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High thermal-conductivity polymer composite material and preparation method thereof

A composite material and polymer technology, which is applied in the field of high thermal conductivity polymer composite materials and their preparation, can solve the problems of affecting the application effect of ceramic filler nanoparticles, easy aggregation and agglomeration, and high surface energy, and achieves that the preparation method is easy to operate, The effect of strong controllability and excellent thermal conductivity

Inactive Publication Date: 2013-06-26
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the selection of thermally conductive fillers, ceramic fillers are widely used because of their high thermal conductivity, excellent thermal stability, chemical corrosion resistance, and good electrical insulation. However, due to the small size of ceramic filler nanoparticles and the surface energy High, in a thermodynamically unstable state, easily aggregated into agglomerates, thus affecting the actual application effect of ceramic filler nanoparticles

Method used

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  • High thermal-conductivity polymer composite material and preparation method thereof
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  • High thermal-conductivity polymer composite material and preparation method thereof

Examples

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preparation example Construction

[0032] The preparation method of the highly thermally conductive functionalized ceramic thermally conductive filler / epoxy resin polymer composite material of the present invention mainly includes the following two steps:

[0033] (1) Disperse amino-functionalized ceramic thermally conductive filler nanoparticles in a solvent, add quantitative 3,5-diaminobenzoic acid, pyridine and triphenyl phosphite, react at 100°C for 3 hours under a nitrogen atmosphere, and filter , washing, and drying to obtain hyperbranched polyaramid-grafted ceramic-type heat-conducting filler nanoparticles;

[0034] (2) Add an appropriate amount of aluminum acetylacetonate to the epoxy resin, stir and dissolve at 80°C, cool to room temperature after vacuum degassing, and at the same time disperse the hyperbranched polyaramid-grafted ceramic-type thermally conductive filler nanoparticles into the acetone solvent Medium, ultrasonic 30min. Then the hyperbranched polyaramid grafted ceramic thermal filler na...

Embodiment 1

[0038] The preparation method of the high thermal conductivity functionalized aluminum nitride / epoxy resin polymer composite material in this embodiment is as follows:

[0039] Pretreatment: Disperse 1g of aluminum nitride nanoparticles in 200ml of xylene and add 0.1g of aminosilane, then reflux at 100°C for 12h, filter, wash with water, and dry to obtain amino-functionalized aluminum nitride nanoparticles.

[0040] (1) Disperse 0.65g of 3,5-diaminobenzoic acid, 6.5g of amino-functionalized aluminum nitride nanoparticles, 6ml of pyridine and 6ml of triphenyl phosphite in 200ml of N-methylpyrrolidone solution, at 100°C Reaction under nitrogen atmosphere for 3 hours, after filtration, repeated washing with methanol and suction filtration, and then vacuum drying at 60°C to obtain hyperbranched polyaramid grafted aluminum nitride (AlN-HBP);

[0041](2) Add 0.3g of aluminum acetylacetonate to 30g of epoxy resin, stir and dissolve at 80°C, and cool to room temperature after vacuum d...

Embodiment 2

[0048] The preparation method of the high thermal conductivity functionalized boron nitride / epoxy resin polymer composite material in this embodiment is as follows:

[0049] Pretreatment: Disperse 1g of boron nitride nanoparticles in 200ml of xylene and add 0.1g of aminosilane, then reflux at 100°C for 12h, filter, wash with water, and dry to obtain amino-functionalized boron nitride nanoparticles.

[0050] (1) Disperse 0.65g of 3,5-diaminobenzoic acid, 6.5g of amino-functionalized boron nitride nanoparticles, 6ml of pyridine and 6ml of triphenyl phosphite in 200ml of N-methylpyrrolidone solution, at 100°C Reaction under nitrogen atmosphere for 3 hours, after filtration, repeated washing with methanol and suction filtration, then vacuum drying at 60°C to obtain hyperbranched polyarylamide grafted boron nitride (BN-HBP);

[0051] (2) Add 0.3g of aluminum acetylacetonate to 30g of epoxy resin, stir and dissolve at 80°C, degas in vacuum and cool to room temperature, meanwhile dis...

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Abstract

The invention discloses a high thermal-conductivity polymer composite material. The high thermal-conductivity polymer composite material comprises the following components in percentage by weight: 60%-95% of epoxy resin and 5%-40% of hyperbranched polyaryl amide grafted ceramic thermal-conductivity filler particles. The invention further discloses a preparation method of the high thermal-conductivity polymer composite material. According to the high thermal-conductivity polymer composite material and the preparation method thereof disclosed by the invention, the hyperbranched polyaryl amide grafted ceramic thermal-conductivity filler particles and the epoxy resin are used materials to obtain the high thermal-conductivity functional ceramic thermal-conductivity filler / epoxy resin polymer composite material; and the composite material has high thermal conductivity, and higher thermal conductivity and heat engine performances in comparison with the conventional filler direct blending process. The polymer composite material disclosed by the invention has excellent thermal conductivity and can be used for greatly improving the thermal conductivity and mechanical performances of the polymer matrix under low thermal-conductivity filler mixing amount, and therefore, the polymer composite material has an extensive application value in the fields of machinery, electronics, chemical engineering and the like. The preparation method disclosed by the invention is simple and easy to operate, strong in controllability and capable of realizing large-scale production.

Description

technical field [0001] The invention belongs to the technical field of electrical insulating materials, and in particular relates to a high thermal conductivity polymer composite material and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics integration and assembly technology and the higher and higher requirements for high voltage in the field of power and electrical insulation, as well as the rapid development of other related fields, the volume of electronic components and logic circuits has shrunk by tens of millions of times, and The working frequency increases sharply. At this time, the heat generated by the electronic equipment accumulates and increases rapidly, and the working environment temperature also changes rapidly towards high temperature. In order to ensure the normal operation of electronic components with high reliability for a long time, it is necessary to prevent the continuous rise of the operating...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/04C08K3/28C08K3/38C08K3/34C08K3/22C08G59/42
Inventor 钱荣江平开吴超吴新锋朱铭黄兴溢
Owner SHANGHAI JIAO TONG UNIV
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