21 results about "Embedded core" patented technology

The invention discloses a multi-bin vacuum press-fit device and method for an embedded core-embedded circuit board, and belongs to the technical field of PCB machining. The multi-bin vacuum press-fit device for the embedded core-embedded circuit board comprises a bin body, a heating mechanism and a vacuumizing mechanism, and a preheating bin, a press-fit bin and a buffering bin are arranged in the bin body; a first air-tight door is arranged between the preheating bin and the pressing bin for isolation, a second air-tight door is arranged between the pressing bin and the buffering bin, and the heating mechanism and the vacuumizing mechanism control the temperature and the vacuum degree of each bin respectively; the transferring mechanism is used for transferring materials, and the driving mechanism controls opening and closing of the feeding bin door, the discharging bin door, the first airtight door and the second airtight door. The control mechanism coordinates all the units to work cooperatively, and closed-loop control is achieved by monitoring technological parameters in real time. Through multi-chamber physical isolation and independent environment control, the problems of thermal crosstalk, pressure fluctuation and the like existing in traditional single-chamber equipment are solved, and the process stability and the production efficiency of PCB embedded chip pressing are improved.

1. The name of the design product: embedded core display (UHD620). 2. The use of the design product: the design product is used for computer configuration. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.

The invention discloses an amplifier structure with a TL-C parallel embedded network. The amplifier structure comprises an amplifier embedded core, an input matching network and an output matching network; the input end of the input series embedded network is electrically connected with the output end of the input matching network; the output end of the output series embedded network is electrically connected with the input end of the output matching network; the input end of the parallel embedded network is electrically connected with the output end of the input matching network, and the output end of the parallel embedded network is electrically connected with the input end of the output matching network; and the input end of the active two-port network is electrically connected with the output end of the input series embedded network, and the output end of the active two-port network is electrically connected with the input end of the output series embedded network. The power gain of the amplifier can be effectively improved, and the problem that the characteristic impedance of a transmission line is low due to the fact that stray capacitance between metal and a substrate is large and the minimum width of the metal is limited by a chip design rule is effectively solved.

The application belongs to the technical field of intelligent manufacturing, and discloses a production quality online monitoring and tracing method and system for color steel profiled plates and aluminum-magnesium-manganese roof plates. Special sensing equipment is deployed in the whole link of raw material entering, profile forming and coating curing. Terahertz spectrum sensors, laser composite sensing units, infrared thermal imagers and other devices work together, and are matched with adaptive adjustment and self-calibration technologies to ensure the accuracy of process parameters and defect information collection. Cross-modal feature extraction and double-branch models are used for defect identification, which can accurately identify subtle surface defects, accurately locate internal micro-cracks and plate shape deviations, and realize full-process online monitoring. A hybrid trusted architecture combining blockchain, NFT and RFID is used to configure a unique identifier and digital certificate for each batch of plates, embed core quality information, and implant a special chip on the surface of the plate to support fast reading and writing in all scenarios.

The utility model relates to the technical field of linear motor production corollary equipment, and provides a rotor glue pouring clamp of a linear motor, which comprises a front side plate, a rear side plate, a left side plate, a right side plate, an upper end plate and a lower end plate, the motor is characterized in that the front side plate is attached to the bottom surface of an iron core of the rotor and is fixedly connected with a mounting strip embedded with the iron core through a locking piece, and comb teeth of the iron core are vertically arranged; the left side plate and the right side plate are attached to the left side wall and the right side wall of the iron core respectively. The upper end plate and the lower end plate are arranged at intervals with the front side wall and the rear side wall of the iron core respectively, the upper end plate is provided with an exhaust hole and a lead hole, and the lower end plate is provided with a glue pouring port. According to the utility model, the defects in the prior art are overcome, the design is reasonable, the use is convenient, and the technical problems that more bubbles are generated when the rotor of the existing linear motor is encapsulated, and the subsequent vacuum degassing treatment time is long are solved.

The utility model discloses a data acquisition and data transmission device supporting multipath CAN communication, which comprises a box body bottom plate, a case left side plate, a case right side plate, a case rear panel and a case front panel, and is characterized in that the box body bottom plate is respectively connected with the case left side plate, the case right side plate, the case rear panel and the case front panel through first screws; the case left side plate is respectively connected with the case rear panel and the case front panel through second screws, the case right side plate is respectively connected with the case rear panel and the case front panel through third screws, and the case rear panel is respectively provided with a CAN bus interface connector and a debugging interface through first screws. Test tasks can be set according to test requirements and parameter settings, at most six paths of time-sharing data acquisition and transmission are supported, and data can be calculated and processed in real time and transmitted to a data center through an Ethernet communication interface through an embedded core controller.

