147results about How to "Suppress disconnection" patented technology

An active matrix substrate or TFT substrate is provided with a lower layer wiring with a groove wiring structure covering surroundings of a copper layer with a barrier metal film is formed by forming a groove at an insulating substrate and depositing the barrier metal film and the copper layer in this groove. This groove wiring structure is used for a TFT substrate of a liquid crystal display (LCD) device. It is possible to manufacture an LCD device with large size, high density, a large aperture ratio and in which the disclination defects originating from a different in level of the lower layer wiring and an occurrence of disconnection failures in an upper layer wiring are suppressed.

An organic light emitting device includes a first electrode and a second electrode, an organic layer including a light emitting layer between the first electrode and the second electrode, and an insulating film covering a rim of the first electrode from a surface thereof to a side surface thereof, and having an internal wall surface being in contact with the organic layer, and one or more corner sections in the internal wall surface with a ridge line thereof in parallel with the surface of the first electrode.

Regarding a semiconductor device, especially the present invention suppresses disconnection of the connection structure concerned in the semiconductor device which has the electric and mechanical connection structure using solder, and aims at improving connection reliability. And to achieve the above objects, the semiconductor device has the solder bump which electrically connects a semiconductor chip and a package substrate, the under-filling resin with which it filled up between the semiconductor chip and the package substrate, and a solder ball which electrically connects a package substrate with the outside, and the solder bump's elastic modulus is made lower than the elastic modulus of a solder ball.

A liquid ejecting head and a method of manufacturing the liquid ejecting head are provided. The liquid ejecting head has a pressure chamber forming substrate that includes a plurality of piezoelectric elements and that is connected to a first surface of a sealing plate, a driver IC that outputs signals that drive the piezoelectric elements and that is provided on a second surface of the sealing plate that is on the opposite side to the first surface, and a power supply wire that supplies electrical power to the piezoelectric elements, that is formed in the second surface of the sealing plate, and that has at least one portion thereof embedded in the sealing plate and a surface thereof exposed on the second surface side.

The thickness of a first drive electrode is greater than the sum of the thickness of a first reflective film and the thickness of a first conductive film, the first drive electrode extends from the surface of a fixed substrate to the surface of the outer edge portion of the first conductive film and is in contact with the first conductive film, the thickness of a second drive electrode is greater than the sum of the thickness of a second reflective film and the thickness of a second conductive film, and the second drive electrode extends from the surface of a movable substrate to the surface of the outer edge portion of the second conductive film and is in contact with the second conductive film.

The invention aims to provide an electromagnetic coil device and a method for processing a winding terminal thereof. Even a coil winding made of thin wires can be also provided with a reinforced winding terminal part with high reliability. In addition, a coil winding made of wires with even a, more or less, large diameter can also easily achieve the operation strengthening. The solution method is that the periphery of a flange of a coil frame for winding a coil winding is provided with clamping sheets for clamping and stopping a coil winding terminal and for wires which, of a winding starting terminal part and a winding stopping terminal part of the coil winding winded on the coil frame, extends towards the outer side of the flange, base end sides thereof are clamped on the clamping sheets and are folded back for many times to form a folding-back wire bundle which has a specific length and is twirled for appropriate times for twisting to become a leading-out terminal sheaved and fixed on the clamping sheets of the flange of the coil frame.

A switch illuminating EL sheet (7) has a structure such that a transparent protection film (8), a transparent electrode layer (9), a light emitting layer (10), a dielectric layer (11) and a back electrode layer (12) are layered in order from a light emitting face side. The transparent protection film (8) has a thickness of 10 μm to 60 μm. Further, the transparent electrode layer (9) is constituted of a conductive polymer. Such an EL sheet (7) can suppress wire breakage or failure to light due to keystroke stress or the like without impairing reliability and clicking feeling of a key switch. The EL sheet (7) is arranged, for example, between a key top (1) and a switch mechanism portion (2) as a light source for illuminating the key top portion (1).

A common electrode includes a plurality of individual sections arranged so as to correspond to pressure chambers that are divided by a plurality of slits, and a base section that joins one end of the individual sections. The individual sections on a base section side gradually widen in plain view. The common electrode has thin film sections at the individual sections and a thick film section at the base section, and the film thickness gradually increases from the thin film sections towards the thick film section in a region between the thin film sections and the thick film section.

Disconnection of a base line is suppressed even when a short-side direction of a collector layer is parallel to crystal orientation [011]. A bipolar transistor includes: a collector layer that has a long-side direction and a short-side direction in a plan view, in which the short-side direction is parallel to crystal orientation [011], a cross-section perpendicular to the short-side direction has an inverted mesa shape, and a cross-section perpendicular to the long-side direction has a forward mesa shape; a base layer that is formed on the collector layer; a base electrode that is formed on the base layer; and a base line that is connected to the base electrode and that is drawn out from an end in the short-side direction of the collector layer to the outside of the collector layer in a plan view.

