Ejector assisted slab-type loop heat pipe

Abstract

The invention discloses an ejector assisted slab-type loop heat pipe which comprises a main loop and a bypath loop; in the main loop, a capillary core in an evaporator is connected with a gas collection channel; an overheating gaseous working medium at an outlet of the gas collection channel injects a saturated gaseous working medium from a compensating chamber through an ejector; the mixed gaseous working medium is connected with an inlet of a condenser by a gas line pipeline; an outlet of the condenser is connected with an inlet of the compensating chamber by a liquid line pipeline; the compensating chamber and the capillary core are longitudinally processed together; the capillary core, the gas collection channel and the compensating chamber are wrapped in a housing of the evaporator; in the bypass loop, a saturated gaseous working medium generated from liquid gasification by absorption of heat leakage in the compensating chamber passes through a regulating valve and then enters the ejector; and through changing the opening of the regulating valve, the flow of the saturated gaseous working medium gasified in the compensating chamber due to different heat leakage quantity is ensured to be led away. The ejector assisted slab-type loop heat pipe is an economical, effective, and feasible improvement scheme, and the performance of the loop heat pipe can be improved effectively.

Description

technical field [0001] The invention belongs to the technical field of heat pipes, and in particular relates to an ejector-assisted flat plate loop heat pipe. Background technique [0002] With the rapid development of electronic technology, the main frequency of electronic devices is getting higher and higher, the speed is increasing and the volume of integrated circuits is getting smaller and smaller, so that the heat flux required for heat dissipation of electronic devices has changed from 2-3w / cm 2 Increased to 10w / cm 2 Above, some high heat flux electronic devices (such as microwave power amplifiers, gyroscopes, cameras, and power supplies of various instruments, etc.) used in the aerospace field need to dissipate a large amount of heat in an extremely small space, which is harmful to electronic devices. Heat dissipation puts forward higher requirements. Studies have shown that in order to ensure the working stability and service life of the chip, its maximum temperat...

AI Technical Summary

Problems solved by technology

In this case, in order to satisfy the working fluid at a lower operating temperature, the system puts forward higher requirements on the subcooling degree of the refrigerant at the outlet of the condenser, which will undoubtedly reduce the heat transfer performance of the flat-plate loop heat pipe

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