823 results about "Surface emission" patented technology

The invention discloses a container coating thickness online detection system and method, and the system comprises a non-contact thickness measurement unit which is used for transmitting modulation light to the surface of a container in real time according to the infrared light thermal modulation principle to excite a coating to generate a thermal wave signal, and determining the coating thickness through detecting the thermal wave reflection delay; the multi-mode executing mechanism is used for selecting a robot or a truss to carry the thickness measuring unit according to the specification of the container, and receiving a control instruction to drive the thickness measuring unit to move to a target detection point of the container according to a preset path; the three-dimensional positioning system is used for detecting the position deviation of the container entering the measuring station and feeding back the space coordinates of the container to the control system; and the control system is used for generating a motion path instruction according to the size of the container and a preset sampling rule, and receiving the coating thickness data of the thickness gauge in real time to generate a detection report, so that the precision, intelligence and high efficiency of container coating detection are realized.

Horizontal Cavity Surface Emitting Lasers (HCSELs) with angled facets may be fabricated by a chemical or physical etching process, and the epitaxially grown semiconductor device layers may be transferred through a selective etch and release process from their original epitaxial substrate to a carrier wafer.

The invention discloses a packaging method and device of a vertical cavity surface emitting laser, and belongs to the field of semiconductor laser chip packaging processes. The packaging heat dissipation cover is additionally arranged on the top of the VCSEL chip, the VCSEL chip is surrounded up and down by the packaging heat dissipation cover, the supporting connecting block and the bottom heat sink component, and the heat dissipation mode of the top of the device is adjusted from low-efficiency heat radiation to air to heat conduction through a high-heat-conductivity solid material. Compared with the prior art, the heat conduction capability of a medium near the center of a heat source can be effectively improved, and the blocking effect of a top DBR material on heat is remarkably reduced. In addition, the transverse component of heat flow at the top is further increased by using a chamfering structure in the through hole and a two-dimensional transparent heat conduction material, and the efficiency of the heat of the VCSEL chip flowing to the two sides of the top is improved.

Illumination device (10) for a motor vehicle headlamp for generating a low beam, wherein a vertical extension of the low beam extends along a VV-line from at least 0° down to at least −10° on the VV-line, said illumination device (10) comprises: —an optic body (100) comprising a common light input section (110), a light output section (130) and a shell surface (140) limiting the optic body (100), —a projection lens system (200) configured to project the light-rays in front of the illumination device (10), wherein the projection lens system (200) in combination with the optic body (100) are configured to generate the low beam illuminated by the projection lens system (200), wherein the optic body (100) comprises a first set of optically operative surfaces for guiding light-rays along a first light-ray path (LR1), wherein the first set of operative surfaces comprises a first and second light deflection surface (300a, 300b), and a first light exit surface (300c), wherein the first and second light deflection surfaces (300a, 300b) are arranged on the shell surface (140), and wherein the first light exit surface (300c) is arranged on the light output section (130), wherein light rays following the first light-ray path (LR1) are incident on the first deflection surface (300a) and are deflected to the second deflection surface (300b), and wherein light-rays incident on the second deflection surface (300b) are deflected to the first light exit surface (300c), and wherein light-rays emitted by the first light exit surface (300c) contribute to generate a first part of the low beam, and wherein the optic body (100) comprises a second set of optically operative surfaces for guiding light-rays along a second and a third light-ray path (LR2, LR3), wherein the second set of optically operative surfaces comprises a third deflection surface (400a) and a second light exit surface (400b), wherein the third deflection surface (400a) is arranged on the shell surface (140) and the second light exit surface (400b) is arranged on the light output section (130) separate from the first light exit surface (300c), wherein light-rays following the second light-ray path (LR2) are incident on the third deflection surface (400a) and are deflected to the second light exit surface (400b) for coupling out of the optic body (100), and wherein light rays following the third light-ray path (LR3) are incident on the second light exit surface (400b) directly from the common light input section (110), wherein light-rays emitted by the second light exit surface (400b) contribute to generate a second part of the low beam.

