A high temperature and pressure resistant ceramic sensor and its sealing solidification method has a positive lead of the ceramic plate connected with one end of the ceramic strain foil, encapsulation film at the rear side of the sensor shell, copper ring connected with both sides of the rear encapsulation film, rear end encapsulation film and ceramic strain foil, the other side of the ceramic strain foil connected with the front encapsulation film, the other end of the ceramic foil connected with the negative lead of the ceramic strain foil, and the negative lead connected to the strain foil fixed base copper ring. The sealing and solidification method comprises the solution cleansing, welding the electrode lead, constant temperature preheating, encapsulation, constant temperature heating, abrasion, and testing the capacity value. It is simple in structure, convenient in use, long in duration; with improved signal receiving width and repeatability, with the resistant temperature reaching 150DEG C, pressure 60 MPa, limitless durability, free from maintenance, applicable in fields with distortion signal measuring and down whole ultrasonic flow meter.