Halogen-free flame retardant heat conduction polyurethane pouring sealant and preparation method thereof
A technology of polyurethane and potting glue is applied in the preparation of halogen-free flame retardant and thermally conductive polyurethane potting glue. The problems such as the decline of the mechanical properties of the glue, to achieve the effect of excellent thermal conductivity, small environmental impact, and high mechanical properties
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Example Embodiment
[0028] Example 1
[0029] Preparation of component A: add 42g castor oil, 8g nano-magnesium hydroxide, 9g toluene diphenyl phosphate, 40g aluminum oxide, 0.2g dibutyltin dilaurate, and 0.8g defoamer into the reactor and heat to 110~ Dehydrate at 120°C for 2 hours under vacuum, reduce to normal temperature under nitrogen protection, and seal the package.
[0030] Preparation of component B: weigh 25g of liquefied 2,4-toluene diisocyanate as component B, and seal the package.
[0031] After mixing component A and component B in a weight ratio of 100:25, the finished product is obtained.
[0032] When in use, cast the finished polyurethane potting glue on the electronic components that need to be potted, vacuum for 3~5min, and then cure for 24h~48h at room temperature.
Example Embodiment
[0033] Example 2
[0034] Preparation of component A: add castor oil 36g, aluminum hydroxide 10g, isopropyl diphenyl phosphate 13g, aluminum oxide 40g, stannous octoate 0.2g, and antifoaming agent 0.8g into the reactor together, and heat to 110~120 ℃, take off under vacuum for 3 hours, reduce to normal temperature under nitrogen protection, and seal package.
[0035] Preparation of component B: Weigh 20g of liquefied 2,6-toluene diisocyanate as component B, and seal the package.
[0036] After mixing the A component and the B component in a weight ratio of 100:20, the finished product is obtained.
[0037] When in use, cast the finished polyurethane potting glue on the electronic components that need to be potted, vacuum for 3~5min, and then cure for 24h~48h at room temperature.
Example Embodiment
[0038] Example 3
[0039] Preparation of component A: 33g castor oil, 14g melamine polyphosphate, 9g isopropyl diphenyl phosphate, 30g aluminum oxide, 10g aluminum nitride, 0.1g dibutyltin dilaurate, 0.1g stannous octoate, defoamer 0.8g is added to the reaction kettle, heated to 110~120℃, dehydrated under vacuum for 2.5 hours, the nitrogen protection is reduced to normal temperature, and the package is sealed.
[0040] Preparation of component B: weigh 15g of liquefied polymethylene polyphenyl polyisocyanate as component B, and seal the package.
[0041] After mixing the A component and the B component in a weight ratio of 100:15, the finished product is obtained.
[0042] When in use, cast the finished polyurethane potting glue on the electronic components that need to be potted, vacuum for 3~5min, and then cure for 24h~48h at room temperature.
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