Even heating board and heat radiating device

Abstract

The invention relates to a heat soaking plate, which comprises a base plate and a cover plate, wherein, a chamber is hermetically formed between the base plate and the cover plate, working fluid is filled in the chamber, at least a vessel extending from the central area of the heat soaking plate to the circumferential edge part of the heat soaking plate is arranged in the chamber, a central through hole is formed at the center of the vessel, a multi-orifice structure used for performing capillary force on the working fluid is formed on the wall of the vessel, the multi-orifice structure is communicated with the central through hole. The heat soaking plate utilizes the vessel of the heat soaking plate to provide the capillary force to strengthen the back flow of the working fluid after being condensed, so as to reach the better purpose of heat soaking distribution, and to effectively solve the heat radiating problem of the electronic element with high heat productivity. The invention also provides a heat radiating device which is formed by assembling the head radiator and the heat soaking plate.

Description

technical field [0001] The invention relates to a soaking plate, in particular to a soaking plate for dissipating heat for electronic components and a heat dissipation device using the soaking plate. Background technique [0002] The general heat dissipation device is to make the heat-generating electronic components contact with the finned heat sink to achieve the purpose of heat dissipation through the heat conduction between the fins and the electronic components. A heat spreader with good thermal conductivity is usually installed between them. The heat sink is usually larger than the area of ​​the heat-generating electronic components to obtain a larger heat dissipation area. The function of the heat spreader is to spread the heat-generating electronic components The generated heat is evenly distributed before being transmitted to the radiator to give full play to the effectiveness of the radiator. The vapor chamber can use metal materials with high thermal conductivity ...

AI Technical Summary

Problems solved by technology

When the electronic components generate more and more heat per unit area during operation, the heat flux density per unit area will also increase accordingly, so the heat transmitted by the vapor chamber will also increase, and the heat will be concentrated between the vapor chamber and the electronic components. When the heat is quickly transferred to the external radiator by the steam flow generated by the phase change of the working fluid in the contacting heating part, the cooled liquid working fluid will accumulate at the edge of the vapor chamber, and there is no effective way to dissipate it. Transport to the heating place in the center of the vapor chamber to enter the next cycle

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