The invention discloses a preparation method of a bimetallic
waveguide device for a GaN
terahertz quantum cascade laser, and the method comprises the steps: providing an epitaxial
wafer of a
silicon substrate GaN-based
terahertz quantum cascade laser, and carrying out the
etching of the epitaxial
wafer till a
silicon substrate, and forming a bar structure; forming a first
ohmic contact layer on the surface of the bar; evaporating bonding
metal on the surface of the receiving substrate; bonding the epitaxial
wafer with the substrate; removing the
silicon substrate by adopting a wet
etching mode; removing the buffer layer through an
inductive coupling plasma etching mode, exposing the bottom n-GaN layer, and forming a second
ohmic contact layer; and cleavage is carried out on the bar to obtain the bimetallic
waveguide device. According to the method, the
tensile strain of the Si-based epitaxial layer is released in advance by etching the epitaxial layer to the growth substrate before
wafer bonding, so that the purpose of releasing the stress is achieved, cracks of the epitaxial layer caused by release of the tensile stress after the substrate is removed are avoided, and improvement of the device manufacturing yield is facilitated.