Method for improving transmission characteristics of fixed-length bonding wires

A technology with fixed length and transmission characteristics, applied in the direction of impedance network, electrical components, CAD circuit design, etc., can solve the problems of difficult implementation and increased cost

Inactive Publication Date: 2020-09-04
XIDIAN UNIV
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing literature, there is a bonding wire circuit designed with a five-stage low-pass filter as the interconnection prototype. This technology can

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for improving transmission characteristics of fixed-length bonding wires
  • Method for improving transmission characteristics of fixed-length bonding wires
  • Method for improving transmission characteristics of fixed-length bonding wires

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0017] Such as figure 1 As shown, the method for improving the transmission characteristics of the fixed-length bonding wire includes establishing a physical model, determining the equivalent circuit, integrating the equivalent circuit into the fifth-order Chebyshev low-pass filter, and completing the compensation optimization by adding a microstrip line.

[0018] will be like figure 2 After the distribution parameters are extracted from the model shown, the bonding wire equivalent circuit model is integrated into the fifth-order Chebyshev low-pass filter by using the microstrip line low-pass filter design module in ADS, and the preliminary results are obtained after optimization. The parameters of the microstrip line that need to be added are t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for improving transmission characteristics of a fixed-length bonding wire. The method comprises the following steps: establishing a bonding wire simulation model, extracting model distribution parameters, fusing the extracted distribution parameters into a five-order Chebyshev low-pass filter prototype; and completing the design of the microstrip line filter by using the ADS according to the prototype parameters of the filter, performing optimization design through an ADS optimization control until the design requirement is met, and importing the design resultinto the HFSS to perform simulation design by using a bonding wire model to obtain a final simulation result. When the length of the bonding wire is fixed, the transmission characteristic of the bonding wire interconnection circuit can be remarkably improved, and the bonding wire interconnection circuit has the advantages of being simple in design thought, easy to implement, wide in frequency bandwidth and capable of being applied to any bonding wire.

Description

technical field [0001] The invention relates to the technical field of electronic engineering, and further relates to the interconnection between chips and transmission lines in a microwave multi-chip module. Background technique [0002] With the continuous pursuit of the miniaturization of microwave circuits, multi-chip assembly technology is an effective way to realize the miniaturization of microwave circuits. In microwave multi-chip modules (MCM), bonding wire is still widely used in actual production due to its simple process and low price, and has become a key technology to realize the electrical interconnection of microwave multi-chip modules. As the frequency of the signal increases, the bonding wire presents a high impedance state due to its parasitic parameters and skin effect, causing signal integrity problems in signal transmission. Therefore, in microwave circuit design, it is very important to analyze, optimize and design the parasitic characteristics of bond...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G06F30/36H03H7/01H03H7/03
CPCH03H7/01H03H7/03
Inventor 谭晓乐刘洪范泽原
Owner XIDIAN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap