46 results about "Embedded core" patented technology

The invention discloses a multi-bin vacuum press-fit device and method for an embedded core-embedded circuit board, and belongs to the technical field of PCB machining. The multi-bin vacuum press-fit device for the embedded core-embedded circuit board comprises a bin body, a heating mechanism and a vacuumizing mechanism, and a preheating bin, a press-fit bin and a buffering bin are arranged in the bin body; a first air-tight door is arranged between the preheating bin and the pressing bin for isolation, a second air-tight door is arranged between the pressing bin and the buffering bin, and the heating mechanism and the vacuumizing mechanism control the temperature and the vacuum degree of each bin respectively; the transferring mechanism is used for transferring materials, and the driving mechanism controls opening and closing of the feeding bin door, the discharging bin door, the first airtight door and the second airtight door. The control mechanism coordinates all the units to work cooperatively, and closed-loop control is achieved by monitoring technological parameters in real time. Through multi-chamber physical isolation and independent environment control, the problems of thermal crosstalk, pressure fluctuation and the like existing in traditional single-chamber equipment are solved, and the process stability and the production efficiency of PCB embedded chip pressing are improved.

The invention discloses a novel silicon carbide embedded core-embedded module packaging circuit board sintering device and method, and relates to the technical field of sintering processes. The device comprises a machine table, and a plurality of stations distributed at intervals are arranged on the machine table and sequentially comprise a feeding station, a plurality of preheating stations, a sintering station, a plurality of cooling stations and a discharging station; the lifting mechanisms are arranged on the machine table and located on the two sides of the multiple stations; the supporting mechanisms are located on the two sides of the multiple stations and movably connected with the lifting mechanism. The driving mechanism is arranged on the machine table and is in transmission connection with the supporting mechanism; and the sintering mechanism is arranged above the sintering station, the sintering mechanism can ascend and descend in the vertical direction, the sintering mechanism comprises a machining bin, an upper pressing die capable of ascending and descending is arranged in the machining bin, and a spray head used for providing inert gas is further arranged in the machining bin. According to the novel sintering device for the silicon carbide embedded core-embedded module packaging circuit board, the sintering quality and the sintering efficiency can be improved.

The present invention belongs to the field of embedded control technology, and relates to an embedded controller and a control method. An embedded controller suitable for an in-situ measurement system of acoustic characteristics of seabed sediments, comprising an embedded core board and a data acquisition control board; the embedded core board is used for communication control, data storage and analysis; the data acquisition control board is used to control sensor data acquisition and the opening and closing of peripheral switches. The embedded controller of the present invention uses a dual-control method of a CPU processor and a single-chip microcomputer to divide the core functions of the embedded controller, which not only utilizes the advantages of the powerful multi-task concurrent processing function of the embedded core board with an integrated high-speed processor and a transplanted Linux system, but also utilizes the advantages of the data acquisition control board with an integrated single-chip microcomputer with excellent real-time single control task performance, fast response time for data acquisition and signal judgment, and timely execution of control functions, so that the embedded controller solves the shortcomings and defects of the existing technology such as the unstable operation, high power consumption, long response time for control function execution, and inability to perform application function expansion such as visual control of the traditional in-situ measurement control system of acoustic characteristics of seabed sediments.

The invention relates to a core-linked closely-embedded core board and a production process, and relates to the technical field of core boards, the core-linked closely-embedded core board comprises single boards, one side of each single board is provided with a connecting protrusion, the other side of each single board is provided with a connecting groove body, the core board further comprises a covering layer, a plurality of single boards are spliced to form a core body, and the covering layer is arranged on the surface of the core body. The method has the advantage that the strength of the joints is high.

1. The name of the design product: embedded core display (UHD620). 2. The use of the design product: the design product is used for computer configuration. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.

The invention belongs to the field of drilling sampling, and relates to an embedded hollow spray pipe type single-wall coring device and a working method thereof.The device comprises a coring pipe, an embedded coring barrel and a connector, the coring pipe and the embedded coring barrel are in clearance fit, a groove in the inner wall of the coring pipe forms the hollow spray pipe, a drill bit nozzle on the front portion of the coring pipe is connected with the hollow spray pipe, and the hollow spray pipe is connected with the embedded coring barrel. The coring pipe is connected with the drill rod through the connector. When the device is adopted for sampling, compressed air enters the hollow spray pipe through the inner cavity of the drill rod and flows out at a high speed through the coring drill bit nozzle, heat generated by cutting friction of the drill bit is rapidly taken away, disturbance to drilling cuttings particles is reduced, a core sample embedded in the coring barrel does not make direct contact with the wall of the coring pipe, and air in a gap forms a heat insulation layer; the taken core sample is complete, keeps the original property, and is suitable for coal seam gas content measurement coring and broken coal measure strata down hole drilling coring.

