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LED with hot channel bonding layer

A technology of light-emitting diodes and bonding layers, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of small thermal conductivity, poor heat dissipation, and reduced thermal resistance and heat dissipation function luminous efficiency.

Active Publication Date: 2006-02-15
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the above invention patent, the epitaxial layer is grown on the light-absorbing first substrate, and then the epitaxial layer is connected to the second substrate with high thermal conductivity by using an adhesive layer, and then the light-absorbing first substrate is removed to reduce thermal resistance, increase heat dissipation, and increase the luminous efficiency; however, because the thermal resistance of the LED structure is equivalent to the sum of the thermal resistance of the epitaxial layer, the thermal resistance of the soft dielectric bonding layer and the thermal resistance of the second substrate with high thermal conductivity, among them, the thermal resistance of the polymer material The thermal conductivity of the soft dielectric adhesive layer is between 0.1W / mk and 0.3W / mk, which is very small, so that the light-emitting diode element still cannot fully utilize the heat dissipation characteristics of the high thermal conductivity substrate, and has poor heat dissipation. good disadvantages

Method used

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Examples

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Embodiment 1

[0022] see figure 1 , according to a preferred embodiment of the present invention, a light-emitting diode with a thermal channel adhesive layer includes a high heat dissipation substrate 11, an adhesive layer 13 with a bump thermal channel 12 formed on the high heat dissipation substrate, wherein, through the bump Penetrating or partially penetrating through the adhesive layer to form a thermal channel, a reflective layer 14 formed on the adhesive layer with a bump thermal channel, an insulating layer 15 formed on the reflective layer, and an insulating layer formed on the insulating layer A transparent conductive layer 16, wherein the upper surface of the transparent conductive layer includes a first surface area and a second surface area, a first contact layer 17 formed on the first surface area, a first contact layer 17 formed on the first contact A first confinement layer 18 on the layer, a luminous layer 19 formed on the first confinement layer, a second confinement laye...

Embodiment 2

[0024] see figure 2 According to another preferred embodiment of the present invention, a bonded light-emitting diode with thermal channels includes a high heat dissipation substrate 10 with bump thermal channels, an insulating layer 111 formed on the high heat dissipation substrate with bump thermal channels, formed on The bonding layer 13 on the insulating layer is used to make the insulating layer penetrate or partially penetrate the bonding layer through bumps, and a transparent conductive layer 16 formed on the insulating layer and the bonding layer, wherein the upper surface of the transparent conductive layer Comprising a first surface region and a second surface region, a first contact layer 17 formed on the first surface region, a first confinement layer 18 formed on the first contact layer, formed on the first A light-emitting layer 19 on a binding layer, a second binding layer 20 formed on the light-emitting layer, a second contact layer 21 formed on the second bin...

Embodiment 3

[0026] see image 3 , according to yet another preferred embodiment of the present invention, a bonded light-emitting diode array with thermal channels, which is compatible with figure 1 Similar to the first preferred embodiment, the difference is that the upper surface of the insulating layer 15 includes a plurality of first surface regions and a plurality of second surface regions, and a plurality of transparent transparent layers formed on the plurality of first surface regions of the insulating layer Conductive layer 16, the plurality of transparent conductive layers have a plurality of first surface areas and a plurality of second surface areas, and a plurality of LED stacks formed on the plurality of first surface areas of the plurality of transparent conductive layers, The LED stack sequentially includes a first contact layer 17, a first confinement layer 18, a light emitting layer 19, a second confinement layer 20, a second contact layer 21, formed on the second surfac...

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Abstract

The LED with thermal channel adhesive layer is characterized in that, forming metal bulge on adhesive layer that combines base plate and LED stack, or the semiconductor bulge penetrates adhesive layer, both to form heat dispersion channel to increase heat dispersion effect and improve stability and efficiency; wherein, the said LED at least comprises a said plate, a insulating layer, a LED stack formed on insulating layer, and a said adhesive layer.

Description

technical field [0001] The invention relates to a light-emitting diode with an adhesive layer, in particular to a light-emitting diode with a thermal channel adhesive layer. Background technique [0002] Light-emitting diodes are widely used, for example, in optical display devices, traffic signs, data storage devices, communication devices, lighting devices, and medical devices. How to improve the brightness of light-emitting diodes is an important issue in the manufacture of light-emitting diodes. [0003] Invention No. 550834 of Taiwan Patent Publication discloses a light-emitting diode structure and its manufacturing method. A light-emitting diode epitaxial structure is grown on a light-absorbing first substrate, and then a soft dielectric bonding layer of a polymer material is used. The epitaxial surface of the light-emitting diode is bonded to a second substrate with high thermal conductivity to increase the cooling effect of the chip and increase the luminous efficie...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/64
Inventor 谢明勋
Owner EPISTAR CORP
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