229 results about "Contact laser" patented technology

The invention discloses a wide-range weak feature scene measurement system based on multi-sensor fusion and structured light scanning, and relates to the technical field of wide-range scene scanning, in the system, an extended Kalman filtering algorithm is adopted, fusion is carried out based on positioning data provided by an inertial measurement module and a positioning sensing module, and a wide-range weak feature scene is obtained. And the distance measurement information provided by the laser distance measurement module is combined to correct the fused positioning data, so that the precision and robustness of subsequent point cloud registration are ensured. Then, according to position information and attitude information of the binocular structured light scanning camera during scene scanning, calculating a relative rotation matrix and a relative displacement matrix of each frame of scanning point cloud data relative to the first frame of scanning point cloud data, and performing coarse registration; in the coarse registration process, all frames of point clouds can be converted into a unified coordinate system by directly utilizing global pose information, and the efficiency of coarse registration is greatly improved. And finally, extracting laser marking point clouds projected by the non-contact laser marking device in each frame of scanning point cloud data, and performing iterative precise registration on each frame of scanning point cloud data by using color features and geometric distribution rules of the extracted laser marking point clouds. In conclusion, high-precision, high-efficiency and high-robustness point cloud registration in a large-scale weak feature scene is realized, and the method can be used for realizing high-precision non-contact measurement.

The invention discloses a laser radar attitude measurement positioning method and device for an aviation electromagnetic detection suspension system, and belongs to the technical field of aviation electromagnetic detection, attitude measurement and coordinate positioning. According to the invention, real-time space positioning information and attitude information of the aviation soft suspension flight pod subsystem are accurately obtained by adopting a non-contact laser remote sensing measurement mode, and attitude and positioning devices do not need to be fixedly installed on the suspension flight pod subsystem. Electromagnetic interference or dynamic stability of the attitude and positioning device and related auxiliary electronic equipment on the soft suspension flight pod subsystem is avoided, the accuracy of electromagnetic signals and data reliability in the detection process are ensured, and therefore the precision of aviation electromagnetic detection is improved.

The invention discloses a wafer polishing laser interference closed-loop pressure control method, and relates to the technical field of semiconductor manufacturing, and the method comprises the following steps: S1, triggering an automatic measurement program after a ceramic plate and a wafer are overturned; s2, driving a laser interference measuring head to perform non-contact scanning on T2 / T4 point positions of the wafer through a six-axis mechanical arm positioning system to obtain thickness distribution data; s3, fitting the thickness distribution data by adopting a Zernike polynomial to generate a three-dimensional distribution diagram, and calculating a pressure correction amount based on a process dynamic model and a pressure prediction model constructed by a support vector machine regression algorithm; s4, detecting a data outlier in real time through an exception handling module, and triggering an equipment protection strategy when the deviation exceeds a set threshold value; and S5, a pressure control instruction is transmitted to the polishing head through the PROFINET bus by means of the PLC. Through non-contact laser interference measurement, the laser interference technology is applied to thickness detection of the polished wafer for the first time, the single measurement time is shorter than 20 seconds, and the detection efficiency is remarkably improved.

The invention discloses a tracking scanning measurement integrated system, a tracking scanning measurement method and a tracking scanning measurement platform. A control device controls a laser emission source to emit distance measurement laser to a contact laser tracking device in a tracking measurement mode; according to an optical ranging signal fed back by the contact laser tracking device, the two-dimensional angle measurement driving device and the laser ranging device are controlled to drive the contact laser tracking device to track the set tracking cooperative target in real time so as to acquire coordinate data of a contact point of the tracking cooperative target and the surface to be measured in real time; and in the scanning measurement mode, the laser emission source is controlled to emit distance measurement laser to the non-contact laser scanning device, and the two-dimensional angle measurement driving device and the laser distance measurement device are controlled to drive the non-contact laser scanning device to scan the surface to be measured according to an optical distance measurement signal fed back by the non-contact laser scanning device so as to obtain scanning point cloud data. According to the invention, high-precision tracking coordinate measurement and high-efficiency scanning measurement can be realized through one instrument, and the detection efficiency is remarkably improved.

The invention discloses a tracking scanning measurement system and platform, the tracking scanning measurement system comprises a two-dimensional angle measurement driving device, a contact laser tracker, a non-contact laser scanner and a control device, and the control device is connected with the contact laser tracker, the non-contact laser scanner and the two-dimensional angle measurement driving device. The system is used for controlling a two-dimensional angle measurement driving device to drive a laser tracker to track a set tracking cooperative target in real time in a tracking coordinate measurement mode, obtaining coordinate data of a contact point of the tracking cooperative target and the to-be-measured surface through combination of two-dimensional angle measurement and laser interference distance measurement data, and scanning the to-be-measured surface in a scanning measurement mode. The two-dimensional angle measurement driving device is controlled to drive the non-contact laser scanner to scan a to-be-measured surface, and the scanning point cloud data of the to-be-measured surface is obtained through the combination of two-dimensional angle measurement and absolute distance measurement data. According to the invention, high-precision tracking coordinate measurement and high-efficiency scanning measurement can be realized through one instrument, and the detection efficiency is remarkably improved.

The invention provides an aero-engine blisk health monitoring method based on digital twinning, and provides an on-line damage identification and real-time monitoring method for the fatigue damage problem of an aero-engine blisk in a service state, and the fatigue damage problem of the aero-engine blisk in the service state is solved by integrating the digital twinning technology, the model correction technology and the non-contact laser vibration measurement technology. The damage identification, positioning, quantification and early warning of the blisk in a service state are realized, and the health state of the blisk is evaluated. The method has the advantages that the precise digital twin model of the blisk obtained through model correction provides a reference model for damage identification of the blisk; by establishing a blisk health monitoring system, feedback iteration among an engine control state, a digital twin model and online measurement parameters is realized, so that whether structural damage occurs or not is judged, the damage position is positioned, the damage degree is calculated, an alarm is given when the damage amount exceeds a limit value, the repair cost is reduced, and the flight safety is ensured.

The invention relates to the technical field of measuring devices, in particular to a glass thickness measuring instrument which comprises a workbench, the upper end of the workbench is fixedly connected with a first support, the upper end of the first support is provided with a first motor, and the lower end of the first support is provided with a first detection mechanism used for detecting an arc-shaped curved glass plate in a contact mode. A contact type laser micrometer is installed on the inner side of the first detection mechanism, a second detection mechanism used for non-contact type laser scanning detection of a glass plate is arranged on the inner side of the first detection mechanism, a plurality of sets of anti-reflection laser triangular sensors are arranged on the inner side of the second detection mechanism, and the anti-reflection laser triangular sensors are arranged on the inner side of the second detection mechanism for laser reflection interference caused by an arc-shaped curved surface. The anti-reflection laser triangular sensor is matched with the conical black velvet inner wall of the refraction plate and the 45-degree light barrier array to form an efficient optical trap, scattered light and transmission echoes are thoroughly absorbed, and the device is particularly suitable for high-precision measurement of high-power laser of 100 mW or above under an arc curved surface.

The invention relates to a pipeline steel ring welding seam toughness evaluation method based on fracture morphology fractal reconstruction. The method comprises the following steps: firstly, preparing an SENB / CT sample according to ASTME 1820 and other standards, completing a fracture toughness test, and calculating to obtain JIC or KIC; performing three-dimensional point cloud acquisition on the fracture of the fractured sample by using a non-contact laser scanning system with the resolution of less than or equal to 1 mu m, denoising, splicing and registering to obtain the three-dimensional shape of the fracture, and extracting the arithmetic mean roughness Sa; and performing fractal analysis on the reconstructed morphology by adopting an improved box counting method, and calculating fracture fractal dimension Df. And constructing a multivariate nonlinear prediction model by taking a toughness parameter as a dependent variable and taking fracture morphology characteristic characterization parameters Sa and Df as independent variables, and accurately evaluating the fracture toughness of the pipeline steel ring welding seam when a decision coefficient R2 is greater than or equal to 0.90. The method has the advantages of less sample demand and short analysis period, can quantitatively evaluate the fracture toughness of the material from the morphological characteristics of the fracture, obviously reduces the detection cost, improves the in-service pipeline integrity evaluation efficiency, and is suitable for rapid toughness prediction of circumferential weld materials of different steel grades and welding processes.

The invention discloses a heterostructure bonding quality evaluation method and device based on non-contact laser ultrasound. The method comprises the following steps: aiming at a target multi-layer heterostructure, calculating all corresponding resonance modes by utilizing a computer finite element simulation method to obtain a multi-mode theoretical resonance frequency; carrying out laser ultrasonic multi-point scanning on a preset plane area of the target multilayer heterostructure based on a thermoelastic effect by utilizing the established detection device, and collecting an ultrasonic signal; performing time-frequency domain conversion on the ultrasonic signal to obtain a corresponding frequency spectrum signal, and further obtaining a multi-modal measurement resonance frequency; and comparing the multi-mode theoretical resonance frequency with the multi-mode measurement resonance frequency to obtain a heterostructure bonding quality evaluation result. According to the invention, the accuracy of bonding quality evaluation is improved, and the evaluation convenience is improved.

The invention discloses an advanced method for manufacturing optoelectronic system arrays, where microdevices are developed separately and then transferred into a system substrate. The invention discloses multiple embodiments, including distributed sacrificial reference points, real-time monitoring with various sensing technologies, laser-generated alignment marks, non-contact laser triangulation, and using polymers for marking to assess and correct alignment during each transfer stage dynamically. The invention further discloses methods, which may be AI based, for detecting and correcting errors caused by wear, environmental changes, load variability, and mechanical vibrations. In general, this system for pre-transfer calibration, monitoring, error detection, and compensatory adjustments enables precise and reliable integration of microdevices into optoelectronic systems, significantly enhancing alignment accuracy, stability, and reliability throughout the manufacturing process. The system can be further an AI-based calibration validation in a microdevice transfer system.

The invention provides a porcelain insulator crack defect identification method and system based on non-contact laser ultrasound, and the method comprises the steps: extracting a forking angle and a forking length of a porcelain insulator tree-shaped crack from a porcelain insulator crack network expansion speed multiple, and carrying out the time domain analysis of multiple peak values of an echo signal, obtaining a numerical sequence of peak amplitude changing along with time; according to the numerical value sequence of the peak amplitude changing along with time, the echo energy loss degree at the bifurcation point is identified, a tail end weak reflection signal of the tree-shaped structure is analyzed, and the tail end depth value of the porcelain insulator tree-shaped crack is determined; the obtained porcelain insulator tree-shaped crack tail end depth value is combined with the rate relation that the number of branches is increased along with time, and the critical moment when the porcelain insulator crack is converted from a linear state to a tree shape is judged; and generating an early warning signal for identifying the crack defect of the porcelain insulator based on non-contact laser ultrasound according to the critical moment when the crack of the porcelain insulator is transformed from the linear state to the tree state.

The invention belongs to the technical field of industrial robot thin-wall bearing measurement, and relates to an industrial robot thin-wall bearing multi-geometric-quantity non-contact laser measurement device, and the core assembly comprises an adjustable laser detection mechanism which can accurately emit and receive laser to measure the geometric quantity of a bearing; the U-shaped track assembly can be rotationally segmented, so that loading and unloading are facilitated; the movable positioning mechanism moves through cooperation of a tooth roller and a tooth rail, and an air bag positioning shaft is matched with bearings with different inner diameters. And the grabbing device can grab the positioning shaft to drive the bearing, so that multi-angle detection and automatic turn-over are realized. The device works in a non-contact mode, various geometric quantities such as the inner diameter, the outer diameter and the roundness of the bearing can be accurately measured, and the precision reaches the micron level. The device has the advantages of efficient measurement, flexible adaptation to bearings of different specifications and high automation degree, greatly improves the measurement efficiency, reduces the labor cost, and meets the requirements of industrial production for high-precision measurement of the thin-wall bearing.

The utility model relates to an off-line laser thickness gauge, which comprises a rack, an object placing plate arranged on the rack, a through groove arranged on the object placing plate, a base arranged on the rack on one side of the object placing plate, two linear slide rails arranged on the base, a first slide block respectively arranged on each linear slide rail, a support seat arranged on the plurality of first slide blocks, and a second slide block arranged on the support seat. A supporting arm is arranged on the supporting seat, a first laser range finder is arranged on the supporting arm above the through groove, a second laser range finder is arranged on the supporting arm below the through groove, first connecting plates are arranged on the supporting arm, the number of the first connecting plates is two, and image capturing devices are arranged on the two first connecting plates respectively; the image capturing device comprises a prism, an industrial camera and a first mounting seat. The non-contact laser method is used for measuring the thickness of the pole piece and feeding back image data of a measured area at the same time. The utility model has the advantages of convenient use and wide market prospect.

The invention discloses a non-contact laser fuse additive manufacturing device with an external ultrasonic field. The non-contact laser fuse additive manufacturing device comprises a laser fuse additive manufacturing system and an ultrasonic field auxiliary system. The laser fuse wire additive manufacturing system is a main body part of the device, is used for achieving the fusion forming process of alloy wires and comprises a wire feeding module, a laser module and an XYZ three-axis moving platform. The ultrasonic field auxiliary system is connected with the laser fuse wire additive manufacturing system through the system connecting piece, and ultrasonic waves are applied to the molten pool through air so that ultrasonic stirring of the alloy molten pool can be achieved. According to the method, the ultrasonic field is applied to the laser fuse wire additive manufacturing process, so that refining of alloy grains is achieved, generation of air holes and cracks is effectively restrained, and the alloy structure and the performance of a formed part are effectively regulated and controlled.

A laser diode component is described including: a semiconductor layer stack having an active zone for emitting laser radiation, a photonic crystal structure having a plurality of structured portions, contacts for electrically contacting the laser diode component, one contact having a plurality of contact portions arranged in recesses of the semiconductor layer stack (2), wherein the contact portions penetrate the active zone.

The invention discloses a photoelectric device layout structure for realizing duplex communication by a non-contact laser slip ring and a layout method thereof, and relates to the technical field of laser slip rings. The non-contact laser slip ring comprises a stator and a rotor which are coaxially arranged and are not in contact with each other; photoelectric device groups with identical distribution modes are respectively arranged at the end parts, close to each other, of the stator and the rotor; the photoelectric device group comprises a plurality of lasers and photoelectric detectors which are distributed in the circumferential direction; the layout structure of the photoelectric device group comprises a single photoelectric detector layout structure and a multi-photoelectric detector layout structure; the single photoelectric detector layout structure ensures that a single detector can continuously and stably receive signals through densely arranged lasers; on the basis of a single photoelectric detector layout structure, the multi-photoelectric detector layout structure reduces the dependence on the number of the lasers by increasing the number of the detectors, can reduce the probability of communication failure caused by the failure of the lasers, and can improve the reliability of the laser slip ring.

The invention discloses a tracking and scanning measurement method and computer equipment, the tracking and scanning measurement method is applied to a tracking and scanning measurement system, the tracking and scanning measurement system comprises a two-dimensional angle measurement driving device, a contact laser tracker and a non-contact laser scanner, and in a tracking coordinate measurement mode, the two-dimensional angle measurement driving device drives the contact laser tracker to rotate. Controlling a two-dimensional angle measurement driving device to drive a tracking scanning device of the contact laser tracker to track a tracking cooperative target of the contact laser tracker in real time according to a set movement strategy so as to obtain coordinate data under a target coordinate system; in the scanning measurement mode, the two-dimensional angle measurement driving device is controlled to drive the non-contact laser scanner to scan the to-be-measured surface according to a set scanning strategy so as to obtain scanning point cloud data of the to-be-measured surface in the target coordinate system in real time. According to the invention, high-precision tracking coordinate measurement and high-efficiency scanning measurement can be realized through one instrument, and the detection efficiency is remarkably improved.