The utility model provides a cooling embedded core processing device which comprises a mounting disc, a supporting bearing is fixedly connected to the middle of the upper portion of the mounting disc, and a rotary processing table is fixedly connected to the upper portion of the supporting bearing. A first driving motor is fixedly connected to an opening in the middle right side of the lower portion of the mounting disc, a first driving gear is fixedly connected to the upper end of an output shaft of the first driving motor, and the first driving gear is in meshing transmission connection with teeth of the supporting bearing. The upper portion of the rotary machining table is detachably and fixedly connected with a cooling embedded part. Through the arrangement of the base, the supporting plate, the arc-shaped rack, the inverted-U-shaped moving frame, a second driving motor, a second driving gear and an angle sensor, the effect of automatically adjusting the arrangement direction of the cooling embedded part is achieved, the adjusting efficiency of the cooling embedded part can be effectively improved, the problem that the machining efficiency of the cooling embedded part is affected is solved, and the machining efficiency of the cooling embedded part is improved. The use is more convenient.

The invention discloses an amplifier structure with a TL-C parallel embedded network. The amplifier structure comprises an amplifier embedded core, an input matching network and an output matching network; the input end of the input series embedded network is electrically connected with the output end of the input matching network; the output end of the output series embedded network is electrically connected with the input end of the output matching network; the input end of the parallel embedded network is electrically connected with the output end of the input matching network, and the output end of the parallel embedded network is electrically connected with the input end of the output matching network; and the input end of the active two-port network is electrically connected with the output end of the input series embedded network, and the output end of the active two-port network is electrically connected with the input end of the output series embedded network. The power gain of the amplifier can be effectively improved, and the problem that the characteristic impedance of a transmission line is low due to the fact that stray capacitance between metal and a substrate is large and the minimum width of the metal is limited by a chip design rule is effectively solved.

In embodiments herein, end-to-end bindings are described to create zones that span across various components in an SoC, such as I / O gateways, processor subsystems, NoCs, storage and data accelerators, and programmable logic. Each zone can be assigned to a different domain controlled by a tenant, such as an external host or software running on the host. In embodiments herein, end-to-end bindings are created between the acceleration engines, I / O gateways, and embedded cores of an SoC. Rather than treating these components as separate monolithic components, bindings divide hardware and memory resources among the components that make up the SoC into various zones. These zones can then have unique bindings for multiple tenants. Bindings can be configured as bridges between components to divide resources into zones and allow tenants of these zones to utilize dedicated resources that are protected from other tenants.

The application belongs to the technical field of intelligent manufacturing, and discloses a production quality online monitoring and tracing method and system for color steel profiled plates and aluminum-magnesium-manganese roof plates. Special sensing equipment is deployed in the whole link of raw material entering, profile forming and coating curing. Terahertz spectrum sensors, laser composite sensing units, infrared thermal imagers and other devices work together, and are matched with adaptive adjustment and self-calibration technologies to ensure the accuracy of process parameters and defect information collection. Cross-modal feature extraction and double-branch models are used for defect identification, which can accurately identify subtle surface defects, accurately locate internal micro-cracks and plate shape deviations, and realize full-process online monitoring. A hybrid trusted architecture combining blockchain, NFT and RFID is used to configure a unique identifier and digital certificate for each batch of plates, embed core quality information, and implant a special chip on the surface of the plate to support fast reading and writing in all scenarios.

