Electronic equipment sealing structure, electronic power supply and encapsulation method for electronic power supply

A technology of sealing structure and electronic equipment, applied in the field of electronics, can solve problems such as stress damage, stress damage of electronic components, insufficient sealing performance, etc., and achieve the effects of avoiding stress damage, improving heat dissipation effect, and ensuring sealing effect

Inactive Publication Date: 2012-07-04
惠州茂硕能源科技有限公司
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Problems solved by technology

[0004] The invention aims to solve the technical problem that the sealing structure of the existing electronic equipment adopts a hard potting glue for one-time potting, which is easy to cause stress damage to the electronic components, and provides a method that can avoid the stress caused by the potting glue to the electronic components. Damage to the sealing st

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  • Electronic equipment sealing structure, electronic power supply and encapsulation method for electronic power supply
  • Electronic equipment sealing structure, electronic power supply and encapsulation method for electronic power supply
  • Electronic equipment sealing structure, electronic power supply and encapsulation method for electronic power supply

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[0016] In order to enable those of ordinary skill in the art to more clearly understand the purpose, technical solutions, and advantages of the present invention, the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] The electronic device sealing structure disclosed in the present invention can be applied to various outdoor electronic devices, and is especially suitable for LED street lamp power supplies, LED tunnel lamp power supplies, wind power and solar inverter power supplies, etc. In the following description, an electronic power supply is used as an example to illustrate the present invention. Those skilled in the art will understand that the present invention is not limited to the electronic power supply in the embodiment shown in the drawings, and can also be applied to other suitable electronic power supplies. equipment.

[0018] See Figure 1 to Figure 3 The electronic device sealing structure include...

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Abstract

The invention discloses an electronic equipment sealing structure which comprises a shell, wherein a circuit board with an electronic element is arranged in the shell; wire rods are introduced into the shell respectively from two ends of the shell and electrically connected with the circuit board; the shell comprises an upper shell and a cover board; an opening is formed on the bottom surface of the upper shell, and the cover board is covered at the opening of the upper shell; a soft encapsulation glue layer is encapsulated on the upper part of the inner cavity of the upper shell, and at least wraps a board body of the circuit board; and a hard encapsulation glue layer is encapsulated below the soft encapsulation glue layer. According to the electronic equipment sealing structure, a phenomenon of stress damage, caused by encapsulation glue, to the electronic element can be avoided. The invention also discloses an electronic power supply with the electronic equipment sealing structure, and an encapsulation method for the electronic power supply.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a sealing structure for electronic equipment, an electronic power supply with the sealing structure and a potting method for the electronic power supply with the sealing structure. Background technique [0002] For electronic equipment (such as electronic power supply) used outdoors, it is in harsh environments such as sun and rain, wind and rain, lightning, acid rain, humidity, cold and heat shock, etc., so electronic equipment must have a sealed structure with a higher protection level. In order to play the role of waterproof, dustproof, high and low temperature resistance, etc., to avoid damage to electronic equipment caused by external harsh environments. In order to ensure the airtightness of the existing electronic equipment used outdoors, most of the circuit boards with electronic components are arranged in a casing, and then the hard potting glue is used for one-time ...

Claims

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Application Information

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IPC IPC(8): H05K5/06B29C39/10
Inventor 顾永德苏周王永彬徐兵吴纯平
Owner 惠州茂硕能源科技有限公司
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