The utility model discloses a coking tamping hammer state monitoring device which comprises a cantilever located right above a tamping hammer, the rear end of the cantilever is installed on a gantry crane track, a transverse adjusting sliding block is installed at the rear end of the cantilever, the lower end of the transverse adjusting sliding block is located in the gantry crane track and detachably installed on the gantry crane track through a bolt, and the lower end of the transverse adjusting sliding block is connected with the cantilever. Two fixing plates are installed on the transverse adjusting sliding block, the rear end of the cantilever is further sleeved with a telescopic adjusting sliding block and fixed through a bolt, and a monitoring probe is detachably installed at the front end of the cantilever through a plurality of universal adjusting screws. The non-contact laser ranging technology is adopted, and data can be summarized in real time and transmitted to a computer. And the state of the hammer rod can be accurately monitored even in the hammer rod and a narrow space thereof. The system can detect the coal cake processing state in real time, provide fault information, help maintenance personnel to quickly position problems and improve the maintenance efficiency, so that the reliability and the production efficiency of the production process are enhanced.

The invention relates to the technical field of precision measurement and optical detection, and discloses a complex inner hole rapid detection method based on laser scanning. According to the method, full-automatic three-dimensional reconstruction of the special-shaped inner hole with the high depth-diameter ratio is achieved through cooperative movement of a rotating platform and an axial feeding laser measuring head in combination with triangulation method laser displacement sensing, multi-source data fusion and an environment compensation mechanism. According to the invention, a traditional contact type measuring means is abandoned, and a non-contact laser scanning technology is adopted, so that the problem of workpiece surface scratch or measuring head wear caused by physical contact is avoided; through cooperative movement of the rotating platform and the linear feeding mechanism, full-circumferential and full-depth coverage scanning of a complex inner hole is achieved, and the limitation that only discrete points or local information can be obtained through an existing method is solved.

The invention discloses a device and method for testing the wet expansion coefficient of a composite material under a humidifying condition, and belongs to the technical field of composite material performance testing, the device comprises a constant temperature box, the interior of the constant temperature box is divided into an upper closed chamber and a lower closed chamber, and the upper closed chamber is internally provided with a temperature adjusting element and a humidity adjusting element; the supporting device is arranged in the upper closed chamber, a plurality of grooves are formed in the end face of the top of the supporting device, the grooves are matched with supporting balls, and the supporting balls are used for supporting placed samples; the quality detection device is arranged in the lower closed chamber, and the detection end of the quality detection device extends into the upper closed chamber to be in contact with the bottom of the supporting device; laser emitted by the laser emitter penetrates through the upper closed chamber and is irradiated on the side end face, needing to be detected, of the sample. The problem of accurate measurement of the moisture absorption performance of the sample is solved by measuring the change of the sample through the laser transmitter and arranging the groove and the supporting ball matched with the groove on the supporting device.

The invention discloses a crystal cutting positioning system and method based on three-laser orthogonal distance measurement and tangent calculation, and belongs to the field of precision machining of semiconductor crystal materials. The main structure of the system is as follows: three orthogonally arranged laser range finders are arranged on an objective table facing a crystal; a posture adjusting device is arranged below the objective table and used for adjusting the yaw angle and the pitch angle of the crystal. And the data processing module is used for receiving distance signals of the three laser range finders and calculating a yaw angle and a pitch angle of the crystal according to a tangent function relationship. According to the method, laser ranging micron-order resolution and fixed baseline geometric constraint are utilized, and the deviation of the yaw angle and the pitch angle is accurately quantified in combination with tangent function solution, so that coupling deviation decoupling is realized. And non-contact laser measurement is adopted, so that hard and brittle crystal damage is avoided. Laser sensing, high-speed processing and precise executing mechanisms are integrated, full-automatic rapid calibration is achieved, and the cutting preparation efficiency is improved. A real-time closed-loop control mechanism actively maintains the position and posture of the crystal before machining and / or during machining, dynamic interference is overcome, and the cutting quality stability is ensured.

