A 
system for using 
machine-learning to create a model for performing 
integrated circuit layout extraction is disclosed. The 
system of the present invention has two main phases: model creation and 
model application. The model creation phase comprises creating one or more extraction models using 
machine-learning techniques. First, a complex extraction problem is decomposed into smaller simpler extraction problems. Then, each smaller extraction problem is then analyzed to identify a set of physical parameters that fully define the smaller extraction problem. Next, models are created using 
machine learning techniques for all of the smaller simpler extraction problems. The 
machine learning is performed by first creating 
training data sets composed of the identified parameters from typical examples of the smaller extraction problem and the answers to those example extraction problems as solved using a highly accurate 
physics-based field 
solver. The training sets are then used to 
train the models. In one embodiment, neural networks are used to model the extraction problems. 
Bayesian inference is employed by one embodiment in order to 
train the neural network models. 
Bayesian inference may be implemented with normal Monte Carlo techniques or 
Hybrid Monte Carlo techniques. After the creation of a set of models for each of the smaller simpler extraction problems, the machine-
learning based models may be used for extraction.