An electronic device is provided. The electronic device includes a ring-shaped housing having an inner surface into which a finger of a user is inserted, a light-emitting unit configured to emit a light to the inner surface of the housing through a first region of the inner surface of the housing within the housing, a light-receiving unit configured to receive first light, which is a portion of the light reflected from an inside of the finger of the user, through a second region of the inner surface of the housing within the housing, and a coating layer, disposed between the first region and the second region, configured to reflect second light, which is distinct from the first light and is remaining portion of the light, to the finger of the user to transmit the second light to the light-receiving unit.

Systems and methods are provided for ultra-fast modulation vertical-cavity surface-emitting laser (VCSEL). An example optical device includes an optical source and an electro-absorption modulated laser (EML) based structure on top of the optical source. The electro-absorption modulated laser (EML) based structure includes a grating structure, with the grating structure including a plurality of grating lines, and with the grating structure further including Pockels material disposed within the grating structure.

A surface-emitting laser element includes a translucent substrate, a back surface of which is light emission surface, an air-hole layer that is a photonic crystal layer, and a light reflection layer including a reflection surface. The air-hole layer has a diffraction surface which has a weakening region where a separation distance between the diffraction surface and the reflection surface is provided such that a light intensity of interference light generated by interference of first diffracted light and second diffracted light is lower than a light intensity of the first diffracted light is provided, and a strengthening region where a separation distance between the diffraction surface and the reflection surface is provided such that the light intensity of the interference light is higher than the light intensity of the first diffracted light is provided.

A wearable electronic device (1), having a first radiation source (10) configured to emit a radiation beam (11) to a surface of skin of a user, the radiation beam having a peak emission wavelength between 610-1400nm; a driver circuit (20) configured to provide a driving current (15) to the radiation source (10) to control an irradiation intensity of the radiation beam on said surface; and an antenna (40) and / or a sensor circuit (30) having one or more sensors. The driver circuit (20) is configured to receive one or more inputs from the sensor circuit (30) and / or from the antenna (40) and is configured to control the first radiation source (10) on the basis of said one or more inputs.

A vertical cavity surface emitting laser diode (VCSEL) includes a substrate, a lower Bragg reflector (DBR) layer, an active region, an upper Bragg reflector (DBR) layer, and a current confinement layer. The lower DBR layer is on the substrate. The active region is on the lower DBR layer on the active region. The current confinement layer is inside or outside the active region. When the current confinement layer comprises a compound containing phosphorus, such as AlAsP or AlGaAsP, and the phosphorus (P) content is within a specific range, the insulation rate of the current confinement layer will not be excessively fast to the point of being difficult to control. Additionally, the reproducibility of the aperture in the current confinement layer between batches of the VCSEL production is improved. Furthermore, the divergence angle of the VCSEL can be further reduced, thereby significantly enhancing the sensing capabilities of Lidar or 3D sensing.

A cathode-ray tube ultraviolet light source includes a metal housing provided with a light-transmissive window, a heatsink disposed within the metal housing, a phosphor having a first surface and an opposing second surface, wherein the second surface of the phosphor is in thermal contact with the heatsink, and an electron gun capable of developing an electron beam to impinge upon the first surface of the phosphor, whereby light emitted from the second surface of the phosphor is directed through the light-transmissive window.

The invention provides a photonic crystal surface emitting laser and a manufacturing method thereof, the photonic crystal surface emitting laser comprises a gain assembly and a photonic crystal assembly, and the gain assembly comprises a semiconductor substrate, a carrier transport layer and an active layer which are stacked in sequence; the photonic crystal assembly comprises a silicon-on-insulator structure and a photonic crystal structure formed on the silicon-on-insulator structure; the active layer and the photonic crystal structure are combined in a bonding mode so that light feedback and surface emission can be achieved through the photonic crystal structure when the active layer emits light. According to the photonic crystal surface emitting laser and the manufacturing method thereof, the key components of the photonic crystal surface emitting laser are separately manufactured and integrated through bonding, so that the manufacturing process is simplified, the manufacturing cost is reduced, the yield is improved, the process of each module can be independently optimized, and the risk of failure of the whole process is reduced.