The application relates to a simple design method of a low-cost embedded core module radiator, which comprises the following steps: firstly, a radiator design model is constructed, the radiator design model is composed of a substrate, a plurality of radiator fins, air ducts formed between the radiator fins, and a heat dissipation step below the substrate; secondly, the radiator power consumption is preset, the radiator fin height is estimated, natural heat dissipation and forced air cooling heat dissipation are evaluated according to a natural heat dissipation and forced air cooling heat dissipation evaluation algorithm, if the evaluation result is forced air cooling heat dissipation, then the radiator height suggestion value is obtained based on the air duct characteristic curve of the radiator and the characteristic curve of a heat dissipation fan and according to a forced air cooling radiator design algorithm; compared with general experimental methods and computer simulation design methods, the technical scheme has the advantages of simple and convenient scheme, high design success rate based on the embedded core module of the company, and the like.

The invention provides an IEEE (Institute of Electrical and Electronic Engineers) 1149.10 to IEEE 1500 (Institute of Electrical and Electronic Engineers) signal The method specifically comprises the steps that a CONFIG packet, a TARGET packet, a CH-SELECT packet and an SCAN packet based on the IEEE Std 1149.10-2017 standard are received, after equipment configuration, target selection and channel locking are sequentially completed, the SCAN packet is decoded according to the IEEE 1149.10 rule, an IEEE1500 driving signal is generated by combining the mapping relation between a scanning channel and IEEE1500 registers (WIR, WBR and WBY), and communication control over the IEEE1500 interface chip equipment is achieved. Wherein the IEEE1500 driving signal covers a Wrapper clock signal (WRCK), a Wrapper serial input signal (WSI), an instruction / data selection signal (SelectWIR), a shift control signal (ShiftWR) and an update control signal (Update WR), and the IEEE1500 driving signal comprises a Wrapper clock signal (WRCK), a Wrapper serial input signal (WSI), an instruction / data selection signal (SelectWIR), a shift control signal (ShiftWR) and an update control signal (Update WR). According to the method, IEEE 1149.10 data packet interaction and time sequence constraints are followed, after test data are coded to generate a compliance packet, an IEEE1500 driving signal with an accurate time sequence can be generated through conversion, the data analysis and test requirements of a high-speed test port are met, and an efficient solution is provided for embedded core test of a system-on-chip (SoC).

The invention relates to the technical field of navigation resolving circuits, and discloses a soc-based navigation resolving circuit, which comprises an embedded core board and a bottom board, and is characterized in that the bottom board comprises a first high-speed board-to-board connector, a serial port circuit, a CAN port circuit, a network PHY, an optical module, a hard disk, a first clock circuit, a network transformer, a first power supply circuit and an external connector; the embedded core board comprises an EMMC memory, a real-time clock, a DDR3, a second clock circuit, a second power supply circuit, an soc circuit and a second high-speed board-to-board connector; according to the navigation resolving circuit, the design of the embedded core board and the bottom board is adopted, a core processing circuit is separated from a peripheral circuit and an interface circuit, expandability and flexibility are greatly enhanced, and for different application requirements, quick response is achieved only by changing the bottom board, and development time and cost are saved.

This invention discloses a decentralized 5G distributed FWA networking method, comprising: trimming the NF network elements of the standard 5G core network; adjusting the standard 5G core network service functions to support data services and voice VoNR service functions; adjusting the technical specifications and performance indicators of the core network; developing 5G embedded base station-type core network software code to adapt to the hardware architecture and resource configuration of the base station at the software level and hardware driver level; freeing up the resources required to run the 5G core network software; completing the development of the embedded base station-type 5G core network software; establishing a unified remote user management center network element and mechanism; unifying the network management of the embedded core network, base stations, and CPEs, adopting distributed core functions, eliminating the need to deploy a centralized high-capacity core network, saving deployment and maintenance costs; and improving network security by eliminating the need for a central node, thus preventing the possibility of network-wide paralysis due to core network failure.

The invention provides an auxiliary demolding device, and relates to the technical field of composite material processing. The auxiliary demolding device comprises a demolding frame and a demolding trolley, the demolding frame is used for containing a cylindrical product embedded with a core mold, the demolding trolley comprises a frame, a lifting assembly arranged on the frame and a movable beam connected with the lifting end of the lifting assembly, and a demolding assembly is arranged on the movable beam and used for being connected with one sub core mold of the core mold. A core mold fixing assembly and a core mold ejection assembly are arranged on the demolding frame, the core mold fixing assembly is used for being connected with other sub core molds of the core mold, and the core mold ejection assembly is used for applying thrust to the demolding assembly so that the sub core molds connected with the core mold assembly can be separated from the cylindrical product. According to the auxiliary demolding device, the sub core molds can be sequentially and stably demolded, the problem of product damage caused by direct manual operation is avoided, meanwhile, core mold damage and potential safety hazards caused by direct manual knocking or prizing are avoided, meanwhile, a large amount of manpower and time are reduced, and the production efficiency is greatly improved.

