According to the technical scheme, the
wafer turnover device comprises a
machine body, a mechanical arm is installed on the
machine body, a supporting rod is installed at the
tail end of the mechanical arm, a fixing frame is installed on the supporting rod, an adjusting piece is rotationally connected to the fixing frame, a rubber film is installed at the bottom end of a fixing disc, and a sliding disc is connected to the
machine body; a spraying strip is connected to the sliding disc, a rolling rod is installed on a rotating shaft of the second motor, and an
adhesive tape is installed on the rolling rod; according to the invention, by controlling the rotation of the adjusting sheet, the large-size
wafer can be conveniently adsorbed, the adjustment is convenient, gas enters the inner part of the outer ring through the through hole and is slowly sprayed out from the blowing hole, so that the rubber film is blown to bulge, the softness of the rubber film is ensured, the
diameter of the outer ring is large, and the large-size
wafer can be conveniently adapted; and a certain gap exists between the outer ring and the rubber film under the action of air pressure, so that the rubber film is relatively soft, damage to the wafer is avoided, dust on the surface of the wafer is removed by
ion wind, the dust is adhered to an
adhesive tape, and secondary adhesion is avoided.