signal reflection peak when the microwave pulse is incident, thus locating the starting position of the multilayer dielectric material. The vector network analyzer also acquires the frequency-domain
signal focused by the antenna module, performs a
Fast Fourier Transform on the frequency-domain
signal to obtain a time-domain signal, calculates the time-domain signal based on the starting position, and outputs the thickness parameters of each layer in the multilayer dielectric
material under test.