The invention discloses an embedded core-embedded circuit board conveying device and circuit board sintering equipment thereof, and belongs to the technical field of circuit board sintering equipment. The embedded core-buried circuit board conveying device comprises a rack, a rotating mechanism and a plurality of bearing mechanisms, wherein the rotating mechanism is vertically arranged; the bearing mechanism can reciprocate along the rotation path of the rotation mechanism and is used for conveying the embedded core-embedded circuit board into the sintering device. By the adoption of the vertically-arranged rotary mechanism, the sliding direction of the bearing mechanism is changed into vertical rotary sliding, and the problem that existing serial operation equipment is large in occupied area can be solved. And secondly, the rotary sliding in the vertical direction increases the sliding distance, more sufficient time is provided for the heating or cooling process, and it can be ensured that the circuit board fully reaches the required temperature in the heating process.

A method includes placing a package component over a carrier. The package component includes a device die. A core frame is placed over the carrier. The core frame forms a ring encircling the package component. The method further includes encapsulating the core frame and the package component in an encapsulant, forming redistribution lines over the core frame and the package component, and forming electrical connectors over and electrically coupling to the package component through the redistribution lines.

The invention discloses a cleaning mechanism for circuit board core burying positioning glue injection and a circuit board core burying positioning glue injection device with the cleaning mechanism, the cleaning mechanism comprises a sliding seat, a glue wiping assembly, a wiping cloth assembly and a surface changing assembly, the sliding seat can drive the glue wiping assembly to slide back and forth in the first horizontal direction, and the sliding seat can drive the wiping cloth assembly to slide back and forth in the second horizontal direction; the frictioning assembly comprises cleaning cloth and two winding and unwinding reels, and the cleaning cloth can be conveyed in a reciprocating mode in the second horizontal direction; the wiping cloth assembly comprises an abutting head, and the cleaning cloth is arranged on the upper end face of the abutting head in the second horizontal direction and used for wiping and cleaning the glue injection head. The sliding seat slides in a reciprocating mode in the first horizontal direction, and the cleaning cloth is conveyed in a reciprocating mode in the second horizontal direction, so that the cleaning cloth moves in the two horizontal directions perpendicular to each other at the same time, the manual wiping action can be simulated, the cleaning effect on the glue injection head is improved, and meanwhile the utilization rate of the cleaning cloth is increased; the front and back surfaces of the cleaning cloth can be utilized through surface changing of the surface changing assembly, and the utilization rate of the cleaning cloth is increased.

The utility model provides a chassis CAN bus communication detector and a vehicle thereof, and the detector comprises a vehicle-mounted host which is detachably connected with a to-be-detected vehicle, and the vehicle-mounted host is in communication interaction connection with a chassis CAN bus of the to-be-detected vehicle through a CAN bus interface; the portable computer is provided with data analysis software, and the vehicle-mounted host is in communication interaction connection with the portable computer through a network interface or a WIFI interface. The vehicle-mounted host adopts the embedded core processing module, is installed in a magnetic attraction mode, and has the advantages of being low in power consumption, small in size and convenient to install. Meanwhile, the vehicle-mounted host supports lithium battery power supply, so that the use portability is improved; in addition, the core processing module filled with data acquisition software can acquire various CAN data, network data and Beidou data, so that the use condition of the chassis can be monitored in all directions.

The invention discloses a Chiplet three-dimensional integrated structure based on a reconstructed chip and a preparation method of the Chiplet three-dimensional integrated structure, and belongs to the technical field of semiconductor packaging. The Chiplet three-dimensional integrated structure comprises a substrate, embedded core particles, copper columns, functional core particles and an organic dry film; the substrate is provided with a chip embedding groove, the Pad surface of the embedded core particle is downwards arranged in the chip embedding groove, the copper column penetrates through the substrate and is connected with the embedded core particle and the functional core particle, the Pad surface of the embedded core particle is connected with one end of the copper column, the other end of the copper column is connected with the functional core particle, and the functional core particle is connected with the chip embedding groove. A chip embedding groove is formed in the substrate, a gap is formed between the embedded core particle and the inner wall of the chip embedding groove, the organic dry film is filled in the gap, vertical conductive through holes are formed in the substrate and the functional core particle and are communicated with each other, and the vertical conductive through holes of the substrate are positioned on two sides of the chip embedding groove. According to the invention, the problems that the Chiplet in the existing reconstructed chip is easy to deviate and the heat dissipation efficiency is low can be solved.