The utility model discloses an enameled wire diameter measuring machine, which relates to the technical field of diameter measurement and comprises a laser measuring host, a measuring port is arranged on the laser measuring host, a guide component, a cleaning component, a laser diameter measuring module and a linear moving mechanism are arranged in the measuring port, the guide component is used for transmitting an enameled wire, and the cleaning component is movably contacted with the enameled wire. The laser diameter measuring module is used for measuring the diameter of the enameled wire, the linear moving mechanism is arranged at the position, below the enameled wire, of the guide assembly, and the linear moving mechanism is provided with a laser marking device used for marking the diameter of the enameled wire; a gas purification structure is arranged on the laser measurement host, an exhaust fan is arranged on the gas purification structure, and gas guide assemblies are arranged on the gas purification structure and the linear movement mechanism. According to the utility model, the problems that the current wire diameter measurement of the enameled wire cannot be visually displayed on the enameled wire and the section with the unqualified wire diameter of the enameled wire cannot be quickly traced are solved.

The application discloses a buffer carving and marking module, which comprises supporting plates, the supporting plates are in parallel state and are provided with a plurality of supporting protrusions, a moving guide rail, a base, a mounting frame, a laser marking head and electromagnetic adsorption blocks, the moving guide rail is arranged on one side of the supporting plate, the base is slidably arranged on the moving guide rail, the mounting frame is arranged on the base, the laser marking head and the electromagnetic adsorption blocks are arranged on the mounting frame, the number of the electromagnetic adsorption blocks is not less than two, the adjacent two electromagnetic adsorption blocks are not in contact, and the laser marking head is located between the two electromagnetic adsorption blocks. The module has the following beneficial effects: the probability of relative shaking between the angle steel and the laser marking head is low during the marking process, and the shaking amplitude is small when the relative shaking occurs, so that the printed mark on the angle steel is clearer.

The invention provides non-contact laser measurement equipment and a non-contact laser measurement method, relates to the technical field of surveying and mapping, and solves the defect that a measured point which cannot be directly contacted by a host or a centering rod is difficult to effectively measure in the prior art. Non-contact high-precision laser irradiation point coordinate calculation can be realized; secondly, confidence degree information of coordinates is calculated, so that the confidence degree of a measurement result is judged; in addition, the measurement credibility can be dynamically adjusted through historical data, so that the method can adapt to the change of a complex environment, and the measurement precision and robustness are improved.

The invention belongs to the field of thin plate high-temperature alloy machining and manufacturing, and relates to a machining method for a thin plate high-temperature alloy with the small-diameter inclined hole multi-convex-hull characteristic. According to the method, the machining efficiency and quality of the sheet high-temperature alloy are improved, the hole forming position is determined on an unfolded graph through a hole-axis positioning method, non-contact laser cutting is adopted, manufacturing of a two-dimensional unfolded blank contour, a characteristic small hole and a process positioning hole is completed on a component base material plate, and a local step-by-step forming method is adopted for the blank. According to the method, the process positioning hole is used for positioning to carry out integral molded surface die forming, then the convex hull characteristics of the parts are formed one by one through the bending die with the local molded surface, and finally the parts are positioned and clamped in the heat treatment clamp through the process positioning hole, so that accurate shape correction is realized. And the accuracy of the convex hull is ensured.

The application discloses a kind of non-contact laser slip ring to realize duplex communication photoelectric device layout structure and its layout method, it is related to laser slip ring technical field, non-contact laser slip ring includes stator and rotor coaxially arranged and mutually not contact, the end of stator and rotor mutually close is respectively equipped with the photoelectric device group of same distribution mode;Photoelectric device group includes the circumferential distribution of several laser and photoelectric detector;The layout structure of photoelectric device group includes single photoelectric detector layout structure and multiple photoelectric detector layout structure;Wherein, single photoelectric detector layout structure is ensured by densely arranging laser that single detector can continuously, stably receive signal;Multiple photoelectric detector layout structure is on the basis of single photoelectric detector layout structure, by increasing the number of detector to reduce the dependence on the number of laser, the probability that communication fails due to laser failure can be reduced, so that the reliability of laser slip ring can be improved.