The utility model relates to the technical field of linear motor production corollary equipment, and provides a rotor glue pouring clamp of a linear motor, which comprises a front side plate, a rear side plate, a left side plate, a right side plate, an upper end plate and a lower end plate, the motor is characterized in that the front side plate is attached to the bottom surface of an iron core of the rotor and is fixedly connected with a mounting strip embedded with the iron core through a locking piece, and comb teeth of the iron core are vertically arranged; the left side plate and the right side plate are attached to the left side wall and the right side wall of the iron core respectively. The upper end plate and the lower end plate are arranged at intervals with the front side wall and the rear side wall of the iron core respectively, the upper end plate is provided with an exhaust hole and a lead hole, and the lower end plate is provided with a glue pouring port. According to the utility model, the defects in the prior art are overcome, the design is reasonable, the use is convenient, and the technical problems that more bubbles are generated when the rotor of the existing linear motor is encapsulated, and the subsequent vacuum degassing treatment time is long are solved.

The embodiment of the invention relates to the technical field of display driving, and discloses an OLED display screen driving device. The system is connected with a PC device, an auxiliary power supply box, an interface bridging board and a screen conversion board, and comprises an embedded linux core board which is connected with the PC device and an embedded linux bottom board; the embedded linux bottom plate is connected with the interface bridging plate, the screen conversion plate, the auxiliary power supply box, the sampling and power supply driving plate, the HDMI interface, the RGB interface and the MIPI interface; the sampling and power supply driving board is connected with the auxiliary power supply box and the operational amplifier aluminum substrate; an operational amplifier aluminum substrate, wherein the operational amplifier aluminum substrate is connected with the screen conversion board; an HDMI interface, an RGB interface and an MPI interface. The problem that the display driving effect of the OLED display is insufficient can be at least solved.

The utility model discloses a data acquisition and data transmission device supporting multipath CAN communication, which comprises a box body bottom plate, a case left side plate, a case right side plate, a case rear panel and a case front panel, and is characterized in that the box body bottom plate is respectively connected with the case left side plate, the case right side plate, the case rear panel and the case front panel through first screws; the case left side plate is respectively connected with the case rear panel and the case front panel through second screws, the case right side plate is respectively connected with the case rear panel and the case front panel through third screws, and the case rear panel is respectively provided with a CAN bus interface connector and a debugging interface through first screws. Test tasks can be set according to test requirements and parameter settings, at most six paths of time-sharing data acquisition and transmission are supported, and data can be calculated and processed in real time and transmitted to a data center through an Ethernet communication interface through an embedded core controller.

The application relates to a simple design method of a low-cost embedded core module radiator, which comprises the following steps: firstly, a radiator design model is constructed, the radiator design model is composed of a substrate, a plurality of radiator fins, air ducts formed between the radiator fins, and a heat dissipation step below the substrate; secondly, the radiator power consumption is preset, the radiator fin height is estimated, natural heat dissipation and forced air cooling heat dissipation are evaluated according to a natural heat dissipation and forced air cooling heat dissipation evaluation algorithm, if the evaluation result is forced air cooling heat dissipation, then the radiator height suggestion value is obtained based on the air duct characteristic curve of the radiator and the characteristic curve of a heat dissipation fan and according to a forced air cooling radiator design algorithm; compared with general experimental methods and computer simulation design methods, the technical scheme has the advantages of simple and convenient scheme, high design success rate based on the embedded core module of the company, and the like.

The embodiment of the utility model discloses an embedded core board, an embedded mother board and electronic equipment, the embedded core board comprises a main control chip, a memory chip and a storage chip, the storage chip comprises a memory time sequence storage unit and a boot loader unit; the main control chip is connected with the memory chip, and a boot loader unit and a memory time sequence storage unit in the memory chip; the main control chip is provided with a first external interface, and the first external interface is used for being connected with the extended storage medium. According to the embedded core board, the first external interface is arranged on the main control chip in the embedded core board, so that the embedded core board can be connected with the corresponding extended storage medium through the first external interface according to actual use requirements on the basis of realizing a basic storage function through the storage chip of the embedded core board, and the overall storage space is expanded; therefore, the operation effect of the embedded core board is improved.

The invention provides an IEEE (Institute of Electrical and Electronic Engineers) 1149.10 to IEEE 1500 (Institute of Electrical and Electronic Engineers) signal The method specifically comprises the steps that a CONFIG packet, a TARGET packet, a CH-SELECT packet and an SCAN packet based on the IEEE Std 1149.10-2017 standard are received, after equipment configuration, target selection and channel locking are sequentially completed, the SCAN packet is decoded according to the IEEE 1149.10 rule, an IEEE1500 driving signal is generated by combining the mapping relation between a scanning channel and IEEE1500 registers (WIR, WBR and WBY), and communication control over the IEEE1500 interface chip equipment is achieved. Wherein the IEEE1500 driving signal covers a Wrapper clock signal (WRCK), a Wrapper serial input signal (WSI), an instruction / data selection signal (SelectWIR), a shift control signal (ShiftWR) and an update control signal (Update WR), and the IEEE1500 driving signal comprises a Wrapper clock signal (WRCK), a Wrapper serial input signal (WSI), an instruction / data selection signal (SelectWIR), a shift control signal (ShiftWR) and an update control signal (Update WR). According to the method, IEEE 1149.10 data packet interaction and time sequence constraints are followed, after test data are coded to generate a compliance packet, an IEEE1500 driving signal with an accurate time sequence can be generated through conversion, the data analysis and test requirements of a high-speed test port are met, and an efficient solution is provided for embedded core test of a system-on-chip (SoC).

In the use of the rotor core holding fixture, the setting of the connecting rod is automated to improve the production efficiency of the magnet embedded core. The invention comprises: a base (42) on which a rotor core holding fixture (10) is placed; an opposing table (46) which is connected to the base (42) and is opposed to the base (42); a pressurizing device (48) which is arranged on the opposing table (46) and pressurizes the upper plate (14) of the rotor core holding fixture (10) on the base (42) toward the lower plate (12); a clamping device (126) which is arranged on the base (42) and holds each connecting rod (30) in a detachable manner and is movable between a detached position in which the connecting rod (30) is detached from the engaging groove (32, 34) and an engaged position in which the connecting rod (30) is engaged with the engaging groove (32, 34); and a fluid pressure cylinder device (120) which is arranged on the base (42) and drives each clamping device (126) between the detached position and the engaged position.

The invention relates to a low-cost simple design method for an embedded core module radiator, and the method comprises the steps: firstly constructing a radiator design model which is composed of a substrate, a plurality of tooth sheets, air channels formed between the tooth sheets, and a radiating step below the substrate; then, the power consumption of the radiator is preset, the height of a tooth piece is estimated, natural heat dissipation and forced air cooling heat dissipation are evaluated according to a natural heat dissipation and forced air cooling heat dissipation evaluation algorithm, and if the evaluation result is forced air cooling heat dissipation, the power consumption of the radiator is estimated based on an air channel characteristic curve of the radiator and a characteristic curve of a cooling fan. Calculating a radiator height suggestion value according to a forced air cooling radiator design algorithm; compared with a common experimental method and a computer simulation design method, the technical scheme has the advantages that the scheme is simple and convenient, the design success rate based on the embedded core module of the company is high, and repeated revision or rework processing is avoided.

The invention relates to the technical field of navigation resolving circuits, and discloses a soc-based navigation resolving circuit, which comprises an embedded core board and a bottom board, and is characterized in that the bottom board comprises a first high-speed board-to-board connector, a serial port circuit, a CAN port circuit, a network PHY, an optical module, a hard disk, a first clock circuit, a network transformer, a first power supply circuit and an external connector; the embedded core board comprises an EMMC memory, a real-time clock, a DDR3, a second clock circuit, a second power supply circuit, an soc circuit and a second high-speed board-to-board connector; according to the navigation resolving circuit, the design of the embedded core board and the bottom board is adopted, a core processing circuit is separated from a peripheral circuit and an interface circuit, expandability and flexibility are greatly enhanced, and for different application requirements, quick response is achieved only by changing the bottom board, and development time and cost are saved.

This invention discloses a decentralized 5G distributed FWA networking method, comprising: trimming the NF network elements of the standard 5G core network; adjusting the standard 5G core network service functions to support data services and voice VoNR service functions; adjusting the technical specifications and performance indicators of the core network; developing 5G embedded base station-type core network software code to adapt to the hardware architecture and resource configuration of the base station at the software level and hardware driver level; freeing up the resources required to run the 5G core network software; completing the development of the embedded base station-type 5G core network software; establishing a unified remote user management center network element and mechanism; unifying the network management of the embedded core network, base stations, and CPEs, adopting distributed core functions, eliminating the need to deploy a centralized high-capacity core network, saving deployment and maintenance costs; and improving network security by eliminating the need for a central node, thus preventing the possibility of network-wide paralysis due to core network failure.

