Rigid-flexible combined printed circuit board preparation method

A rigid-flexible combination and circuit board technology, which is applied in the direction of multilayer circuit manufacturing and can solve problems affecting bending performance and other issues

Inactive Publication Date: 2014-03-26
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the lamination process, the resin of the prepreg will flow from the rigid area to the flexible area, forming excessive glue overflow at the rigid-flexible joint and affecting the bending performance

Method used

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  • Rigid-flexible combined printed circuit board preparation method
  • Rigid-flexible combined printed circuit board preparation method
  • Rigid-flexible combined printed circuit board preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The present invention will be further elaborated below in conjunction with the accompanying drawings and embodiments.

[0031] In this embodiment, a 4-layer rigid-flex circuit board is prepared, wherein the second and third layers are flexible layers, and the first and fourth layers are rigid layers. There is also a dielectric layer (flowable prepreg) between the 1st and 2nd layers and the 3rd and 4th layers. The specific production steps are as follows:

[0032] (1) Fabrication of flexible sub-board (refer to figure 1 ): The flexible board is etched out of the circuit through graphic transfer, and a polyimide cover film is pasted on the flexible area of ​​the flexible board. The polyimide cover film includes an epoxy resin adhesive layer and a PI layer. The epoxy The thickness of the resin adhesive layer is 15.0-75.0 μm, the thickness of the polyimide cover film is 12.7-50.4 μm, and then the flexible sub-board is obtained by pressing, and the pressing parameters are:...

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PUM

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Abstract

The invention discloses a rigid-flexible combined printed circuit board preparation method. The rigid-flexible combined printed circuit board comprises a rigid sub board, a dielectric layer, a flexible sub board, another dielectric layer, and another rigid sub board which are laminated sequentially. The method comprises the following steps of: flexible board preparation, rigid board preparation, dielectric layer preparation, pressing, cover opening, and post processes. In the invention, a PI film resistance glue is pasted in a rigid board slot area; a flow type prepreg (a PP sheet) windowing area is increased; and the total thickness of the PP sheet is controlled to be less than the total thickness of a polyimide cover film and a polyimide resistance glue film, so that the flow type prepreg can be applied to preparation of the rigid-flexible combined printed circuit board. The excessive glue length of the rigid-flexible connecting point of the pressed printed circuit board is less than 1.0mm, so that the requirements of the IPC-6013B relevant regulation are met.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a rigid-flexible circuit board and a preparation method thereof. Background technique [0002] With the development of electronic products in the direction of miniaturization and portability, the market demand for rigid-flex boards is increasing day by day. Rigid-flex board is a special circuit board that combines the advantages of rigid board and flexible board and can realize three-dimensional assembly in space. In order to control the glue overflow of the rigid-flexible board at the rigid-flexible joint, a non-flowing prepreg is used for bonding between the flexible material layer and the rigid material layer. However, the non-flowing prepreg has poor resin fluidity during the lamination process, which may easily cause defects such as lamination spots and voids due to insufficient glue filling, especially for thick copper boards and high-layer boards with a lar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
Inventor 曾志军林楚涛
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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