The application discloses a flexible self-supporting
diamond heat dissipation film and a preparation method thereof, and relates to the technical field of heat dissipation materials. In view of the problems of
high heat flow density of power devices, 5G
radio frequency and advanced packaging chips, strong
anisotropy of traditional
graphite films, poor insulation of
metal foils, and easy aging and pumping out of
silicone grease / gaskets to cause the increase of interface
thermal resistance, the application provides the flexible self-supporting
diamond heat dissipation film and the preparation method thereof. On the structure, 10-50 mu m nanocrystalline CVD
diamond film is used as the main body, and 1-3 mu m
polyimide surface modification layers are arranged on both sides to improve wet adhesion and
environmental resistance. On the process, after the
silicon substrate is cleaned and activated, a composite is formed through CVD deposition, self-supporting film is obtained by using the
internal stress of the difference in
thermal expansion of diamond /
silicon, and the PI layer is coated and solidified on both sides. As a result, the flexible self-supporting diamond heat dissipation film has high
thermal conductivity, thin and light weight, and can be repeatedly bent and mounted, reduces the interface
thermal resistance, and improves the long-term heat dissipation reliability.