The invention belongs to the technical field of rails, particularly relates to a modularized reinforcing and connecting structure for a frog and a connecting method, and provides the following scheme aiming at the problems that the external position of a harmful space of an existing frog is basically intact, particularly under the working condition of a heavy haul railway, the frog is frequently replaced, a large amount of skylight point time is occupied, and the maintenance and repair workload is increased. The frog comprises a frog body and an inlaid core, a matching groove is formed in the top end of the frog body, a convex matching block is arranged at the bottom end of the embedded core, the convex matching block and the matching groove are used in a matched mode, and the embedded core is embedded into the frog body; the wedge-shaped clamping plate is arranged between the frog body and the inlaid core and is used for fastening and connecting the frog body and the inlaid core; the clamping plate is designed to have the overall dimension matched with the frog, the wedge-shaped gap capable of stabilizing the frog body and the inlaid core is designed, and the stability of the assembled frog can be better improved.

The present invention relates to an automated production system for embedded core boards, comprising an input device, a loading and feeding device, a placing device, a tooling processing device, a taking-out device, a discharging and feeding device and / or an output device connected in sequence; the input device comprises an input vertical lifting paired conveyor belt with an intermediate gap; the root of a horizontal bar of a horizontally placed input conveying L-shaped bracket is arranged on the input vertical lifting paired conveyor belt; the loading and feeding device comprises a feeding longitudinal movable slide seat connected to a taking hinged connecting arm arranged at the lower part of the intermediate gap; a feeding lifting frame is arranged above the feeding longitudinal movable slide seat; a feeding longitudinal telescopic rod is arranged on the feeding lifting frame, a feeding load-bearing intermediate support hand is arranged at the end of the feeding longitudinal telescopic rod, and a feeding side positioning platform is arranged at the root of the feeding load-bearing intermediate support hand; the present invention has reasonable design, compact structure and convenient use.

The invention provides an auxiliary demolding device, and relates to the technical field of composite material processing. The auxiliary demolding device comprises a demolding frame and a demolding trolley, the demolding frame is used for containing a cylindrical product embedded with a core mold, the demolding trolley comprises a frame, a lifting assembly arranged on the frame and a movable beam connected with the lifting end of the lifting assembly, and a demolding assembly is arranged on the movable beam and used for being connected with one sub core mold of the core mold. A core mold fixing assembly and a core mold ejection assembly are arranged on the demolding frame, the core mold fixing assembly is used for being connected with other sub core molds of the core mold, and the core mold ejection assembly is used for applying thrust to the demolding assembly so that the sub core molds connected with the core mold assembly can be separated from the cylindrical product. According to the auxiliary demolding device, the sub core molds can be sequentially and stably demolded, the problem of product damage caused by direct manual operation is avoided, meanwhile, core mold damage and potential safety hazards caused by direct manual knocking or prizing are avoided, meanwhile, a large amount of manpower and time are reduced, and the production efficiency is greatly improved.

The invention discloses an embedded core-embedded circuit board conveying device and circuit board sintering equipment thereof, and belongs to the technical field of circuit board sintering equipment. The embedded core-buried circuit board conveying device comprises a rack, a rotating mechanism and a plurality of bearing mechanisms, wherein the rotating mechanism is vertically arranged; the bearing mechanism can reciprocate along the rotation path of the rotation mechanism and is used for conveying the embedded core-embedded circuit board into the sintering device. By the adoption of the vertically-arranged rotary mechanism, the sliding direction of the bearing mechanism is changed into vertical rotary sliding, and the problem that existing serial operation equipment is large in occupied area can be solved. And secondly, the rotary sliding in the vertical direction increases the sliding distance, more sufficient time is provided for the heating or cooling process, and it can be ensured that the circuit board fully reaches the required temperature in the heating process.

A method includes placing a package component over a carrier. The package component includes a device die. A core frame is placed over the carrier. The core frame forms a ring encircling the package component. The method further includes encapsulating the core frame and the package component in an encapsulant, forming redistribution lines over the core frame and the package component, and forming electrical connectors over and electrically coupling to the package component through the redistribution lines.

