67results about How to "Dissipate heat" patented technology

A channel letter lighting unit according to the present invention comprises a printed circuit board (PCB) having a plurality of linearly mounted light emitting elements. Input wires transmit a power signal to the PCB to illuminate the plurality of light emitting elements, and output wires transmit the power signal from the PCB. The PCB is mounted in the extrusion and the light emitting elements transmit light away from the extrusion. The extrusion promotes the dissipation of heat from the light emitting elements. A mounting mechanism is included for mounting the extrusion within a housing. A further embodiment according to the invention comprises a plurality of channel lighting units electrically connected to one another so that a power signal applied to the lighting system is transmitted to each of the plurality of lighting units. A still further embodiment according to the invention comprises an illuminated channel letter system having a housing in the shape of a letter. A translucent lens is included over the housing to transmit light from within the housing. A plurality of channel lighting units are mounted within the housing and coupled to one another in a daisy chain. A power signal applied to the first of the plurality of lighting units in the daisy chain is transmitted to the remaining of the plurality of lighting units.

The present invention provides methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may be disposed fully within the package or it may extend out of the package.

A light bulb includes an enclosure, a heat-dissipating unit, and a lamp unit. The enclosure extends along an axis, and defines an inner space therein. The heat-dissipating unit includes a hollow first heat-dissipating element disposed in the inner space, a second heat-dissipating element surrounded by the first heat-dissipating element and extending along the axial direction, and an end heat-dissipating element mounted to the second heat-dissipating element at a distal end thereof. The lamp unit includes a first circuit board disposed at a periphery of the first heat-dissipating element, a second circuit board mounted on the end heat-dissipating element, and a plurality of light-emitting elements mounted on the first and second circuit boards for emitting light beams.

An LED light device includes a housing having a base plate, and two side walls extended forwardly and outwardly from the base plate for forming a chamber between the side walls and the base plate, one or more light elements disposed in the chamber of the housing for generating a light, and the housing includes a number of fins extended rearwardly from the base plate for dissipating a heat generated by the light element and for preventing the LED light device from being damaged by the heat and for increasing the brightness and the working life of the LED light device.

A thermocycler apparatus and method for rapidly performing the PCR process employs at least two thermoelectric modules which are in substantial spatial opposition with an interior space present between opposing modules. One or multiple sample vessels are placed in between the modules such that the vessels are subjected to temperature cycling by the modules. The sample vessels have a minimal internal dimension that is substantially perpendicular to the modules that facilitates rapid temperature cycling. In embodiments of the invention the sample vessels may be deformable between: a) a shape having a wide mouth to facilitate filling and removing of sample fluids from the vessel, and b) a shape which is thinner for conforming to the sample cavity or interior space between the thermoelectric modules of the thermocycler for more rapid heat transfer.

The present disclosure provides a composite material for shielding an electromagnetic wave, and more particularly, a composite material for shielding an electromagnetic wave, which can effectively shield an electromagnetic wave generated in an electronic component. The composite material of the disclosure has a multi-layer structure including: an electromagnetic wave-shielding layer for shielding an electromagnetic wave; and a thermally conductive layer stacked under the electromagnetic wave-shielding layer for dissipating heat generated when the electromagnetic wave is absorbed, wherein the electromagnetic wave-shielding layer includes a material including a magnetic material and a carbon-based conductive material added to a thermoplastic resin.

A package structure for packaging a liquid crystal display (LCD) panel. The package structure includes a heat sink for positioning the LCD panel, a transparent cover against the LCD panel, and a sealing material for sealing the LCD panel within the package structure.

A high power semiconductor component structure having a semiconductor device arranged to operate in response to an electrical signal, with the device heating up during operation in response to the electrical signal. A heat sink is positioned in thermal contact with the semiconductor device such that heat from the device transmits into the first heat sink. The heat sink has at least partially a porous material region of a thermally conductive material in a 3-dimensional pore structure with the surfaces of the pore structure providing surface area for heat to dissipate into the ambient air.

Methods for improving the thermal conductivity of a substrate for a micro-fluid ejection head and micro-fluid ejection heads are provided. One such head includes a substrate having a thermal conductivity ranging from about 1.4 W / m-° C. to about 148 W / m-° C., a fluid ejection actuator, and a thermal bus thermally adjacent to the substrate and configured to dissipate heat associated with the operation of the actuator. Exemplary modified substrates have improved thermal conductivity characteristics as compared to a corresponding substrate not modified to include the thermal bus.

A system to cool the air inside a nacelle and the heat generating components housed in the nacelle of an offshore wind turbine is presented. An upper cooling circuit is disposed in the nacelle. A reservoir is disposed below the upper cooling circuit and has a lid that freely rotates about a vertical axis of the reservoir along with an inlet and an outlet pipe of the upper cooling circuit as the nacelle yaws, the vertical axis of the reservoir being coincident with a yaw axis of the nacelle. A lower cooling circuit is disposed below the reservoir. Coolant is circulated through the upper cooling circuit using a cooling pump disposed between the nacelle and the upper cooling circuit. The upper cooling circuit carries heat from the heat generating components and from the air inside the nacelle to the reservoir. The lower cooling circuit carries heat from the reservoir to the bottom of the tower and dissipates the heat to the sea water through a heat exchanger that is cooled by the sea water.

