Low-density thermal conductive silicone pad and preparation method thereof

A heat-conducting silica gel and low-density technology, which is applied in the field of low-density heat-conducting silica gel sheet and its preparation, can solve the problems of restricting wide application, and achieve the effects of reducing battery weight, wide application prospects, excellent flame retardancy and mechanical properties

Inactive Publication Date: 2017-08-18
深圳市德镒盟电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the use of a large amount of functional fillers such as heat conduction and mechanical strength, although the flame retardancy and shock absorption funct

Method used

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  • Low-density thermal conductive silicone pad and preparation method thereof
  • Low-density thermal conductive silicone pad and preparation method thereof
  • Low-density thermal conductive silicone pad and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A low-density thermally conductive silica gel sheet, comprising the following components by weight:

[0033]

[0034] The preparation process of the above-mentioned low-density thermal silica gel sheet is as follows:

[0035] (1) Mixing and plasticizing, under the condition of 110 degrees Celsius, vinyl silicone oil, thermally conductive filler, flame retardant filler, reinforcing filler, and low-density filler were added to a vacuum kneader, and blended for 2 hours to obtain a masterbatch; After cooling to room temperature, add catalyst, inhibitor, vacuumize 1H and mix well;

[0036] (2) calendering, put the semi-finished product made in step (1) into a calender, adjust the cylinder and the scraper, and roll it into a set thickness through the calender;

[0037] (3) Prepare a low-density heat-conducting silica gel sheet, transport the gasket rolled in step (2) to an oven along with the tunnel, and vulcanize it into a sheet at high temperature; according to the vulc...

Embodiment 2

[0039] A low-density thermally conductive silica gel sheet, comprising the following components by weight:

[0040]

[0041] The preparation process of the above-mentioned low-density thermal silica gel sheet is as follows:

[0042] (1) To prepare the base material, add 100 parts of vinyl silicone oil to the vacuum kneader at room temperature at 25°C, start the kneader; then add 180 parts of boron nitride, 20 parts of aluminum hydroxide, and 8 parts of gas phase white carbon Black and 38 parts of hollow glass microspheres were evenly added to vinyl silicone oil, and blended and kneaded for 6 hours under the condition of vacuum degree of 0.06MPa to obtain the base material;

[0043] (2) To prepare component A and component B, divide the base material into two parts according to this example of 1:1; control the temperature at 25±3°C, add 0.01 part of chloroplatinic acid-isopropanol to one of the base materials , stirred for 100 minutes to prepare component A; control the tem...

Embodiment 3

[0046] A low-density thermally conductive silica gel sheet, comprising the following components by weight:

[0047]

[0048]

[0049] The preparation process of the above-mentioned low-density thermal silica gel sheet is as follows:

[0050] (1) To prepare the base material, add 100 parts of vinyl silicone oil to the vacuum kneader at room temperature at 25°C, start the kneader; then add 200 parts of boron nitride, 30 parts of zinc borate, and 10 parts of fumed silica and 45 parts of hollow phenolic spheres were uniformly added to vinyl silicone oil, and blended and kneaded for 6 hours under the condition of vacuum degree 0.08MPa to obtain the base material;

[0051](2) To prepare component A and component B, divide the base material into two parts according to the ratio of 1:1; control the temperature at 25±3°C, add 0.3 parts of Castel catalyst to one of the base materials, stir for 80min, Prepare component A; control the temperature at 25±3°C, add 14 parts of hydrogen...

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PUM

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Abstract

The invention discloses a low-density thermal conductive silicone pad and a preparation method thereof. The low-density thermal conductive silicone pad is prepared from the following components: 100 parts of vinyl silicone oil, 0-25 parts of silicon resin, 0-30 parts of crude rubber, 1-25 parts of a cross-linking agent, 0.01-0.5 part of a catalyst, 50-1,200 parts of a thermal conductive filler, 10-200 parts of a flame-retardant filler, 0-100 parts of a low-density filler and 0.001-0.1 part of an inhibitor. As a proper amount of the low-density filler is contained, together with the proper amounts of the thermal conductive filler, a reinforcing filler, the flame-retardant filler and other fillers, the thermal conductive silicone pad with good thermal conductivity, excellent flame-retardant and mechanical property and low density is prepared; compared with a common thermal conductive silicone pad at present, the low-density thermal conductive silicone pad has the advantages that the density is reduced by about 60%, the battery weight of an electric vehicle can be remarkably reduced, and application of the low-density thermal conductive silicone pad in the field of electric vehicles is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting silica gel, and in particular relates to a low-density heat-conducting silica gel sheet and a preparation method thereof. Background technique [0002] Thermally conductive silicone gasket has certain flexibility, self-adhesiveness, and good compressibility, which can effectively reduce contact resistance, guide heat transfer between heating parts and heat dissipation parts, and have excellent high and low temperature resistance, weather resistance, insulation or impact resistance. High voltage and other characteristics, so it is widely used in the field of heat conduction of electronic appliances. With the development of the electronics industry, high-tech technologies such as electronic components, large integrated circuit boards, and LEDs tend to be more intensive and miniaturized, and the requirements for light weight, high thermal conductivity, and high elasticity are becoming more an...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K13/04C08K13/02C08K3/28C08K3/22C08K3/36C08K7/28
CPCC08K2003/2227C08K2003/282C08K2003/385C08K2003/387C08K2201/003C08L83/04C08L2201/02C08L2203/20C08L2205/03C08L2205/20C08K13/04C08K3/28C08K3/22C08K7/28C08K5/05C08K3/38C08K3/36C08K13/02
Inventor 王春华唐新开
Owner 深圳市德镒盟电子有限公司
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