Thermal conductive molding compound and preparation method thereof

Abstract

The invention discloses a thermal conductive molding compound and a preparation method thereof. The thermal conductive molding compound consists of the following components by weight percent: 15-40% of thermal conductive filler A, 10-30% of thermal conductive filler B, 1-5% of thermal conductive filler C, 5-15% of reinforcing component, 0.05-0.5% of surface modifier and 0-2% of other additives. The preparation method comprises the following steps: adding the thermal conductive filler B in a mixer, adding the surface modifier for mixing, and then adding the thermal conductive filler C for further mixing to obtain a mixture I; adding the thermal conductive filler A in a high-speed mixer, and adding the surface modifier for mixing to obtain a mixture II; after uniformly mixing a plastic matrix with other additives, adding the mixture of the plastic matrix and other additives from the main feeding port of a twin-screw extruder; adding the mixture I and the mixture II from the main feeding port or a feeding port on one side downstream of the extruder; independently adding the reinforcing component from a feeding port on the other side downstream of the extruder; and obtaining the thermal conductive molding compound from the twin-screw extruder. The thermal conductive molding compound has excellent thermal conductivity and good mechanical property.

Description

[0001] technical field [0002] The invention relates to the technical field of functional polymer materials, in particular to a thermally conductive molding composition and a preparation method thereof. Background technique [0003] With the rapid development of microelectronics integration technology and assembly technology, the assembly density has increased rapidly, the volume of electronic components and logic circuits has shrunk thousands of times, electronic instruments have become thinner and smaller, and the operating frequency has increased sharply. The thermal environment of semiconductors has become high temperature. change rapidly. At this time, the heat generated by electronic equipment accumulates rapidly. To make electronic components work normally with high reliability and high efficiency under the ambient temperature of use, the ability to dissipate heat in time becomes an important limiting factor affecting their service life. Although traditional ceramic ...

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Problems solved by technology

The impact strength of the obtained material is between 25J / m and 30J / m, and the toughness of the material is relatively poor

As described in [0007] patent CN101568577A, graphite and boron nitride are added to the PP / PA matrix to prepare thermally conductive alloy materials, and the total mass fraction of graphite and boron nitride is as high as 71wt %, the thermal conductivity of the material is 2.2W / mK~4.0W / mK, the patent only pays attention to the fluidity, and there is no mention of the toughness of the material

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