A method includes placing a package component over a carrier. The package component includes a device die. A core frame is placed over the carrier. The core frame forms a ring encircling the package component. The method further includes encapsulating the core frame and the package component in an encapsulant, forming redistribution lines over the core frame and the package component, and forming electrical connectors over and electrically coupling to the package component through the redistribution lines.

The application discloses a kind of concealed pre-embedded box groups, comprising: box body, the box body includes bottom plate and wallboard, the wallboard is located on bottom plate, and is surrounded to form box cavity;Embedded core is located in the box cavity to connect water inlet pipe and water outlet pipe;The box cavity includes bypass accommodation slot, and the bypass accommodation slot is located in the side of the embedded core to accommodate additional bypass water outlet pipe.The technical scheme of the application, in the box cavity of pre-embedded box group, the bypass accommodation slot is additionally arranged in the side of the embedded core, to reserve space for the bypass water outlet of the water passing valve body extending to the side, to accommodate the additional bypass water outlet pipe, so as to change the pre-embedded box group or the embedded core without, only need to adapt to the water passing valve body with different bypass waterway, can be added in the case where wall is not disassembled, re-laying pre-embedded box group, water outlet.

The utility model provides a kind of finished product placing rack of electron microscope scanning sample, belong to electron microscope sample preparation technical field, including base, the top of base is rotatably provided with sample holder, the outer wall of sample holder is evenly provided with clamping groove, the end of clamping groove is rotatably connected with hoop, the top of sample holder is fixedly connected with stud, the top of sample holder is provided with protective core plate, the bottom of protective core plate is evenly provided with core cavity, the inner chamber of protective core plate is rotatably provided with the rotating cap of stud screw connection, and rotating cap is provided with rotating stop member between protective core plate, after sample is fixed in clamping groove in sequence, continue to twist rotating cap, so as to cover core cavity in the embedded core outside each sample, and then the embedded core is protected, in the process of moving protective core plate, rotating cap is prevented from reverse rotation by rotating stop member, the movement in the same direction is guaranteed, reverse movement is prevented, so as to guarantee the sealing between protective core plate and sample holder.

The invention discloses a transferring mechanism for circuit board core burying, positioning and glue injection and a core burying, positioning and glue injection device. The transferring mechanism comprises a workbench, a bearing frame, a transmission assembly and a driving assembly. The workbench is provided with a glue injection station; the bearing frame can be arranged on the workbench in a reciprocating sliding mode, the two ends of the bearing frame are configured to contain material plates, and the material plates are configured to bear circuit boards; the transmission assembly can be arranged on the workbench in a sliding mode, and the transmission assembly is configured to drive the bearing frame to slide on the workbench in a reciprocating mode; the driving assembly is arranged on the workbench, and the driving assembly is configured to drive the transmission assembly to slide on the workbench in a reciprocating mode so that the two ends of the bearing frame can alternately slide to the glue injection station. The bearing frame slides on the workbench in a reciprocating mode through the transmission assembly, so that the material plate slides to the glue injection station alternately, and glue injection can be continuously conducted on the circuit board. And meanwhile, in the glue injection process, the circuit board on the material plate sliding out of the glue injection station can be fed and discharged, so that the glue injection efficiency is improved.

The application discloses a kind of embedded embedded core circuit board multi-bin vacuum pressing equipment and method, belong to PCB processing technical field, this embedded embedded core circuit board multi-bin vacuum pressing equipment includes cabin, heating mechanism and vacuumizing mechanism, preheating bin is set in cabin, pressing bin and buffer bin, first airtight door is isolated between preheating bin and pressing bin, second airtight door is arranged between pressing bin and buffer bin, and heating mechanism and vacuumizing mechanism control the temperature and vacuum degree of each chamber respectively;Transfer mechanism is used for transporting material, drive mechanism controls the opening and closing of feed bin door, discharge bin door and first airtight door and second airtight door;Control mechanism coordinates each unit to work cooperatively, realizes closed-loop control by real-time monitoring process parameters.The application solves the problems of heat crosstalk, pressure fluctuation and other problems existing in traditional single-bin equipment through multi-chamber physical isolation and independent environment control, improves the process stability and production efficiency of PCB embedded chip pressing.