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Glass cream for protective coating and thick film resistance element

A technology of protective coating and thick film resistors, which is applied in the direction of electrical components, coating resistive materials, coating non-metallic protective layers, etc., can solve problems such as difficulties, and achieve excellent acid resistance, improved laser fine-tuning, and excellent effects Effect

Active Publication Date: 2007-06-06
SHOEI CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in order to balance low melting property, acid resistance and laser trimming, it was very difficult before

Method used

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  • Glass cream for protective coating and thick film resistance element
  • Glass cream for protective coating and thick film resistance element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] A glass paste was prepared by dispersing and mixing 100 parts by weight of the glass powder A described in Table 1 and 37 parts by weight of an organic vehicle including a 25% terpineol solution of ethyl cellulose. On the alumina substrate with a pair of Ag / Pd thick film electrodes formed in advance, mix CaRuO 3 40 parts by weight of powder and SiO with a basicity of about 0.45 and a Young's modulus of 90 GPa 2 -B 2 o 3 -BaO-CaO-Al 2 o 3 60 parts by weight of glass powder, after heat treatment at 600°C for 1 hour, the specific surface area obtained by crushing is 18m 2 100 parts by weight of composite powder per gram and 5 parts by weight of niobium oxide are dispersed in 30 parts by weight of an organic vehicle, and a resistor paste with a nominal film resistance value of 100 kΩ / □ is screen-printed in a square pattern of 1 mm × 1 mm. Thick film resistors with a film thickness of about 5 μm are produced by firing at 850°C. That is, this resistance paste is the res...

Embodiment 2

[0071] A thick-film resistance element was obtained in the same manner as in Example 1 except that glass powder B was used instead of glass powder A.

Embodiment 3

[0073] With respect to 100 parts by weight of glass powder A, 5 parts by weight of La with an average particle diameter of 1.5 μm was mixed as an oxide filler. 2 o 3 Except for the powder, a thick film resistance element was obtained in the same manner as in Example 1.

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Abstract

The present invention provides a glass paste for protection coating. The glass paste does not contain lead basically, and can be sintered under low temperature specially under the temperatures below 700 DEG C, also the air-tightness and chemistry endurance, especially acid resistance are excellent. Laser trimming can be easily carried out without damaging resistance stability when glass paste is used as precoated layer glass of thick film resistance element. A glass paste for protection coating has a character that said low melting point glass does not contain Pb basically, represented with the mol % of oxide, containing SiO2: 20 to 50 percents, Al2O3: 0.5 to 10 percents, chosen from at least one of BaO and SrO: 5 to 35 percents, ZnO: 5 to 35 percents, TiO2: 1 to 10 percents, chosen from at least one of Li2O, Na2O and K2O: 1 to 13 percents, B2O3: 0 to 20 percents, chosen from at least one of WO3 and MoO3: 0 to 5 percents.

Description

technical field [0001] This invention relates to substantially lead (Pb)-free protective coating glass pastes for protecting resistors and electrodes, thick-film conductor circuits, etc., and to thick-film resistor elements made therefrom. Background technique [0002] Thick film resistors used for thick film resistor elements such as thick film chip resistors are usually covered with protective coating glass for electrical, mechanical, and chemical protection from the outside. In addition, thick-film electrodes and thick-film conductors of electronic parts, display elements, multilayer substrates, etc. are sometimes covered with protective coating glass. [0003] As an example, a method of manufacturing a thick film chip resistor will be described. [0004] For example, a pair of electrodes is formed by printing and firing an electrode paste on an insulating substrate such as alumina. A resistor paste is printed and fired in a predetermined pattern so as to overlap at lea...

Claims

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Application Information

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IPC IPC(8): C03C12/00C03C3/066C03C3/093H05K3/28H01C7/00H01C17/06
CPCC03C3/083C03C3/093C03C3/062C03C3/066C03C3/087C03C3/085C03C8/00
Inventor 田中哲也远藤忠真岛浩金作整山添干夫
Owner SHOEI CHEM IND CO LTD
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