A heat dissipating helmet provides a heat dissipating heat pipe portion. One or more high powered LEDs may be in thermal contact therewith providing a significant portion of a heat sink to remove heat from the LEDs to maintain them at a proper operating temperature during operation. The heat dissipating material may be also in contact with air flow as the helmet moves through space thereby allowing convection to assist in removing heat from the helmet.

A photoactivation apparatus (200) separately delivers light to a plurality of wells of a multiwell plate (110). The device-includes a plurality of light emitting diodes (210) attached to a first surface of a substrate (220) such that when the photoactivation apparatus is positioned on the multiwell plate each of the light emitting diodes delivers light to one corresponding well. The light emitting diodes (210) may extend at least partially into the wells of the multiwell plate. A heat sink (250) and fan may be provided on the device to dissipate heat generated by the light emitting diodes. The components are preferably enclosed in a conveniently-sized housing (270). The housing may include one or more grips and air vents. The apparatus includes an interlocking lip (230) defining a recess which is sized to receive at least a portion of the multiwell plate. A power supply connected to the apparatus and configured to provide an equal voltage across each of the light emitting diodes.

A semiconductor device includes: a semiconductor element; a substrate; a metal plate; and a plurality of spherical particles. The substrate has the semiconductor element mounted thereon. The metal plate has one surface and the other surface that face each other, and the substrate is provided on the one surface. The plurality of spherical particles each has a spherical outer shape, and a part of the spherical outer shape is buried in the other surface of the metal plate. With such a configuration, there can be obtained a semiconductor device that allows promotion of heat dissipation from the semiconductor element, and a method for manufacturing the semiconductor device.

A printed circuit board (PCB) has a multi-layered substrate including a plurality of signal lines and a ground voltage plate disposed below the signal lines and by which a common ground voltage is applied to the signal lines, a heat sink disposed on the multi-layered substrate, and thermal interface material interposed between the signal lines and the heat sink to transfer heat from the multi-layered substrate to the heat sink. The heat sink thus dissipates the heat generating from the multi-layered substrate and along with the ground voltage plate suppresses electromagnetic interference of signal transmitted through adjacent ones of the signal lines. The thermal interface material also serves in the design phase as a means to tune the impedance of the signal lines.

A tracking device for tracking a vehicle in which a radio transmitter is powered by heat energy of the exhaust system of an engine propelling the vehicle. A thermoelectric module is attached to a hot portion of the exhaust system. Electrical power generated by the thermoelectric module is used to power the transmitter. A preferred tracking device consists of one thermoelectric module, one transmitter, a flexible finned plate for dissipating heat, and two high Curie temperature magnets for attaching the device to the vehicle's tail pipe. The transmitter is mounted on the flexible finned plate with a thermal insulator in-between them.

A motor includes a heat dissipating structure. The motor may be used for a fan and includes on an upper surface of a circuit board a heat dissipating layer. The heat dissipating layer has a high thermal conductivity. The fan also includes a coil provided on the teeth of a stator core. The heat dissipating layer and the coil axially face each other, and thermal conductive members are arranged therebetween. An outer dimension of the circuit board is greater than that of an impeller cup so that a radially outward portion of the circuit board protrudes radially outwardly from the impeller cup. The heat generated by the coil is transferred to the heat dissipating layer via the thermal conductive members. Therefore, the heat is dissipated from a wide area, which efficiently dissipates heat from the fan. In addition, since the circuit board and the heat dissipating layer protrude radially into an air-flow generated by an impeller, the heat transferred to the heat dissipating layer is actively dissipated.

A heat sink (10) includes a plurality of fins (12). Each of the fins includes a main body (122) and at least one bulge (126) disposed on the main body. The main bodies of two adjacent fins cooperatively define an air passage (121) therebetween, for allowing an airflow to pass therethough. The bulge has a varying projection height so as to form a streamline guide surface (127) thereon.

The semiconductor module mounting structure includes a semiconductor module including therein a semiconductor device and electrodes exposed to both surfaces thereof, a wiring substrate having a mounting surface on which the semiconductor module is mounted, and a heat radiating body for dissipating heat from the semiconductor module. The wiring substrate is formed with a ground wiring such that at least a part of the ground wiring is exposed to a back surface thereof opposite to the mounting surface. The exposed surface of the ground wiring exposed to the back surface is in thermal contact with the heat radiating body. At least one of the electrodes exposed to one of the both surfaces opposed to the wiring substrate is in electrical contact with the ground wiring through a through hole formed in the wiring substrate.

A lamp includes an optically transmissive enclosure and a base connected to the enclosure. A LED board is positioned in the enclosure and has a first side and a second side. A first LED array is mounted on the first side and a second LED array is mounted on the second side where the LED arrays are operable to emit light when energized through an electrical path from the base. A first diffusive lens and a second diffusive lens are located inside of and spaced from the enclosure. The first diffusive lens receives light emitted from the first LED array and the second diffusive lens receives light emitted from the second LED array.

