Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

134results about How to "Reduce radio frequency interference" patented technology

System and method for using film deposition techniques to provide an antenna within an integrated circuit package

An integrated circuit package comprises a cavity for housing an integrated circuit (IC) and an antenna provided as part of the package that is located substantially outside the cavity. The antenna may be located on the floor of the IC package that lies in the region outside of the IC cavity. Alternatively, the antenna may be located on the upper or lower surface of the lid sealing the IC package. The antenna may be placed in the floor or on a surface of the IC lid by forming depressions in the floor or lid surface and depositing conductive material in the depressions. The conductive material deposition may be by sputtering, evaporation, or other known physical or chemical deposition method. Antennas formed in the upper surface of an IC lid may be coupled to a pin of the IC package so that the antenna may be electrically coupled to a transceiver component on the IC within the package. Antennas formed in the lower surface of an IC lid or the floor of the IC package may be coupled by a conductive pin to a component pad of the IC within the package. To reduce electromagnetic noise that may be induced by the radio frequency signals emitted or received by an antenna, a grounding plane may be provided as part of the IC package. The grounding plane may be coupled to an electrical ground reference point through an IC package pin or the IC within the package.
Owner:BELL SEMICON LLC

Chip of double-frequency radio-frequency power amplifier circuit

The invention discloses a chip of a double-frequency radio-frequency power amplifier circuit. A radio-frequency power amplifier circuit in the chip comprises two radio-frequency power amplifier modules and two output matching networks which are positioned behind the two radio-frequency power amplifier modules and are respectively connected with the two radio-frequency power amplifier modules, outputs of the two output matching networks are connected to a high-isolation radio-frequency switch which is used for switching on or switching off the selected output matching network, the output of theoutput matching network is used as the output of the chip, output stages of the two radio-frequency power amplifier modules are arranged in parallel and in the same direction on the chip, i.e. triodes of the output stages are arranged in a parallel-strip structure way, and output directions of the two output stages on the chip are same and parallel. Last stages of the radio-frequency power amplifier circuits of two frequency ranges, i.e. radio-frequency amplifier tubes at the power output stage, are arranged in parallel and in the same direction, and therefore, the invention reduces area of the double-frequency power amplifier chip, saves the cost and lowers the radio-frequency interference between frequency ranges.
Owner:RDA TECH

System and method for using film deposition techniques to provide an antenna within an integrated circuit package

An integrated circuit package comprises a cavity for housing an integrated circuit (IC) and an antenna provided as part of the package that is located substantially outside the cavity. The antenna may be located on the floor of the IC package that lies in the region outside of the IC cavity. Alternatively, the antenna may be located on the upper or lower surface of the lid sealing the IC package. The antenna may be placed in the floor or on a surface of the IC lid by forming depressions in the floor or lid surface and depositing conductive material in the depressions. The conductive material deposition may be by sputtering, evaporation, or other known physical or chemical deposition method. Antennas formed in the upper surface of an IC lid may be coupled to a pin of the IC package so that the antenna may be electrically coupled to a transceiver component on the IC within the package. Antennas formed in the lower surface of an IC lid or the floor of the IC package may be coupled by a conductive pin to a component pad of the IC within the package. To reduce electromagnetic noise that may be induced by the radio frequency signals emitted or received by an antenna, a grounding plane may be provided as part of the IC package. The grounding plane may be coupled to an electrical ground reference point through an IC package pin or the IC within the package.
Owner:LSI CORP +1

Radio frequency interference processing method, device, storage medium and terminal

The invention provides a radio frequency interference processing method, comprising the following steps: acquiring a signal strength value of a received radio frequency signal of a radio frequency antenna; judging whether the signal strength value is less than a preset strength threshold; when determining that the signal strength value is less than the preset strength threshold, acquiring the data transmission frequency of a camera component; and performing corresponding adjustment for the data transmission frequency. According to the radio frequency interference processing method provided by the invention, the signal strength value of the received radio frequency signal of the radio frequency antenna is acquired, the data transmission frequency of the camera component is adjusted to be less than the preset safety frequency when the signal strength value is less than the preset strength threshold, and thus the radio frequency interference of the camera component to the radio frequency antenna during data transmission can be reduced, and the efficiency of radio frequency communication can be improved. The invention also provides a radio frequency interference processing device, a storage medium and a terminal.
Owner:GUANGDONG OPPO MOBILE TELECOMM CORP LTD

