Resin composition with high-heat, high-glass transition temperature for printed circuit board, prepreg and coating substance

A technology of resin composition and printed circuit board, which is applied in the direction of printed circuit components, circuit substrate materials, synthetic resin layered products, etc., can solve problems such as thermal conductivity not meeting the requirements, and achieve improved service life and stability, Effects of high glass transition temperature and high thermal conductivity
CN101343402AInactive Publication Date: 2009-01-14NANYA PLASTICS CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NANYA PLASTICS CORP
Publication Date
2009-01-14
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to resin combination with high thermal conductivity and glass transition temperature used for a printed circuit board. According to the weight percentage, the resin combination comprises brominated epoxy resin occupying 20 percent to 70 percent, hardening agent occupying 1 percent to 10 percent, accelerating agent occupying 0.1 percent to 10 percent, inorganic powder occupying 0 percent to 20 percent, high heat conducting powder occupying 5 percent to 85 percent, and processing auxiliary agent occupying 0 percent to 10 percent. The resin combination has the advantages of high glass transition temperature and heat conducting performance, excellent thermal resistance and flame resistance, which can be applied to the heat conducting insulating layer of the printed circuit board after being made into a high heat conducting preimpregnated body through a containing and soaking way or into a high heat conducting coating through a coating way, thus the printed circuit board has high heat conducting performance, and the heat quantity generated by the operation of the electronic elements on the printed circuit board can be rapidly dissipated to enhance the service life and the stability of the electronic elements.
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Description

technical field

[0001] The invention relates to a resin composition, especially a resin composition with high glass transition temperature (Tg) and high thermal conductivity, which is applied to a printed circuit board as a heat conduction insulating layer. Background technique

[0002] The applicant once disclosed a brominated epoxy resin with a high glass transition temperature for glass fiber laminates, and obtained Chinese patent (publication number CN1358780), Taiwan patent No. 196977 and US patent No. 6,512,075. The disclosed brominated epoxy resin is synthesized by tetrabromopropanediol and at least one resin selected from phenol-benzaldehyde multifunctional epoxy resin, bifunctional epoxy resin and bromine-containing bifunctional epoxy resin. Obtained, and the weight-average molecular weight of brominated epoxy resin (M W ) is 1500-4000, the polydispersity index (Mw / Mn ratio) of molecular weight distribution is 1.5-4.0, the epoxy equivalent weight (EEW) is 300-450g / ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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