Provided is a copper foil provided with a carrier which enables to form an extremely fine circuit and to suppress the disconnection of a circuit well. A copper foil provided with a carrier having, in order, an intermediate layer and an ultrathin copper layer on one side or both sides of the carrier, wherein the ultrathin copper layer is an electrolytic copper layer; and the thickness of the ultrathin copper layer measured by using a gravimetric method is 1.5 μm or less and the number of pinholes in the ultrathin copper layer is 0 pinholes/m² or more and 5 pinholes/m² or less.

To provide a multiple-wire winding method, a multiple-wire winding device, and a wound coil component that make it possible to reduce both damage done to wires and the risk of short-circuits between said wires and electrodes at different potentials. In this winding method, starting sections of a plurality of wires are first guided from the outside of a flange on one end to the inside thereof and then laid out on top of and affixed to electrodes on said flange. The wires are guided laterally with respect to the axis of a core and are wound around a winding-core section together. Next, a wire-bending implement is made to contact a flat surface of a flange on the other end between a plurality of electrodes, ending sections of the wires are guided from the inside of said flange to the outside thereof, and the ending section of at least one wire is hooked between the wire-bending implement and the flange on the other end and bent with said wire(s) under tension. The ending sections of the plurality of wires are then affixed to the corresponding electrodes on the flange on the other end. By bending the wire ending section(s) laterally, the risk of short-circuits with electrodes at different potentials is reduced.

A display device according to an embodiment of the invention includes: a base insulating film; a sealing film which covers the base insulating film; a plurality of first electrodes which are two-dimensionally arranged on the sealing film, the first electrodes adjacent in a first direction being connected via a first connection line; a plurality of second electrodes which are two-dimensionally arranged, the second electrodes adjacent in the second direction being connected via a second connection line intersecting the first connection line in plan view; an interlayer insulating film which is interposed between the first connection line and the second connection line and which fills a step formed by an outer edge of the sealing film and the base insulating film; and a lead-out wiring which is connected to the first electrode or the second electrode and which passes over a portion of the interlayer insulating film which fills the step.

The invention provides a heat-sealing device, wherein wire breakage caused by heat expansion of a heater is prevented. Shafts (50, 52) arranged on the pedestral plate (15) of the sealing component (14) at the side of the heater are inserted in the through holes (42, 44) of the terminal platform (36) of the terminal (32) fixedly provided with a strip-shaped heater (30). The terminal platform (36) can move along the shafts. When the strip-shaped heater (30) is expanded caused by heating, the terminal platform (36) moves along the shafts (50, 52) towards the strip-shaped heater (30), compared to the structure that a heater is contracted caused by the force of a spring, the load on the strip-shaped heater (30) when the strip-shaped heater (30) is contracted is minimized, wire breakage caused by heat expansion of the strip-shaped heater (30) is prevented.

A wire discharge processing machine performs a feeding control in such a manner that there are mixed, during a discharge processing, an upper side feeding state in which a high frequency pulse voltage is applied to a wire electrode only from an upper feeding part disposed above a processed subject, a lower side feeding state in which a high frequency pulse voltage is applied to the wire electrodeonly from a lower feeding part disposed beneath the processed subject and a two-side feeding state in which the high frequency pulse voltages are synchronously applied to the wire electrode from boththe upper and lower feeding parts, thereby suppressing the short-circuiting between the wire electrode and the processed subject and also suppressing the wire brakes, thereby facilitating the improvement of productivity.

The purpose of this invention is to provide a method that is used to manufacture a wound electronic component using twisted wires and makes it possible, when twisting a plurality of winding wires together, to minimize breakage thereof. This method for manufacturing a wound electronic component (1) includes a preparation step in which a chuck (C1) is used to grip a core (12) that has a winding-core section (14) and flanges (16 and 18), a first step in which part of each of a number of winding wires (20, 21) supplied from respective nozzles (N1, N2) is affixed to one of the flanges (16), and a second step in which the chuck (C1) is rotated so as to twist the winding wires (20, 21).

A radio device (10) receives signals from a radio device (20) through a plurality of downlink channels that have different frequencies, decides modulation formats that have transmission performances based on qualities of the received signals for the individual downlink channels, and transmits modulation format setup information in which respective pieces of information that represent the decided modulation formats for the individual downlink channels are combined into one piece to the radio device (20) through a plurality of uplink channels that have different frequencies. The radio device (20) refers to modulation format setup information received through at least one of the plurality of uplink channels and sets up modulation formats for signals transmitted through the plurality of downlink channels based on the modulation format setup information.