Method for producing a
gallium nitride substrate (100), the method comprising: Formation of a bond
oxide film (120) on a first
gallium nitride (110); Performing a first
ion implantation for a surface of the first
gallium nitride (110) on which the bonding
oxide film (120) is formed, at least once, to form a damaged layer (113), thereby canceling any deflection of the first
gallium nitride (110); Performing a second
ion implantation for the surface of the first
gallium nitride (110) on which the bonding
oxide film (120) is formed, in order to form a blister layer (114); Connecting the bonding oxide film (120) of the first
gallium nitride (110) to a temporary substrate (130); Separation of the first gallium nitride (110) using the
vesicle layer (114) to form a
nucleation layer (115); and Enabling the growth of a second gallium nitride (140) using the
nucleation layer (115) to form gallium nitride in bulk, wherein, during the formation of the damaged layer (113), the thickness of the damaged layer (113) is controlled according to an accelerating
voltage of the first
ion implantation, wherein the second
ion implantation is performed at an accelerating
voltage that is lower than that of the first
ion implantation, wherein the blister layer (114) is formed at a position which is closer to the surface of the first gallium nitride (110) on which the bonding oxide film (120) is formed, compared to a position of the damaged layer (113), wherein during the second
ion implantation the bubble layer (114) is formed at a depth of 0.1 µm to 4 µm from the surface of the first gallium nitride (110), wherein a heat treatment at 400 °C to 800 °C is carried out for the bubble layer (114), wherein the first gallium nitride (110) comprises an N-surface (111) and a Ga-surface (112), wherein during the second ion implantation the blister layer (114) is formed on the Ga-surface (112) of the first gallium nitride (110), wherein the second gallium nitride (140) is allowed to grow using the Ga surface (112) of the first gallium nitride (110) as a
nucleation layer (115).