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Liquid immersion type packaged large power LED light source

A LED light source and high-power technology, applied in the field of high-power LED light source, can solve the problems of light source device performance attenuation and aging, difficulty in applying high power density and high-power LED light source, high PN junction temperature, etc., and achieve the solution of heat dissipation and light intensity output Effect

Inactive Publication Date: 2008-11-19
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this way, the heat of the LED chip cannot be dissipated as soon as possible, resulting in a high temperature of the PN junction, and other optical materials such as epoxy resin, silica gel and fluorescent agent work at high temperature for a long time, and the performance of the entire light source device decays and ages quickly. Poor reliability, this packaging structure is difficult to apply to high-power LED light sources with high power density

Method used

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  • Liquid immersion type packaged large power LED light source
  • Liquid immersion type packaged large power LED light source
  • Liquid immersion type packaged large power LED light source

Examples

Experimental program
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Embodiment Construction

[0013] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0014] Such as figure 1 As shown, the liquid immersion packaged high-power LED light source includes an LED chip 1, a packaging substrate 2, a cooling liquid 3, an optical window assembly 4, a housing 5, and a radiator 6; the radiator 6 is provided with a housing 5 and a packaging substrate 2. The LED chip 1 is arranged on the packaging substrate 2, the optical window assembly 4 is arranged on the top of the casing 5, and the cooling liquid 3 is filled in the casing 5.

[0015] The LED chip is fixed on the packaging substrate by welding and bonding. The packaging substrate is made of a material with high thermal conductivity, and the circuit required for chip connection is laid on it. The packaging substrate is fixed and installed on the radiator. A negative-pressure airtight space composed of an optical window assembly, a housing and a heat ...

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Abstract

The invention discloses an immersed-type packaged LED light source with high power, comprising an LED chip, a packaging substrate, cooling fluid, an optical window component, a shell and a radiator. The radiator is provided with the shell and the packaging substrate which is provided with the LED chip, the top of the shell is provided with the optical window component, and the cooling fluid is filled in the shell. The LED chip is arranged on the packaging substrate which is arranged on the radiator, and the LED chip and the packaging substrate are immersed in the cooling fluid, and the cooling fluid is enclosed in a negative pressure airtight space which is formed by the optical window component, the shell and the radiator to form condensation and evaporation circulation. Light generated by the LED chip is emitted from the optical window component, and heat energy is transmitted to a sealing component and the radiator to be dispersed, thereby effectively solving the problems of heat radiation and light intensity output of the LED light source with high power.

Description

technical field [0001] The invention relates to an illumination light source, in particular to a liquid immersion packaged high-power LED light source. Background technique [0002] LED light source is a new generation of green lighting source. Its power consumption is only one tenth of that of ordinary incandescent lamps, but its life is more than ten times longer. In addition, LED light sources also have the advantages of small size, durability, and rich colors. In order to meet the requirements of higher light intensity, the LED light source is realized by increasing the output power of a single chip or using an LED array. Under ideal conditions, matching optical materials and appropriate packaging structures can give full play to the efficient light-emitting performance of LEDs and convert most of the electrical energy into light. However, temperature has a great influence on the output light intensity and color temperature performance of high-power LED light sources, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V19/00F21V29/00H01L23/28H01L33/00F21Y101/02F21K9/20F21V29/56F21Y115/10H01L33/64
Inventor 符建
Owner ZHEJIANG UNIV
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