Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive

Abstract

The invention discloses a conductive adhesive for LED (light emitting diode) packaging. The conductive adhesive consists of the following raw materials in percentage by weight: 75 to 95 percent of conductive powder, 2 to 12 percent of epoxy resin, 1 to 10 percent of epoxy diluting agent, 1 to 3 percent of curing agent, 0 to 1 percent of curing accelerator, and 0.5 to 2 percent of coupling agent. The LED conductive adhesive provided by the invention has superior performance and good heat conduction and electric conduction effects and can fully meet operating requirements of a high-brightness high-power LED chip.

Description

technical field

[0001] The invention relates to a conductive adhesive and a preparation method thereof, in particular to a conductive adhesive for packaging high-brightness and high-power LEDs (light-emitting diodes) and a preparation method thereof. Background technique

[0002] In recent years, the application of LED (light-emitting diode) has developed rapidly in the field of lighting. Compared with traditional light sources, LED lighting has obvious advantages in energy saving and environmental protection. It is the future trend of indoor lighting, landscape lighting, vehicle lighting and other fields. . LED chip packaging technology is one of the core technologies of LED device manufacturing. Traditional packaging technology can well meet the requirements of traditional low-power and low-brightness LED devices. However, for the packaging of emerging high-brightness and high-power LED chips, as the power of LED chips increases, and when LED chips perform electro-optical...

Examples

Embodiment 1

[0023] At room temperature, weigh the raw materials according to the weight ratio of each component in Example 1 in Table 1, bisphenol A epoxy resin and 1,4-butanediol glycidyl ether were mixed for 10 minutes until uniform, and then Add dicyandiamide, 2-heptadecyl imidazole and 3-aminopropyltriethoxysilane, mix at room temperature for 10 minutes to form a homogeneous mixture, and then grind it through a three-roll machine until it becomes a fine and uniform mixture, then add the particle size range The conductive adhesive can be prepared by mixing 0.5 micron to 100 micron micron flake silver powder at a low speed for 30 minutes at room temperature.

Embodiment 2

[0025] At room temperature, weigh the raw materials according to the weight ratio of each component in Example 2 in Table 1, mix bisphenol F epoxy resin and neopentyl glycol glycidyl ether for 10 minutes until uniform, and then add diamino Diphenylmethane and 3-aminopropyltriethoxysilane were mixed at room temperature for 10 minutes to form a homogeneous mixture, and then ground by a three-roll machine until it became a fine and uniform mixture, and then added micron-sized particles with a particle size range of 0.5 microns to 100 microns The flake silver powder and the nano-scale silver wire with a wire diameter ranging from 50 nanometers to 1 micron and a length ranging from 1 micron to 100 microns can be mixed in a low-speed vacuum at room temperature for 30 minutes to prepare a conductive adhesive.

Embodiment 3

[0027] At room temperature, weigh the raw materials according to the weight ratio of each component in Example 3 in Table 1, mix bisphenol A epoxy resin and polyethylene glycol diglycidyl ether for 10 minutes until uniform, and then add diamino Mix diphenyl ether and 3-aminopropyltrihydroxysilane for 10 minutes at room temperature to form a homogeneous mixture, and then grind it on a three-roll machine until it becomes a fine and uniform mixture, then add micron-sized flakes with a particle size range of 0.5 microns to 100 microns The conductive adhesive can be prepared by mixing silver powder and nano-scale silver wires with wire diameters ranging from 50 nanometers to 1 micron and lengths ranging from 1 micron to 100 microns in a low-speed vacuum at room temperature for 30 minutes.

technical field

[0001] The invention relates to a conductive adhesive and a preparation method thereof, in particular to a conductive adhesive for packaging high-brightness and high-power LEDs (light-emitting diodes) and a preparation method thereof. Background technique

[0002] In recent years, the application of LED (light-emitting diode) has developed rapidly in the field of lighting. Compared with traditional light sources, LED lighting has obvious advantages in energy saving and environmental protection. It is the future trend of indoor lighting, landscape lighting, vehicle lighting and other fields. . LED chip packaging technology is one of the core technologies of LED device manufacturing. Traditional packaging technology can well meet the requirements of traditional low-power and low-brightness LED devices. However, for the packaging of emerging high-brightness and high-power LED chips, as the power of LED chips increases, and when LED chips perform electro-optical...

Examples

Embodiment 1

[0023] At room temperature, weigh the raw materials according to the weight ratio of each component in Example 1 in Table 1, bisphenol A epoxy resin and 1,4-butanediol glycidyl ether were mixed for 10 minutes until uniform, and then Add dicyandiamide, 2-heptadecyl imidazole and 3-aminopropyltriethoxysilane, mix at room temperature for 10 minutes to form a homogeneous mixture, and then grind it through a three-roll machine until it becomes a fine and uniform mixture, then add the particle size range The conductive adhesive can be prepared by mixing 0.5 micron to 100 micron micron flake silver powder at a low speed for 30 minutes at room temperature.

Embodiment 2

[0025] At room temperature, weigh the raw materials according to the weight ratio of each component in Example 2 in Table 1, mix bisphenol F epoxy resin and neopentyl glycol glycidyl ether for 10 minutes until uniform, and then add diamino Diphenylmethane and 3-aminopropyltriethoxysilane were mixed at room temperature for 10 minutes to form a homogeneous mixture, and then ground by a three-roll machine until it became a fine and uniform mixture, and then added micron-sized particles with a particle size range of 0.5 microns to 100 microns The flake silver powder and the nano-scale silver wire with a wire diameter ranging from 50 nanometers to 1 micron and a length ranging from 1 micron to 100 microns can be mixed in a low-speed vacuum at room temperature for 30 minutes to prepare a conductive adhesive.

Embodiment 3

[0027] At room temperature, weigh the raw materials according to the weight ratio of each component in Example 3 in Table 1, mix bisphenol A epoxy resin and polyethylene glycol diglycidyl ether for 10 minutes until uniform, and then add diamino Mix diphenyl ether and 3-aminopropyltrihydroxysilane for 10 minutes at room temperature to form a homogeneous mixture, and then grind it on a three-roll machine until it becomes a fine and uniform mixture, then add micron-sized flakes with a particle size range of 0.5 microns to 100 microns The conductive adhesive can be prepared by mixing silver powder and nano-scale silver wires with wire diameters ranging from 50 nanometers to 1 micron and lengths ranging from 1 micron to 100 microns in a low-speed vacuum at room temperature for 30 minutes.

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