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Halogen-free flame retardant heat conduction polyurethane pouring sealant and preparation method thereof

A technology of polyurethane and potting glue is applied in the preparation of halogen-free flame retardant and thermally conductive polyurethane potting glue. The problems such as the decline of the mechanical properties of the glue, to achieve the effect of excellent thermal conductivity, small environmental impact, and high mechanical properties

Inactive Publication Date: 2014-01-22
FUJIAN RUISEN CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, polyurethane potting adhesives mainly use a large amount of flame retardants and thermally conductive fillers to meet the performance requirements of flame retardancy and heat conduction at the same time, but this often leads to a decrease in the mechanical properties of the potting adhesive, and the viscosity of the potting adhesive is high and the fluidity is poor. , can not penetrate into the tiny pores, which is not conducive to the filling of the potted electronic components. Even so, it is difficult to achieve a polyurethane potting compound with excellent flame retardancy and thermal conductivity, and often the two properties cannot be balanced
Moreover, the current polyurethane potting glue can reach the V-0 level of flame retardancy. Most of them use halogen-containing flame retardants, which will release toxic gases when burned, which do not meet environmental protection requirements, or contain plasticizers, which do not meet environmental protection requirements. , and the potting glue using environmentally friendly flame retardants, the flame retardant level is often difficult to reach the V-0 level

Method used

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  • Halogen-free flame retardant heat conduction polyurethane pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Preparation of component A: Add 42g of castor oil, 8g of nano-magnesium hydroxide, 9g of toluene diphenyl phosphate, 40g of aluminum oxide, 0.2g of dibutyltin dilaurate, and 0.8g of defoamer into the reaction kettle, and heat to 110~ Dehydrate at 120°C for 2 hours under vacuum, drop to normal temperature under nitrogen protection, and seal the package.

[0030] Preparation of component B: Weigh 25g of liquefied 2,4-toluene diisocyanate as component B, and seal the package.

[0031] Mix components A and B uniformly at a weight ratio of 100:25 to obtain the finished product.

[0032] When in use, pour the finished polyurethane potting compound on the electronic components that need to be potted, vacuumize for 3~5min, and then cure at room temperature for 24h~48h.

Embodiment 2

[0034] Preparation of component A: Add 36g of castor oil, 10g of aluminum hydroxide, 13g of isopropyl diphenyl phosphate, 40g of aluminum oxide, 0.2g of stannous octoate, and 0.8g of defoamer into the reaction kettle, and heat to 110~120 ℃, take it off for 3 hours in a vacuum state, lower it to normal temperature under the protection of nitrogen, and seal the package.

[0035] Preparation of component B: Weigh 20 g of liquefied 2,6-toluene diisocyanate as component B, and seal the package.

[0036] Mix components A and B uniformly at a weight ratio of 100:20 to obtain the finished product.

[0037] When in use, pour the finished polyurethane potting compound on the electronic components that need to be potted, vacuumize for 3~5min, and then cure at room temperature for 24h~48h.

Embodiment 3

[0039] Preparation of component A: castor oil 33g, melamine polyphosphate 14g, isopropyl diphenyl phosphate 9g, aluminum oxide 30g, aluminum nitride 10g, dibutyltin dilaurate 0.1g, stannous octoate 0.1g, defoamer Add 0.8g into the reaction kettle, heat to 110~120°C, dehydrate under vacuum for 2.5 hours, lower to normal temperature under nitrogen protection, and seal the package.

[0040] Preparation of component B: Weigh 15 g of liquefied polymethylene polyphenyl polyisocyanate as component B, and seal the package.

[0041] Mix components A and B uniformly at a weight ratio of 100:15 to obtain the finished product.

[0042] When in use, pour the finished polyurethane potting compound on the electronic components that need to be potted, vacuumize for 3~5min, and then cure at room temperature for 24h~48h.

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Abstract

The invention relates to the technical field of a polyurethane pouring sealant, and particularly relates to a halogen-free flame retardant heat conduction polyurethane pouring sealant. The halogen-free flame retardant heat conduction polyurethane pouring sealant is formed by uniformly mixing 100 parts by mass of component A and 15-25 parts by mass of component B, wherein the component A comprises 30-45 parts by mass of polymer polyhydric alcohol, 15-25 parts by mass of halogen-free flame retardant, 40-55 parts by mass of heat conducting filler, 0.1-2 parts by mass of defoaming agent and 0.1-2 parts by mass of catalyst, the component B is isocyanate, and the polymer polyhydric alcohol is one of or a mixture of castor oil and polyether polyol. The halogen-free flame retardant heat conduction polyurethane pouring sealant does not contain halogen and has high conductivity of heat, high flame resistance and strong mechanical property. Meanwhile, the invention also discloses a preparation method of the halogen-free flame retardant heat conduction polyurethane pouring sealant. The preparation method is simple in process and has strong operability.

Description

technical field [0001] The invention relates to the technical field of polyurethane potting glue, in particular to a halogen-free flame-retardant and heat-conducting polyurethane potting glue. At the same time, the invention also discloses a preparation method of the halogen-free flame-retardant and heat-conducting polyurethane potting glue. Background technique [0002] Polyurethane potting adhesives are widely used in electronic component potting and other technical fields. They can prevent moisture, corrosion, shock, and dust. They can not only improve the performance of electronic products, but also stabilize the parameters of electronic components. With the development of modern information technology, electronic components and logic circuits tend to be denser and miniaturized, and the power of electrical appliances is increased, which leads to the continuous increase of heat per unit area of ​​electronic products. Devices and components affect the reliability and servi...

Claims

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Application Information

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IPC IPC(8): C08G18/67C08G18/48C08G18/69C08K13/02C08K3/22C08K5/3492C08K5/5313C08K5/523C08K5/521C08K5/524C08K3/38C08K3/28C08K3/34C08K13/04C08K7/14C08K7/06C09J175/14C09J175/08C09J11/04C09J11/06C09K3/10
CPCC08G18/36C08G18/4825C08G18/4854C08G18/69C08G2190/00C08K3/22C08K3/28C08K5/098C08K5/34928C08K5/523C08K5/524C08K5/5313C08K5/5333C08K13/02C08K2003/2224C08K2003/2227C08K2003/282C08K2201/011C09J11/04C09J11/06C09J175/04C09J175/08
Inventor 陆志军
Owner FUJIAN RUISEN CHEM
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