The invention discloses a process for processing a corrosion-resistant aluminum alloy pipe through laser cladding, which comprises the following steps of: performing laser cladding on a formed aluminum alloy pipe, transmitting a laser beam to the surface of the aluminum alloy pipe, conveying cladding layer powder / alloy wires to a laser area, quickly melting the cladding layer powder / alloy wires and the surface of the aluminum alloy pipe together through the laser beam, and solidifying, thereby obtaining the corrosion-resistant aluminum alloy pipe. The cladding layer combined with the aluminum alloy pipe is formed on the surface of the aluminum alloy pipe, cladding layer powder / alloy wires are made of zinc or zinc alloy, the cladding layer serves as a sacrificial anode, a thin and compact oxide and hydroxide layer is formed on the surface of the aluminum alloy pipe, further oxidation reaction is effectively prevented, and the corrosion resistance and reliability of the aluminum alloy pipe are improved. And the laser cladding procedure can be accurately controlled by controlling the laser power of the laser beam, the spot diameter, the passing speed of the aluminum alloy pipe and the speed of conveying cladding layer powder / alloy wires, so that the cladding layer has the advantages of being small in dilution degree, compact in structure, good in combination with the aluminum alloy pipe and not prone to falling off.

The invention discloses an LED dimming system and method, and the system comprises a white light LED which is used for emitting a spectrum in a 400-650 nm wave band; at least three red light LEDs of blue light excitation fluorescent powder respectively emit red light with different central wavelengths, the central wavelength of the first red light LED is 660nm + / -2nm, the half-peak width is less than or equal to 15nm, and an I < n > GaA < l > P material vertical cavity surface emission structure is adopted; the central wavelength of the second red light LED is 730nm + / -3nm, the half-peak width is less than or equal to 20nm, and the second red light LED adopts an A < l > GaAs material quantum well structure; the center wavelength of the third red light LED is 780nm + / -5nm, the half-peak width is less than or equal to 25nm, and a GaAsP material gradient refractive index waveguide structure is adopted; the driving control module comprises three independent constant-current driving units which are used for respectively controlling the current and PWM duty ratio of each red light LED; the optical mixing module is composed of a two-stage integral rod and a micro lens array and is used for realizing uniform mixing of spectrums.

Systems and methods for laser-based surface processing operations on a semiconductor wafer, such as a silicon carbide semiconductor wafer, are provided. In one example, a method includes providing a semiconductor workpiece having a surface. The method includes providing emission of one or more lasers to the surface of a semiconductor workpiece at a non-perpendicular incidence angle relative to the surface. The method includes imparting relative motion between the one or more lasers and the semiconductor workpiece while providing emission of the one or more lasers to the surface of the semiconductor workpiece at the non-perpendicular incidence angle.

An optical transmission module includes a housing having a cavity therein and an optical transmission device encapsulated in the cavity. The optical transmission device includes an optical waveguide substrate, laser assemblies, an optical multiplexing assembly and main waveguides. The optical waveguide substrate includes a surface and a first reflection inclined surface having an acute angle therebetween. The laser assemblies are disposed on the surface of the optical waveguide substrate, and are configured to emit laser beams towards the surface of the optical waveguide substrate. The optical multiplexing assembly is disposed in the optical waveguide substrate, and is configured to combine the laser beams into a laser beam. The main waveguides are disposed inside the optical waveguide substrate, light inlet ends of the main waveguides face the first inclined surface, and light outlet ends of the main waveguides are communicated with the optical multiplexing assembly.

The embodiment of the invention discloses an adjustable ring laser welding system and method based on intelligent laser-assisted wire filling. According to the method, a laser emitting module is used for emitting a corresponding laser beam to the surface of a welding piece, and the shape of the laser beam is adjustable and annular; the wire filling module is used for conveying welding wires to the welding part; and the feedback module is used for acquiring the temperature and morphology in a molten pool corresponding to a welding part in the welding process to generate corresponding real-time monitoring data, and determining a feedback signal of the laser emission module and a feedback signal of the wire filling module based on the real-time monitoring data. According to the embodiment of the invention, intelligent and self-adaptive adjustment of the welding process can be realized through multi-dimensional information fusion and closed-loop control, the dependence on skills of operators is reduced while the welding quality is improved, and the production efficiency and the product yield are improved.

The invention discloses a surface emitting laser which solves the problems that a laser is poor in single-mode working stability and high in preparation process difficulty. The surface emitting laser comprises a substrate and an epitaxial structure which are arranged in a stacked mode, the epitaxial structure is provided with a plurality of holes, the section of each hole is roughly in a T shape, the sections are parallel to the substrate, filler is arranged in the holes, and the refractive index of the filler is different from that of the epitaxial structure. Under the same mode field area and surface emission coupling efficiency, the threshold gain difference between the base mode and the high-order resonance mode of the laser is large, and the stability of the single-mode working state is high. And the hole machining difficulty of the T-shaped structure is low.

