Arrangement comprising a shunt resistor and method for producing the same

Abstract

The invention relates to an arrangement comprising a shunt resistor with at least an electrically conductive first connecting leg and an electrically conductive second connecting leg. A resistance area of the shunt resistor is electrically connected to the first connecting leg and to the second connecting leg. The arrangement further comprises a circuit carrier with a first metallization and a second metallization. The first connecting leg is directly joined to the first metallization and the second connecting leg is directly joined to the second metallization. The resistance area of the shunt resistor is in thermal contact with the thermally conductive substrate by use of a thermal filler arranged between the resistance area and the substrate, and / or by directly contacting the resistance area with the substrate. The invention further relates to a method for producing an arrangement with a shunt resistor and a circuit carrier.

Description

technical field

[0001] The invention relates to a device comprising a shunt resistor. Background technique

[0002] Shunt resistors are used, for example, for the precise determination of current flow in power semiconductor modules. Conventional shunt resistors are used in a wide range of applications and are electrically connected to circuit carriers, for example by soldering. Physically, it is required that the two properties are incompatible. The first characteristic is that the resistance value is rather large so that the current can be measured accurately. The second characteristic is low thermal resistance to avoid overheating due to dissipated power. Since the two properties do not combine well, shunt resistors are often very hot, and as a result, degradation of the solder function and delamination of the shunt resistor may occur. This is one of the reasons why shunt resistors are generally specified at a certain maximum temperature - eg 250°C. Contents of the i...

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