The invention discloses a cleaning mechanism for circuit board core burying positioning glue injection and a circuit board core burying positioning glue injection device with the cleaning mechanism, the cleaning mechanism comprises a sliding seat, a glue wiping assembly, a wiping cloth assembly and a surface changing assembly, the sliding seat can drive the glue wiping assembly to slide back and forth in the first horizontal direction, and the sliding seat can drive the wiping cloth assembly to slide back and forth in the second horizontal direction; the frictioning assembly comprises cleaning cloth and two winding and unwinding reels, and the cleaning cloth can be conveyed in a reciprocating mode in the second horizontal direction; the wiping cloth assembly comprises an abutting head, and the cleaning cloth is arranged on the upper end face of the abutting head in the second horizontal direction and used for wiping and cleaning the glue injection head. The sliding seat slides in a reciprocating mode in the first horizontal direction, and the cleaning cloth is conveyed in a reciprocating mode in the second horizontal direction, so that the cleaning cloth moves in the two horizontal directions perpendicular to each other at the same time, the manual wiping action can be simulated, the cleaning effect on the glue injection head is improved, and meanwhile the utilization rate of the cleaning cloth is increased; the front and back surfaces of the cleaning cloth can be utilized through surface changing of the surface changing assembly, and the utilization rate of the cleaning cloth is increased.

The utility model relates to the technical field of remote data acquisition, in particular to a vehicle-mounted data acquisition device. An independent embedded core processor, a CAN controller and a CAN transceiver are adopted, wherein the CAN controller and the CAN transceiver are compatible with the core processor. The core processor receives the vehicle-mounted data through the CAN bus, the external expansion RAM connected with the core processor is used for storing the vehicle-mounted data, and the signal conditioning module is used for maintaining the signal strength and improving the acquisition precision. And then vehicle-mounted data is transmitted from the core processor to the GPRS module through the SCI module, and remote wireless transmission is realized by using the GPRS module. Therefore, the independent embedded core processor and the CAN bus, the CAN transceiver, the CAN controller, the core processor, the SCI module, the GPRS module, the external expansion RAM and the signal conditioning module which are matched are integrated into the vehicle-mounted data acquisition device, so that the sampling precision and reliability of vehicle-mounted data are improved, and the device can be separated from a PC (Personal Computer) to perform high-precision CAN signal acquisition.

The utility model provides a chassis CAN bus communication detector and a vehicle thereof, and the detector comprises a vehicle-mounted host which is detachably connected with a to-be-detected vehicle, and the vehicle-mounted host is in communication interaction connection with a chassis CAN bus of the to-be-detected vehicle through a CAN bus interface; the portable computer is provided with data analysis software, and the vehicle-mounted host is in communication interaction connection with the portable computer through a network interface or a WIFI interface. The vehicle-mounted host adopts the embedded core processing module, is installed in a magnetic attraction mode, and has the advantages of being low in power consumption, small in size and convenient to install. Meanwhile, the vehicle-mounted host supports lithium battery power supply, so that the use portability is improved; in addition, the core processing module filled with data acquisition software can acquire various CAN data, network data and Beidou data, so that the use condition of the chassis can be monitored in all directions.

The invention discloses a Chiplet three-dimensional integrated structure based on a reconstructed chip and a preparation method of the Chiplet three-dimensional integrated structure, and belongs to the technical field of semiconductor packaging. The Chiplet three-dimensional integrated structure comprises a substrate, embedded core particles, copper columns, functional core particles and an organic dry film; the substrate is provided with a chip embedding groove, the Pad surface of the embedded core particle is downwards arranged in the chip embedding groove, the copper column penetrates through the substrate and is connected with the embedded core particle and the functional core particle, the Pad surface of the embedded core particle is connected with one end of the copper column, the other end of the copper column is connected with the functional core particle, and the functional core particle is connected with the chip embedding groove. A chip embedding groove is formed in the substrate, a gap is formed between the embedded core particle and the inner wall of the chip embedding groove, the organic dry film is filled in the gap, vertical conductive through holes are formed in the substrate and the functional core particle and are communicated with each other, and the vertical conductive through holes of the substrate are positioned on two sides of the chip embedding groove. According to the invention, the problems that the Chiplet in the existing reconstructed chip is easy to deviate and the heat dissipation efficiency is low can be solved.

A method includes placing a package component over a carrier. The package component includes a device die. A core frame is placed over the carrier. The core frame forms a ring encircling the package component. The method further includes encapsulating the core frame and the package component in an encapsulant, forming redistribution lines over the core frame and the package component, and forming electrical connectors over and electrically coupling to the package component through the redistribution lines.