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Infiltration preparation method of Cu-MoCu-Cu three-layer composite plate

A cu-mocu-cu, layer composite technology, applied in the direction of chemical instruments and methods, layered products, metal layered products, etc., can solve the problem of high thermal conductivity, achieve high thermal conductivity, avoid interlayer oxidation, and shorten the process The effect of the process

Active Publication Date: 2013-02-27
西安宝德九土新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The Cu-MoCu-Cu three-layer composite sheet prepared by this method has excellent interlayer bonding and high thermal conductivity, which can solve the problems of heat dissipation and packaging of large-scale integrated circuits.

Method used

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  • Infiltration preparation method of Cu-MoCu-Cu three-layer composite plate
  • Infiltration preparation method of Cu-MoCu-Cu three-layer composite plate
  • Infiltration preparation method of Cu-MoCu-Cu three-layer composite plate

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Embodiment 1

[0031] The Cu-MoCu-Cu three-layer composite sheet in this embodiment has a layer thickness ratio of 1:1:1. The Cu-MoCu-Cu three-layer composite sheet in this embodiment has the following steps:

[0032] Step 1. Use a hydraulic press to press molybdenum powder with an average Fischer particle size of 5.3μm into a molybdenum slab with a thickness of 10mm, then place the molybdenum slab in a hydrogen furnace and sinter at 1500°C for 3h under the protection of a hydrogen atmosphere , Get a porous molybdenum framework with a relative density of 60%±2% (such as figure 1 Shown);

[0033] Step 2. Lay the porous molybdenum framework described in Step 1 between two oxygen-free copper plates with a thickness of 23mm, and then place them in a hydrogen furnace. Under the protection of a hydrogen atmosphere, infiltrate at 1350°C for 2 hours to obtain a complete surface. Cu-MoCu-Cu three-layer composite material coated with copper; the mass percentage of copper in the MoCu layer of the Cu-MoCu-Cu...

Embodiment 2

[0041] The Cu-MoCu-Cu three-layer composite sheet in this embodiment has a layer thickness ratio of 1:2:1. The Cu-MoCu-Cu three-layer composite sheet in this embodiment is prepared by infiltration and includes the following steps:

[0042] Step 1. Use a hydraulic press to press molybdenum powder with an average Fischer particle size of 5μm into a molybdenum slab with a thickness of 8mm, and then place the molybdenum slab in a hydrogen furnace and sinter it at 1600°C for 3h under the protection of a hydrogen atmosphere. Obtain a porous molybdenum framework with a relative density of 70%±2%;

[0043] Step 2. Lay the porous molybdenum framework described in step one between two oxygen-free copper plates with a thickness of 10mm, and then place it in a hydrogen furnace, under the protection of a hydrogen atmosphere, infiltrate at 1350°C for 2 hours to obtain a complete surface Cu-MoCu-Cu three-layer composite material coated with copper; the mass percentage of copper in the MoCu layer ...

Embodiment 3

[0051] The Cu-MoCu-Cu three-layer composite sheet in this embodiment has a layer thickness ratio of 1:3:1. The Cu-MoCu-Cu three-layer composite sheet in this embodiment is prepared by infiltration and includes the following steps:

[0052] Step 1. Use a hydraulic press to press molybdenum powder with an average Fischer particle size of 5.7μm into a molybdenum slab with a thickness of 5mm, then place the molybdenum slab in a hydrogen furnace and sinter at 1700°C for 2h under the protection of a hydrogen atmosphere , Get a porous molybdenum framework with a relative density of 80%±2% (such as figure 2 Shown);

[0053] Step 2. Lay the porous molybdenum framework described in step one between two oxygen-free copper plates with a thickness of 5mm, and then place it in a hydrogen furnace, under the protection of a hydrogen atmosphere, infiltrate at 1300°C for 1.5 hours to obtain the surface Cu-MoCu-Cu three-layer composite material completely covered by copper; the Cu-MoCu-Cu three-laye...

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Abstract

The invention provides an infiltration preparation method of a Cu-MoCu-Cu three-layer composite plate, which comprises the following steps: 1. pressing molybdenum powder into a plate blank, and sintering into a porous molybdenum framework; 2. laying the porous molybdenum framework between copper plates to carry out infiltration, thereby obtaining a Cu-MoCu-Cu three-layer composite material; 3. smoothing the surface; 4. carrying out multi-channel hot rolling; 5. carrying out annealing treatment; 6. carrying out multichannel cold rolling; and 7. carrying out surface treatment and finished product shearing to obtain the Cu-MoCu-Cu three-layer composite plate. The steps of infiltration and compounding are carried out synchronously to prepare the Cu-MoCu-Cu three-layer composite plate, thereby greatly shortening the technical process and enhancing the production efficiency; the layers are combined in an infiltration mode, thereby obviously enhancing the interlayer binding force and effectively avoiding the problem of interlayer oxidization; and the Cu-MoCu-Cu three-layer composite plate prepared by the method provided by the invention has the advantages of favorable interlayer combination and favorable thermal conductivity, and can solve the problem of heat dissipation in the large-scale integrated circuit.

Description

Technical field [0001] The invention belongs to the technical field of composite plate preparation, and specifically relates to a Cu-MoCu-Cu three-layer composite plate preparation method by infiltration. Background technique [0002] Because of its good heat dissipation performance, adjustable thermal expansion coefficient, and excellent high temperature resistance, molybdenum copper alloy is widely used in the field of electronic information as heat sink materials, electronic packaging, electrical contacts and other materials. [0003] In recent years, with the rapid development of the electronic information industry, the assembly density of large-scale integrated circuits has continued to increase. Therefore, the heat per unit volume has increased sharply. In order to solve the heat dissipation problem of large-scale integrated circuits, Mo-Cu layered composite sheets are used as a kind of New heat dissipation materials came into being. Layered Mo / Cu composite sheet is a sandwi...

Claims

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Application Information

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IPC IPC(8): B32B15/01B32B15/20B32B3/24B23P15/00B22F3/11B22F1/05
CPCH01L23/3735H01L23/3736C22C1/045C22C1/0425C22C1/08B22F2998/10B22F2999/00B22F2003/185B22F3/177B22F2007/045C22C27/04B32B15/01B22F1/05C22C1/1073B22F3/1007B22F2201/013B22F3/02B22F2003/247
Inventor 林小辉李来平梁静王国栋曹亮张新
Owner 西安宝德九土新材料有限公司
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