Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

1639 results about "Single-core" patented technology

A single-core processor is a microprocessor with a single core on a chip, running a single thread at any one time. The term became common after the emergence of multi-core processors (which have several independent processors on a single chip) to distinguish non-multi-core designs. For example, Intel released a Core 2 Solo and Core 2 Duo, and one would refer to the former as the 'single-core' variant. Most microprocessors prior to the multi-core era are single-core. The class of many-core processors follows on from multi-core, in a progression showing increasing parallelism over time.

Laser diode optical transducer assembly for non-invasive spectrophotometric blood oxygenation monitoring

InactiveUS7047054B2Easily and securely attachedLight couplingDiagnostic recording/measuringSensorsCapacitanceFiber
A non-invasive near infrared spectrophotometric monitoring transducer assembly includes a housing member, which is adhered directly on a patient's skin. The housing member contains a prism coupled to a flexible and lightweight single core optical light guide, which provides a means of transferring narrow spectral bandwidth light from multiple distant laser diodes of different wavelengths by use of a multi-fiber optic light combining assembly. Different wavelengths are needed to monitor the level of blood oxygenation in the patient. The assembly also contains a planar light guide mounted on the prism located in the housing member, which light guide contacts the patient's skin when the housing member is adhered to the patient's skin. The light guide controls the spacing between the prism and the patient's skin, and therefore controls the intensity of the area on the patient's skin which is illuminated by the laser light. The housing member contains a photodiode assembly, which detects the infrared light at a second location on the skin to determine light absorption. The photodiode assembly is preferably shielded from ambient electromagnetic interference (EMI) by an optically transparent EMI attenuating window. This rigid window placed over the photodiode also provides a planar interface between the assembly and the skin, improving optical coupling and stability as well as reducing the capacitive coupling between skin and the photodiode resulting in further EMI attenuation. The housing may be associated with a disposable sterile hydrogel coated adhesive envelope, or pad, which when applied to the patient's skin will adhere the housing to the patient's skin. The transducer assembly will thus be reusable, and skin-contacting part of the device, i.e., the envelope or pad can be discarded after a single use. The assembly also includes a laser safety interlock means, which is operable to turn off the laser light output in the event that the assembly accidentally becomes detached from the patient's skin.
Owner:CAS MEDICAL SYST

Method and apparatus for coupling optical signal with packaged circuits via optical cables and lightguide couplers

Method and apparatus for coupling electrical and communication circuits, included in a packaged semiconductor comprising photo receivers, photo transmitters and photovoltaic cells, through lightguide and optical fiber cables. The packaged semiconductor combinations comprise one, two or plurality of photo elements for a single or plurality one way optical signal, receive or transmit, and a single or plurality of two way optical signal communications via direct optical links and via optical prisms, filters, half mirrors and lenses. The packaged semiconductor includes at least one optical access to a single or plurality of lightguides or optical fiber with single core and for multicore lightguides. A built-in or attachable holders are used for attaching the different lightguide cables to the one or plurality of optical accesses with the attached cable end is terminated by cutting, trimming and shaping. The packaged circuit comprising electrical switches, current sensors, basic elements such as diodes, transistors and FETs, switches and power switches and different basic electrical circuit and communication, distribution circuits including CPU, DSP and complex semiconductor circuits, as used for communicating within limited short distances through optical network of lightguides and fiber optical cables. A packaged semiconductor of an SPDT power switch circuit is integrated with an SPDT manually activated switch, for providing dual switching for lights and other electrical appliances, via manual action and remotely via the lightguide or the optical fiber.
Owner:ELBEX VIDEO LTD

Laser diode optical transducer assembly for non-invasive spectrophotometric blood oxygenation

A non-invasive near infrared spectrophotometric monitoring transducer assembly includes a housing member, which is adhered directly on a patient's skin. The housing member contains a prism coupled to a flexible and lightweight single core optical light guide, which provides a means of transferring narrow spectral bandwidth light from multiple distant laser diodes of different wavelengths by use of a multi-fiber optic light combining assembly. Different wavelengths are needed to monitor the level of blood oxygenation in the patient. The assembly also contains a planar light guide mounted on the prism located in the housing member, which light guide contacts the patient's skin when the housing member is adhered to the patient's skin. The light guide controls the spacing between the prism and the patient's skin, and therefore controls the intensity of the area on the patient's skin which is illuminated by the laser light. The housing member contains a photodiode assembly, which detects the infrared light at a second location on the skin to determine light absorption. The photodiode assembly is preferably shielded from ambient electromagnetic interference (EMI) by an optically transparent EMI attenuating window. This rigid window placed over the photodiode also provides a planar interface between the assembly and the skin, improving optical coupling and stability as well as reducing the capacitive coupling between skin and the photodiode resulting in further EMI attenuation. The housing may be associated with a disposable sterile hydrogel coated adhesive envelope, or pad, which when applied to the patient's skin will adhere the housing to the patient's skin. The transducer assembly will thus be reusable, and skin-contacting part of the device, i.e., the envelope or pad can be discarded after a single use. The assembly also includes a laser safety interlock means, which is operable to turn off the laser light output in the event that the assembly accidentally becomes detached from the patient's skin.
Owner:EDWARDS LIFESCIENCES CORP

