A
system for using
machine-learning to create a model for performing
integrated circuit layout extraction is disclosed. The
system of the present invention has two main phases: model creation and
model application. The model creation phase comprises creating one or more extraction models using
machine-learning techniques. First, a complex extraction problem is decomposed into smaller simpler extraction problems. Then, each smaller extraction problem is then analyzed to identify a set of physical parameters that fully define the smaller extraction problem. Next, models are created using
machine learning techniques for all of the smaller simpler extraction problems. The
machine learning is performed by first creating
training data sets composed of the identified parameters from typical examples of the smaller extraction problem and the answers to those example extraction problems as solved using a highly accurate
physics-based field
solver. The training sets are then used to
train the models. In one embodiment, neural networks are used to model the extraction problems.
Bayesian inference is employed by one embodiment in order to
train the neural network models.
Bayesian inference may be implemented with normal Monte Carlo techniques or
Hybrid Monte Carlo techniques. After the creation of a set of models for each of the smaller simpler extraction problems, the machine-
learning based models may be used for extraction.