The transceiver-integrated antenna includes an antenna element, a ground plate for grounding the antenna element, and a transceiver configured to transmit and receive radio signals through the antenna element. The transceiver is housed in a recess formed in the ground plate. The ground plate serves as not only a plane for grounding the antenna element, but also a radiator for dissipating the heat emitted from the transceiver.

A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded dissipation element having a thermal conductivity of at least about 150 W / m-K; and a thermal connection material positioned between and in thermal contact with each of the base element and the dissipation element, wherein the thermal connection material having an in-plane thermal conductivity greater than the thermal conductivity of the dissipation element.

A temperature regulation system, which can be used to cool the interior temperature of an automobile / motor vehicle, when it is parked under the sun, substantially below the external temperature, was designed and produced. The system was powered by solar cells, thus functioning without dissipating any energy from the vehicle's battery. The mechanical device of the system incorporated Peltier elements, heat sinks and fans, all controlled by a power supply in the form of a circuit board. When the automobile was switched on, the system could be further used as an automobile climate control unit, for heating or cooling, withdrawing the supplementary electricity from the battery, another feature controlled by the circuit board.

A leadless lower temperature co-crystal phase transition metal heat conductive device comprises two metal substrates made from tin, indium, bismuth and a little other elements; a metal heat conductive sheet installed between the two metal substrates, where the metal substrates having the effect of increasing heat dissipating ability of the metal heat conductive sheet; a heat dissipation device installed above a structure formed by the metal substrates and the metal heat conductive sheet so as to dissipate heat from the metal heat conductive sheet and the two metal substrates; and a fan installed above the heat dissipation device for dissipating heat from the heat dissipation device. When leadless lower temperature co-crystal phase transition metal heat conductive device is placed on a circuit board, the temperature range for co-crystal phase transition is between 50° C. to 70° C.

The present invention provides a heat dissipation plate which includes a heat dissipator and two elastic plates. The heat dissipation plate is adapted to be disposed in a bicycle disc brake. The elastic plates are fixed to the heat dissipator, and the elastic plates are disposed in the bicycle disc brake so as to fix the back panels of the brake linings in the disc brake. Thereby, the elastic plates of the present invention can conduct the heat, which is generated when braking, to the heat dissipator, so that it can prevent the brake linings from overheating when braking. The overheated brake linings may make the disc brake fail to stop the bicycle; therefore, the present invention can enhance the safety of the bicycle disc brake.

A lighting apparatus including a reflector having a reflective surface partially enclosing an interior space and defining a focal point within the interior space, and a filament positioned substantially within the interior space. In some examples, the filament is made substantially of tungsten. In some examples, the reflective surface extends along a longitudinal axis and curves around the longitudinal axis. In some examples, the reflective surface defines an elliptical paraboloid. In some examples, the filament may be placed substantially at the focal point of the reflective surface.

A server system and a heat dissipation control method thereof are provided. A main power supply and a standby power supply respectively supplying a main voltage and a standby voltage of the server system are provided. An extension card module including at least one extension card slot allowing at least one extension card to insert into, is provided. A fan module including at least one fan used for dissipating heat from the extension card module is provided. When the main voltage is applied to the server system, the main voltage is applied to the fan to drive the fan. When the standby voltage is applied to the server system, the extension card module is determined whether to be inserted in any extension card. If yes, the standby voltage is applied to the fan to drive the fan; otherwise, the standby voltage is interrupted to stop the fan.

A casing for electric circuits is proposed, which shields the circuits from EMI phenomena. The circuit has means for making thermal contact with heat generating components inside the casing, allowing using the casing as a heat sink to dissipate the heat. The casing comprises a frame, a cover and an inwardly projecting element for thermally contacting a heat source within the casing. The inwardly projecting element is designed so as not to cause any openings in the casing. The inwardly projecting element may be an integral part of the frame or the cover and all parts of the casing may advantageously be produced using cut-and-bend procedures.

A spray misting system for use with headwear having a front and rear, including an integrated reservoir and pump which contains a quantity of water, and a forward misting nozzle. The forward misting head is provided at the front of the headwear forwardly of the user to direct a fine, cooling, spray mist toward the user. A conduit connects the water reservoir with the forward misting nozzle, and a flow control valve allows the user to control the flow of water through the conduit. When desired the user operates a handle on the integrated reservoir and pump to initiate flow through the conduit to create a misting spray at the forward misting head which is directed toward the face and forehead of the user to effect cooling of the user.

This disclosure discloses a heat dissipating system using fans for an electronic device. The electronic device includes a first air outlet and a second air outlet. The heat dissipating system using fans includes a processor, a first fan, a second fan, an orientation sensor, and a temperature sensor. The orientation sensor is for sensing whether the electronic device is under a horizontal state or a vertical state and generating a corresponding orientation signal. The temperature sensor is for sensing the temperature of the electronic device and generating a temperature signal. When the temperature signal is greater than or equal to a predetermined value, the processor activates the first fan and the second fan. When the temperature signal is less than the predetermined value, the processor selectively activates one of the first fan and the second fan according to handedness information and the orientation signal.