Some implementations described herein include an optoelectronic device for a low-lighting application and techniques to form the optoelectronic device. The optoelectronic device includes near infrared light vertical-cavity surface emitting laser devices, near infrared light pixel sensors, and visible light pixel sensors. The near infrared light vertical-cavity surface emitting laser devices and the near infrared light pixel sensor include selectively grown epitaxial materials (e.g., silicon germanium, gallium arsenide, or another type III / V material) that improves a performance of the near infrared light vertical-cavity surface emitting laser devices, near infrared light pixel sensors.

A lighting device for a motor vehicle, in particular a high-definition headlamp, includes an imaging component that has an active surface on which light-emitting diodes or laser diodes are arranged in a matrix to generate pixels in a light distribution in a targeted manner, and a projection lens with which the light emitted from the active surface is projected outward from the motor vehicle when the lighting device is in operation. The lighting device is designed to switch the projection lens from a first setting to a second and from the second setting to the first. The projection lens has a first focal length in the first setting, and a second focal length in the second setting, which is greater than the first focal length.

To provide a surface emitting laser, a surface emitting laser array, and an electronic device that improve the reliability of a transparent conductive film.The present technique provides a surface emitting laser including: a first structure including a first multilayer reflective mirror; an active layer; and a second structure including a transparent conductive film, a pad electrode, and a second multilayer reflective mirror, the first structure, the active layer, and the second structure being disposed in this order, in which a film thickness of the transparent conductive film disposed at a position in contact with the pad electrode is greater than a film thickness of the transparent conductive film disposed on an optical path of light generated by the active layer.

The invention relates to an integrated component group comprising: a carrier, in particular a submount, with a first main surface and an opposing second main surface; a laser arranged on the carrier on the first main surface and having a first light-emitting surface and an opposing second light-emitting surface, wherein the laser is configured to emit more laser light via the first light-emitting surface than via the second light-emitting surface during its intended use; and a photodiode integrated into the carrier and configured to detect laser light emitted by the laser from the second light-emitting surface.

The invention belongs to the technical field of defect detection, and particularly relates to a mirror surface type surface defect detection method and system, a laser device is used for emitting a laser beam to a detected mirror surface type surface, the laser beam is reflected on a receiving plate through the detected mirror surface type surface to form an elliptic arc scanning path, and the elliptic arc scanning path is discretized into a plurality of continuous path points; obtaining a theoretical reflection light spot track of the roi area to be detected on the receiving plate, dividing the theoretical reflection light spot track into multiple equal parts, and establishing a mapping relation with each path point; the method comprises the following steps: controlling a laser to scan a detected mirror surface type surface along an elliptic arc scanning path, identifying path points corresponding to defects, recording actual position coordinates on a receiving plate, and obtaining equal division point positions on a theoretical reflection light spot track; acquiring an optical path offset, and determining normal vector deflection information of the defect at the surface of the detected mirror surface; obtaining a three-dimensional space coordinate of the defect; and constructing a three-dimensional model of the detected mirror surface type surface, and marking defect positions.

According to one embodiment, an optical element includes a first member. The first member includes a first region along a first plane. The first region includes a plurality of first structures. The plurality of first structures are arranged along a first direction at a first pitch and along a second direction at a second pitch. The first direction is along the first plane. The second direction is along the first plane and crosses the first direction. The first pitch is longer than the second pitch. A first length of the first region along the first direction is longer than a second length of the first region along the second direction.

Method for producing a plurality of optoelectronic components comprising the steps: Producing a plurality of volume-emitting µLEDs, each having a first emission surface, on a wafer, which are arranged at a first distance from one another on the wafer, wherein the µLEDs comprise a semiconductor layer stack of at least a first layer of a first conductivity type, a second layer of a second conductivity type, and an active region arranged between the first and second layers, an electrically conductive first contact layer on the first layer, and an electrically conductive second contact layer on the second layer; Transferring a subset of the µLEDs from the wafer to a temporary carrier such that at least two µLEDs of the subset of µLEDs are arranged on the temporary carrier at a second distance from one another that is greater than the first distance; Creating a structured dielectric material layer on the temporary carrier, which surrounds at least side surfaces of the subset of µLEDs in a contacting manner, and which has a second emission surface for light emitted by the first emission surface, wherein the second emission surface is larger than the first emission surface, in particular by at least a factor of 1.1; and Creating a second contact structure on the structured dielectric material layer, wherein the second contact structure contacts the electrically conductive second contact layer of the µLEDs.

