Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive

A technology of conductive adhesive and conductive powder, which is applied in the direction of conductive adhesives, circuits, adhesives, etc., can solve the problems of not many products required for use, low thermal conductivity, and the inability to use conductive adhesives, etc., to achieve high conductivity, high Good thermal conductivity, thermal conductivity and electrical conductivity

Inactive Publication Date: 2011-09-07
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thermal conductivity of traditional ordinary conductive adhesive is relatively low, lower than 10W/m·K, while the heat dissipation of high-brightness and high-power LED chips requires its thermal conductivity to be higher than 20W/m·K, so traditional conductive adhesive cannot be used , so it is necessary to develop materials with higher thermal conductivity, such as high thermal conductivit

Method used

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  • Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive
  • Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive
  • Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0022] Example 1

[0023] At room temperature, weigh the raw materials according to the weight ratio of each component in Example 1 in Table 1, and mix bisphenol A epoxy resin and 1,4-butanediol glycidyl ether for 10 minutes until uniform, then Add dicyandiamide, 2-heptadecylimidazole and 3-aminopropyltriethoxysilane, mix for 10 minutes at room temperature to form a homogeneous mixture, and then grind through a three-roll machine until it becomes a fine and homogeneous mixture, and then add the particle size range Conductive adhesive can be obtained by mixing micron-sized flake silver powder of 0.5 microns to 100 microns at low speed for 30 minutes at room temperature.

Example Embodiment

[0024] Example 2

[0025] At room temperature, weigh the raw materials according to the weight ratio of each component in Example 2 in Table 1, mix bisphenol F epoxy resin and neopentyl glycol glycidyl ether for 10 minutes until uniform, and then add diamino Diphenylmethane and 3-aminopropyltriethoxysilane are mixed at room temperature for 10 minutes to form a homogeneous mixture, and then milled by a three-roll machine until it becomes a fine and homogeneous mixture. Add micron particles with a particle size ranging from 0.5 microns to 100 microns Conductive glue can be prepared by mixing flake silver powder and nano-scale silver wires with a wire diameter ranging from 50 nanometers to 1 micron and a length ranging from 1 micron to 100 micrometers under low-speed vacuum at room temperature for 30 minutes.

Example Embodiment

[0026] Example 3

[0027] At room temperature, weigh the raw materials according to the weight ratio of each component in Example 3 in Table 1, mix the bisphenol A epoxy resin and polyethylene glycol diglycidyl ether for 10 minutes until uniform, and then add the diamino group Diphenyl ether and 3-aminopropyltrihydroxysilane are mixed at room temperature for 10 minutes to form a homogeneous mixture, and then milled by a three-roll machine until it becomes a fine and homogeneous mixture, and then micron-sized flakes with a particle size ranging from 0.5 microns to 100 microns are added Conductive glue can be prepared by mixing silver powder and nano-scale silver wires with a wire diameter ranging from 50 nanometers to 1 micron and a length ranging from 1 micron to 100 micrometers under low-speed vacuum at room temperature for 30 minutes.

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Abstract

The invention discloses a conductive adhesive for LED (light emitting diode) packaging. The conductive adhesive consists of the following raw materials in percentage by weight: 75 to 95 percent of conductive powder, 2 to 12 percent of epoxy resin, 1 to 10 percent of epoxy diluting agent, 1 to 3 percent of curing agent, 0 to 1 percent of curing accelerator, and 0.5 to 2 percent of coupling agent. The LED conductive adhesive provided by the invention has superior performance and good heat conduction and electric conduction effects and can fully meet operating requirements of a high-brightness high-power LED chip.

Description

technical field [0001] The invention relates to a conductive adhesive and a preparation method thereof, in particular to a conductive adhesive for packaging high-brightness and high-power LEDs (light-emitting diodes) and a preparation method thereof. Background technique [0002] In recent years, the application of LED (light-emitting diode) has developed rapidly in the field of lighting. Compared with traditional light sources, LED lighting has obvious advantages in energy saving and environmental protection. It is the future trend of indoor lighting, landscape lighting, vehicle lighting and other fields. . LED chip packaging technology is one of the core technologies of LED device manufacturing. Traditional packaging technology can well meet the requirements of traditional low-power and low-brightness LED devices. However, for the packaging of emerging high-brightness and high-power LED chips, as the power of LED chips increases, and when LED chips perform electro-optical...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J163/10C09J9/02H01L33/56
Inventor 吴光勇王建斌陈田安
Owner YANTAI DARBOND TECH
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