The utility model relates to
processing equipment for adding a
coating on a base material, which comprises a
deposition chamber, a
coating chamber, a
coating chamber and a coating chamber, the pulsed
electron beam deposition module is arranged on the
deposition chamber, the pulsed
electron beam deposition module and the
deposition chamber jointly form a
closed cavity, and the cavity can form a vacuum environment through air exhaust; and the pulsed
electron beam deposition module is arranged at the top, or the bottom, or the top and the bottom, or a single side surface or double side surfaces of the deposition chamber. Compared with
sputtering coating in the prior art, the pulse
electron beam deposition is more excellent in
energy consumption due to the pulse characteristic of the pulse
electron beam deposition. By adjusting the pulse interval parameter and the
energy consumption cost of coating of the base layer material per
square meter, 70% can be reduced, in addition, the deposition thickness can be randomly adjusted on line under the working condition through parameter adjustment, the step thickness difference can be realized on the same film, and the relative deposition material
utilization rate is excellent, so that the cleaning cost of the target material and the deposition chamber is further saved.