Method and Apparatus for Coupling Optical Signal with Packaged Circuits Via Optical Cables and Lightguide Couplers

Method and apparatus for coupling electrical and communication circuits, included in a packaged semiconductor comprising photo receivers, photo transmitters and photovoltaic cells, through lightguide and optical fiber cables. The packaged semiconductor combinations comprise one, two or plurality of photo elements for a single or plurality one way optical signal, receive or transmit, and a single or plurality of two way optical signal communications via direct optical links and via optical prisms, filters, half mirrors and lenses. The packaged semiconductor includes at least one optical access to a single or plurality of lightguides or optical fiber with single core and for multicore lightguides. A built-in or attachable holders are used for attaching the different lightguide cables to the one or plurality of optical accesses with the attached cable end is terminated by cutting, trimming and shaping. The packaged circuit comprising electrical switches, current sensors, basic elements such as diodes, transistors and FETs, switches and power switches and different basic electrical circuit and communication, distribution circuits including CPU, DSP and complex semiconductor circuits, as used for communicating within limited short distances through optical network of lightguides and fiber optical cables. A packaged semiconductor of an SPDT power switch circuit is integrated with an SPDT manually activated switch, for providing dual switching for lights and other electrical appliances, via manual action and remotely via the lightguide or the optical fiber.
Owner:ELBEX VIDEO LTD

A GEMM (general matrix-matrix multiplication) high-performance realization method based on a domestic SW 26010 many-core CPU

ActiveCN107168683ASolve the problem that the computing power of slave cores cannot be fully utilizedImprove performanceRegister arrangementsConcurrent instruction executionFunction optimizationAssembly line
The invention provides a GEMM (general matrix-matrix multiplication) high-performance realization method based on a domestic SW 26010 many-core CPU. For a domestic SW many-core processor 26010, based on the platform characteristics of storage structures, memory access, hardware assembly lines and register level communication mechanisms, a matrix partitioning and inter-core data mapping method is optimized and a top-down there-level partitioning parallel block matrix multiplication algorithm is designed; a slave core computing resource data sharing method is designed based on the register level communication mechanisms, and a computing and memory access overlap double buffering strategy is designed by using a master-slave core asynchronous DMA data transmission mechanism; for a single slave core, a loop unrolling strategy and a software assembly line arrangement method are designed; function optimization is achieved by using a highly-efficient register partitioning mode and an SIMD vectoring and multiplication and addition instruction. Compared with a single-core open-source BLAS math library GotoBLAS, the function performance of the high-performance GEMM has an average speed-up ratio of 227. 94 and a highest speed-up ratio of 296.93.
Owner:INST OF SOFTWARE - CHINESE ACAD OF SCI +1

Storage device and fetching method for multilayered cooperation and sharing in GPDSP (General-Purpose Digital Signal Processor)

ActiveCN104699631AAchieving Data Transfer LatencyAvoid Computational Performance ImpactsMemory adressing/allocation/relocationGeneral purposeNetworks on chip
The invention discloses a storage device and a fetching method for multilayered cooperation and sharing in a GPDSP (General-Purpose Digital Signal Processor). The device comprises a plurality of DSP (Digital Signal Processor) cores and an overall sharing caching unit for caching off-chip storage data, wherein each DSP core is connected with the overall sharing caching unit by an on-chip network; each DSP core comprises a scalar storage unit and a vector array storage unit which are parallel to each other; each DSP core is used for carrying out in-core data fetching through the respective scalar storage unit and vector array storage unit, and sharing data through the overall sharing caching unit. The method can be used for uniformly addressing through the scalar storage units and the vector array storage units, and fetching the scalar storage units according to data type configurations. By the aid of the device and the method, the efficient fetching of the data in the single core and the efficient sharing of the inter-core data in the GPDSP can be realized; the device and the method have the advantages of high accessing efficiency, small hardware cost and flexible configuration.
Owner:NAT UNIV OF DEFENSE TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products