Movable holder for silicon-based film solar cells

The invention discloses a movable holder for silicon-based film solar cells, which belongs to the technical field of solar cells. The movable holder mainly has the following technical characteristics that: a supporting housing is a movable housing with grounded side frames, a holder comprising electrode plates is mounted on the supporting housing, and anti-interference shield assemblies are arranged between holders or holder arrays. The triangular end surface of a signal feed-in module with a cylindrical waist is contacted with a signal feed-in port and positioned in a concave triangular surface in the central area of the back plane of the negative plate to feed in radio frequency / very high frequency power signals, and the positive plate is grounded. Each negative plate-shielding cover is provided with a through hole, and the negative plate is insulated from the shielding cover. The invention has the advantage that because of feed-in on the central surface of the electrode plate, the loss of one-point or multi-point feed-in, which is caused by the feeder distance, is avoided. When a radio frequency / very high frequency power supply is used for driving, a uniform electric field can be formed to stably discharge in a large area, standing wave and skin effects are effectively eliminated, consequently, the yield is increased, and the cost is reduced.
Owner:SHEN ZHEN TRONY SCI & TECH DEV CO LTD

Radio-frequency interference processing method and device, storage medium, and terminal

The embodiment of the invention discloses a radio-frequency interference processing method and device, a storage medium, and a terminal. The method comprises the following steps: respectively acquiring an initial first frequency band used by a first communication module in the terminal, and an initial second frequency band used by a second communication module in the terminal; judging whether a part of the initial first frequency band is overlapped with a part of the initial second frequency band or not; and if the part of the initial first frequency band is overlapped with the part of the initial second frequency band, adjusting the initial second frequency band when the first communication module in the terminal enters a communication status, so that the initial first frequency band and the adjusted initial second frequency band are staggered. The radio-frequency interference processing method and device, the storage medium and the terminal provided by the invention have the advantages that the frequency bands of the two communication modules of the dual-mode terminal can be adjusted, so that radio-frequency interference on one communication module can be reduced when a phone conversation is carried out through the other communication module, which further improves the signal quality.
Owner:GUANGDONG OPPO MOBILE TELECOMM CORP LTD

Shield and spring interface to a spark plug from a pencil coil

An interface device for interfacing a pencil coil to a spark plug is provided. The interface device comprises a substantially C-shaped spring adapted to mechanically and electrically engage a pencil coil shield and also adapted to make electrical contact with a spark plug ground while the spring remains mechanically and electrically engaged to the pencil coil shield. Also provided is a pencil coil shield assembly for interfacing a pencil coil to a spark plug. The pencil coil shield assembly comprises a substantially cylindrical pencil coil and a spring. The substantially cylindrical pencil coil shield is adapted to surround the pencil coil. The spring is mechanically and electrically engaged with the pencil coil shield and is adapted to make electrical contact with a spark plug ground while the spring remains mechanically and electrically engaged to the pencil coil shield. The interface device and / or pencil coil shield assembly can be configured to reduce RFI from the secondary current winding currents of a pencil coil. In addition, each can be manufactured using inexpensive and uncomplicated manufacturing and installation techniques, and using starting materials and parts that are relatively inexpensive. Also provided is a method of reducing RFI from secondary winding currents of a pencil coil by, among other things, electrically connecting the substantially cylindrical shield to a low voltage terminal of a secondary winding of the pencil coil, and electrically connecting the substantially cylindrical shield to a spark plug ground of a spark plug associated with the pencil coil.
Owner:DELPHI TECH IP LTD

Digital symmetrical cable and manufacturing technology thereof

The invention provides a digital symmetrical cable and a manufacturing technology thereof. The digital symmetrical cable comprises pair-twisted groups, pair twisting shielding layers, an inner shielding layer, an insulating layer, an outer shielding layer and an outer protecting layer which are sequentially arranged from the center to the outside, wherein each pair-twisted group comprises insulating layers and two copper cores, each insulating layer is wrapped outside each copper core, and the two copper cores are pair-twisted to form the pair-twisted group; the pair twisting shielding layers are aluminium foil shielding layers; the inner shielding layer is an aluminium foil shielding layer; the insulating layer is made from extruded crosslinked polyethylene; and the outer shielding layer is a copper wire braided shielding layer. As the pair-twisted groups are respectively shielded, radio-frequency interference is lowered, and accordingly, expensive electronic equipment is not needed for reducing crosstalk. The wire pair shielding and total shielding are adopted to ensure that the cable supports high transmission rate, the integral bandwidth higher than 600MHz is provided, and the highest bandwidth can reach 1.2GHz. The digital symmetrical cable can support various applications including data, multimedia, wideband videos and CATV (Community Antenna Television) on one channel and has extremely high security.
Owner:ANHUI JIANGHUAI CABLE GROUP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products