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Electromagnetic wave shield film, and shielded printed wiring board equipped with same

A technology for printed wiring boards and shielding films, applied in the fields of magnetic field/electric field shielding, crosstalk/noise/electromagnetic interference reduction (, printed circuits, etc.), which can solve problems such as the difficulty of thinning electromagnetic wave shielding films, and achieve excellent shielding properties.

Inactive Publication Date: 2019-09-20
TATSUTA ELECTRICWIRE & CABLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In addition, although the shielding properties against electromagnetic waves in the high-frequency region (1 GHz to 10 GHz) are improved by increasing the thickness of the shielding layer, there is a problem that it is difficult to reduce the thickness of the electromagnetic wave shielding film.

Method used

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  • Electromagnetic wave shield film, and shielded printed wiring board equipped with same
  • Electromagnetic wave shield film, and shielded printed wiring board equipped with same
  • Electromagnetic wave shield film, and shielded printed wiring board equipped with same

Examples

Experimental program
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Effect test

Embodiment 1）

[0084]

[0085] As a supporting base material, a PET film having a thickness of 60 μm and having a release treatment on the surface was used. Next, a composition for a protective layer (solid content: 30% by mass) composed of bisphenol novolac A-type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., jER1256) and methyl ethyl ketone was applied on the supporting substrate, and By heating and drying, a support substrate with a protective layer having a thickness of 5 μm was produced.

[0086] Next, a shielding layer was formed on the surface of the protective layer. More specifically, a support substrate with a protective layer was installed in a batch vacuum evaporation apparatus (EBH−800 manufactured by ULVAC), and the vacuum arrival degree was adjusted to 5×10 in an argon atmosphere. −1 Below Pa, nickel was vapor-deposited to a thickness of 4.0 μm by a magnetron sputtering method (DC power supply output: 3.0 kW), and a first metal layer was formed.

[0087] Next...

Embodiment 2）

[0106] Except that the thickness of the first metal layer made of nickel was changed to 2 μm, an electromagnetic wave shielding film and a shielded printed wiring board were produced in the same manner as in Example 1, and the electric field wave and magnetic field wave shielding characteristics and output waveform characteristics were evaluated. Image 6 , Figure 7 , Figure 9 The above results are shown in .

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Abstract

The purpose of the present invention is to provide: an electromagnetic wave shield film having excellent transmission characteristics for high frequency signals and having excellent shielding characteristics with respect to electromagnetic waves in the high frequency region; and a shielded printed wiring board equipped with the electromagnetic wave shield film. An electromagnetic wave shield film 1 comprises: a shield layer constituted by a first metal layer in which nickel is the main component and a second metal layer in which copper is the main component; an adhesive layer provided to the second metal layer side of the shield layer; and a protective layer provided to the first metal layer side which is opposite the second metal layer side of the shield layer. A thickness T1 of the first metal layer is 2 to 10 [mu]m, and a thickness T2 of the second metal layer is 2 to 10 [mu]m.

Description

technical field [0001] The present disclosure relates to an electromagnetic wave shielding film and a shielded printed wiring board provided with the electromagnetic wave shielding film. Background technique [0002] In recent years, the performance of high-speed transmission of large-capacity data is required in smartphones and tablet-type information terminals, and high-frequency signals need to be used for high-speed transmission of large-capacity data. However, when a high-frequency signal is used, electromagnetic wave noise is generated from a signal circuit provided on a printed wiring board, which easily causes malfunction of peripheral devices. Therefore, in order to prevent such malfunctions, it is important to shield the printed wiring board from the influence of electromagnetic waves. [0003] As a method of shielding a printed wiring board, a method of using an electromagnetic wave shielding film having a shielding layer and a conductive adhesive layer has been ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00
CPCH05K1/0218H05K3/281H05K9/0084H05K9/0088H05K2201/0195H05K2201/0338H01J11/44H01J2211/446H05K9/0075
Inventor 山内志朗渡边正博田岛宏
Owner TATSUTA ELECTRICWIRE & CABLE
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