3D printing device and 3D printing method. The device comprising:a build platform having an external surface;means for providing a polymerizable fluid resin on said surface;a radiation source, to emit a radiation beam to said surface;beam positioning means, to variably position an impinging point of said beam; andmeans for controlling said source and said positioning means to manufacture a 3D tubular object according to a model;wherein the build platform comprises a stem forming a tubular shaped surface around a longitudinal axis, so that said external surface of said build platform is comprised in said tubular shaped surface, and said positioning means is configured to variably position said impinging point of said beam on different points of said fluid resin provided on said tubular shaped surface.

To provide a surface light-emitting element, in which a light-emitting element unit has a constriction layer, capable of improving a degree of freedom of selecting a material of a layer of the light-emitting element unit other than the constriction layer.SOLUTION: A surface light-emitting element 10 is provided comprising a light-emitting element part LE including: a first structure including a first semiconductor structure SS1; a second structure laminated with the first structure and including a second semiconductor structure SS2; and a light-emitting layer 103 disposed between the first and second structures. The first structure and / or the second structure is provided therein with a constriction layer 104 that constricts, from between current and light, at least the current. The constriction layer has a second region 104a2 surrounding a first region 104a1 and having a higher resistance than the first region. The constriction layer has formed therein a first hole CH1 that surrounds the second region and where a solid layer or a gas layer is provided, a second hole where the first region is provided, or a third hole where the second region is provided.SELECTED DRAWING: Figure 1

The embodiment of the invention relates to a surface emitting laser. The surface emitting laser comprises a substrate; the bottom reflector structure, the active layer and the top reflector structure are arranged on the substrate; the grating structure is arranged on the top reflecting mirror structure; the grating structure comprises a base layer and an injection layer obtained by performing ion injection on a partial region of the base layer, the refractive index of the injection layer is different from that of the base layer, and the grating structure is configured to control the polarization mode of output light of the surface emitting laser. By applying the scheme of the invention, the surface smoothness of the grating can be improved, and an almost planar grating structure is manufactured.

The invention relates to a preparation method of a flexible film for dynamically adjusting infrared emissivity, and belongs to the technical field of dynamic adjustment of infrared radiation characteristics. The preparation method comprises the following operation steps: (1) uniformly mixing the basic component A and the reaction component B at room temperature; (2) defoaming the mixed solution, and pouring the mixed solution on a flat plate for self-leveling; (3) curing to obtain a polymer film; (4) stretching and fixing the polymer film, and sequentially plating an adhesion layer film and a functional layer film on the surface of the polymer film by using an electron beam evaporation coating technology; the functional layer film is made of a low-emissivity material; and (5) reducing the strain spontaneous release polymer film to an initial length to obtain the variable-emissivity flexible film with a wrinkle structure on the surface. The size and morphology change of the wrinkle structure changes the propagation path of the electromagnetic wave, and changes the area ratio of the high-emissivity material to the low-emissivity material, thereby changing the surface emissivity of the material. The infrared radiation temperature adjustment amplitude of the flexible film is 40 DEG C, and the flexible film has a good dynamic infrared camouflage function.

The invention relates to a component package, in particular a laser package, comprising a first semiconductor chip with a first main side and a second main side opposite the first. The first semiconductor chip has a first layer adjacent to the first main side, which comprises a photonically integrated element, wherein the first layer has at least one light input surface, at least one light output surface, and at least one light guide connecting the at least one light input surface and the at least one light output surface. The first semiconductor chip also has a second layer adjacent to the second main side, which comprises an integrated circuit that is decoupled from the photonically integrated element, and a plurality of contact pads on the second main side, which are provided for connection to a carrier, in particular a PCB, or a second semiconductor chip.The component package also comprises a first optoelectronic component, in particular a laser chip, which is designed to emit light of a first wavelength from at least one first emission surface, wherein the at least one first emission surface is arranged opposite the at least one light coupling surface.