This invention belongs to the field of
sandpaper production technology, specifically relating to a lamination and packaging
system and method for dust-free
ceramic dry
sandpaper. The invention features a pre-
assembly mechanism, a
sandpaper feeding mechanism, a
release liner feeding mechanism, and a lamination and packaging mechanism working collaboratively. The sandpaper and
release liner feeding mechanisms respectively achieve precise, non-
adhesive, and quantitative material delivery in a single layer, with precise material alignment achieved through a positioning structure. The pre-
assembly mechanism utilizes vacuum adsorption and
mechanical pressure to pre-assemble the double-layer sandpaper with the
release liner, avoiding direct friction damage to the
abrasive layers. The lamination and packaging mechanism employs a circumferential ring-shaped film formed by
adhesive coating and curing. This invention effectively solves the problems of sandpaper shedding, scratches, and dust accumulation during the packaging process of high-
hardness ceramic abrasive sandpaper, ensuring the performance of dust-free sandpaper, significantly reducing the cost of lamination and packaging
consumables, and offering high efficiency and excellent alignment accuracy in automated
assembly and lamination operations. It is suitable for the standardized
mass production of high-precision dust-free
ceramic dry sandpaper.