The application provides a laser chip with improved reliability and a preparation process thereof, and aims to solve the technical problem that an edge-emitting laser is prone to end face failure.The laser chip comprises a substrate, the back surface of the substrate is provided with an N electrode, the front surface of the substrate is provided with an epitaxial material, the top layer of the epitaxial material is an ohmic contact layer, the epitaxial material is provided with a waveguide, and the vicinity of the waveguide is a waveguide region; an insulating medium layer is arranged on the surface of the epitaxial material, the waveguide region and the insulating medium layer are provided with a P electrode, but the ohmic contact layer in the waveguide region is not provided with the insulating medium layer, and the P electrode is in contact with the ohmic contact layer; the end surface of the laser chip is provided with an electrode-free area, and the electrode-free area is not provided with the insulating medium layer and the P electrode above the electrode-free area.The application further comprises a preparation method of the laser chip.The electrode-free area is arranged on the end surface of the laser, and the electrode-free area can improve the COD threshold level and improve the reliability.

The application discloses a wafer polishing laser interference closed-loop pressure control method, and relates to the technical field of semiconductor manufacturing, and comprises the following steps: S1: a ceramic plate is triggered to automatically measure a program after being turned over with a wafer; S2: a laser interference measurement head is driven by a six-axis mechanical arm positioning system to non-contact scan T2 / T4 points of the wafer, and thickness distribution data is acquired; S3: a Zernike polynomial is adopted to fit the thickness distribution data to generate a three-dimensional distribution graph, and a pressure correction amount is calculated based on a pressure prediction model constructed by a process kinetics model and a support vector machine regression algorithm; S4: an abnormal processing module is used to detect data outliers in real time, and a device protection strategy is triggered when a deviation exceeds a set threshold; and S5: a pressure control instruction is transmitted to a polishing head by a PLC controller through a PROFINET bus. By means of non-contact laser interference measurement, the laser interference technology is applied to wafer thickness detection after polishing for the first time, and single measurement time is less than 20 seconds, so that the detection efficiency is significantly improved.

The invention provides a quantitative feeding system based on an online thickness measurement technology. The quantitative feeding system based on the on-line thickness measurement technology comprises a hardware part, a control part and a feeding part, wherein the hardware part comprises an on-line thickness gauge, a data processing unit, an environment monitoring device and a feeding control device; the on-line thickness gauge is a non-contact laser thickness gauge and is used for measuring the thickness of a feeding material in real time; the data processing unit comprises an embedded microcontroller and is used for receiving and processing thickness data and executing data filtering and thickness correction, and the environment monitoring device comprises a temperature and humidity sensor and a light intensity detector. According to the quantitative feeding system based on the on-line thickness measurement technology, through integration of the non-contact laser thickness gauge, the environment monitoring device and the embedded microcontroller, the system can monitor the material thickness and environment parameters in real time, and through the modes of data filtering, thickness correction and the like, the influence of environment noise is eliminated, and the measurement precision is improved.

The utility model discloses a laser engraving machine for keyboard characters. The laser engraving machine comprises a base; the support is fixedly installed on the top of the base, and laser equipment is installed on the support; the mounting plate is fixedly mounted at the bottom of the base, a circular plate is rotatably mounted at the top of the mounting plate, an L-shaped plate is fixedly mounted at the top of the circular plate, and a sliding plate is slidably mounted on one side of the L-shaped plate. Through cooperation of the circular plate, the L-shaped plate, the sliding plate, the clamping assembly, the lifting assembly and the containing frame, a keyboard can be automatically placed at the working position of laser equipment, the requirement for manual operation is reduced, the labor intensity of workers is lowered, meanwhile, the working efficiency of keyboard carving is improved, and the working efficiency of keyboard carving is improved. Due to the fact that manual direct contact with laser equipment is not needed in the keyboard placing and carving process, potential risks in the operation process are reduced, and the safety of workers is improved.