Wear-resistant diamond polishing grinder and production method thereof

A diamond and polishing grinding technology, which is applied in the direction of grinding/polishing equipment, abrasives, grinding devices, etc., can solve the problems of diamond polishing abrasives such as long time, large environmental pollution, and short service life, and achieves obvious toughening effect , low comprehensive cost and long service life

Inactive Publication Date: 2012-06-20
广东奔朗新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, most of the common diamond polishing abrasives are magnesite silicon carbide abrasives. The service life of this kind of diamond polishing abrasives is short, which leads to more time for replacing diamond polishing abrasives during work. Moreover, the diamond po...

Method used

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  • Wear-resistant diamond polishing grinder and production method thereof
  • Wear-resistant diamond polishing grinder and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0024] see figure 1 , the wear-resistant diamond polishing abrasive tool includes an abrasive layer 3 arranged on the deck 1, the abrasive layer is prepared from the following raw material components in volume percentage: 6.25% to 15% of diamond, 0% to 15% of silicon carbide, 200 35-60% of heat-resistant phenolic resin with fine mesh, 10-50% of carboxylated nitrile rubber with fine mesh of 40 mesh, 0.5-1% of zinc stearate, 0.5-5% of zinc oxide, 0-5% of sulfur, promoting Agent TMTD0~5%, stearic acid 0~5%.

[0025] The bonding agent in the abrasive layer is formed by adding carboxylated nitrile rubber to heat-resistant phenolic resin, and the volume ratio of heat-resistant phenolic resin to carboxylated nitrile rubber is 100:10-100.

[0026] The particle diameter of the diamond is 200 mesh to 8000 mesh, and the particle diameter of the silicon carbide is 200 mesh to 3000 mesh.

[0027] The deck 1 is made of plastic.

[0028] In this embodiment, the abrasive layer is prepared ...

no. 2 example

[0035] In this embodiment, the abrasive layer is prepared from the following raw material components in volume percentage: 400 mesh diamond 8%, 600 mesh silicon carbide 7%, phenolic resin powder 50%, carboxylated nitrile rubber 30%, zinc stearate 1%, zinc oxide 2%, sulfur 0.5%, accelerator TMTD 1%, stearic acid 0.5%.

[0036] See the first embodiment for the rest of the undescribed parts, and will not repeat them here.

no. 3 example

[0038] In this embodiment, the abrasive layer is prepared from the following raw material components in volume percentage: 800 mesh diamond 6.25%, 800 mesh silicon carbide 3.75%, phenolic resin powder 50%, carboxylated nitrile rubber 35%, zinc stearate 1%, zinc oxide 2%, sulfur 0.5%, accelerator TMTD 1%, stearic acid 0.5%.

[0039] See the first embodiment for the rest of the undescribed parts, and will not repeat them here.

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Abstract

The invention relates to a wear-resistant diamond polishing grinder and a production method thereof. The diamond polishing grinder comprises an abrasive layer arranged on a clamping seat, and the abrasive layer is prepared with raw materials by the following volume percentage: 6.25-15 percent of diamond, 0-15 percent of silicon carbide, 35-60 percent of 200-mesh fine heat-resistant phenolic resin, 10-50 percent of 40-mesh fine carboxylated nitrile rubber, 0.5-1 percent of zinc stearate, 0.5-5 percent of zinc oxide, 0-5 percent of sulfur, 0-5 percent of promoting agent TMTD (tetramethyl thiuram disulfide) and 0-5 percent of stearic acid. A binder in the abrasive layer is prepared by adding carboxylated nitrile rubber into the heat-resistant phenolic resin, and the volume ratio of the heat-resistant phenolic resin and the carboxylated nitrile rubber is 100: (10-100). The particle size of the diamond is of 200-8000 meshes, and the particle size of the silicon carbide is of 200-3000 meshes. The invention has the advantages of good grinding effects, long service life, high polishing speed and low overall cost.

Description

technical field [0001] The invention relates to a diamond polishing abrasive, in particular to a wear-resistant diamond polishing abrasive and a manufacturing method thereof. Background technique [0002] At present, the polished tiles produced by architectural ceramic factories and the stone polished plates produced by stone factories need to be polished after rough grinding with metal-bonded diamond abrasive tools to obtain a high glossiness ranging from 50 to 90°. [0003] At present, most of the common diamond polishing abrasives are magnesite silicon carbide abrasives. The service life of this kind of diamond polishing abrasives is short, which leads to more time for replacing diamond polishing abrasives during work. Moreover, the diamond polishing abrasives The tool produces a large amount of waste residue and waste water in the working process, which pollutes the environment relatively large, is not conducive to environmental protection, and at the same time, the econ...

Claims

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Application Information

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IPC IPC(8): B24D3/28B24D18/00
Inventor 陶洪亮周华
Owner 广东奔朗新材料股份有限公司
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