Wire material for saw wire and method for producing same

Abstract

Disclosed is a wire material for a saw wire and a method for producing the same, wherein parameter P expressed by formula (1) for the C, Si, Mn, and Cr content is 1000 or higher. The metallographic structure includes an areal proportion of 98% or greater of drawn pearlite, and the diameter is 0.05 - 0.18 mm. The tensile strength is 4000 MPa. The grip spacing is 100 mm, and the number of twists in torsion tests with a load tension of tensile strength wire material cross-sectional area 0.5 is 5 or greater. P = 1098 [C] + 98 [Si] - 20 [Mn] + 167 [Cr]... (formula 1) (In formula (1), [C], [Si], [Mn], and [Cr] are the content (in mass%) of C, Si, Mn, and Cr, respectively.)

Description

technical field [0001] The present invention relates to a wire for a wire saw used for cutting metal materials, ceramic materials, semiconductor materials, and the like, and a manufacturing method thereof. Background technique [0002] Wire saws are used for cutting Si single crystals, Si polycrystals, sapphire, SiC single crystals, and the like. Furthermore, a piano wire for a wire saw, a steel wire for a wire saw, and the like have been proposed (Patent Documents 1 and 2). For wire saws, thin wire diameter and high strength are required. [0003] In addition, wire rods of wire ropes used for reinforcement of tires, conveyor belts, etc. are required to have a thin wire diameter and high strength, similarly to wire saws. Furthermore, various wire materials for steel cords have been proposed (Patent Documents 3 to 9). [0004] As wire saws, free abrasive wire saws and fixed abrasive wire saws are known. The fixed abrasive wire saw is constituted, for example, by electrode...

AI Technical Summary

Problems solved by technology

[0005] However, if a wire saw with a thin wire diameter is used to cut the material to be cut, the wire saw is easy to break during cutting.

If the wire saw breaks during cutting, the cutting has to be stopped, so the yield drops

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