Integrated circuit packaging method with postpositional embedded core flow and package structure

A technology of integrated circuits and packaging methods, which is applied in the direction of circuits, electrical components, and electric solid devices, and can solve the problems of reduced compactness of integrated circuits, increased manufacturing process steps, and reduced production yields, so as to improve the heat dissipation performance of chips and simplify The production process and the effect of improving electrical performance
CN109659239AActive Publication Date: 2019-04-19NANTONG ACCESS SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
NANTONG ACCESS SEMICON CO LTD
Publication Date
2019-04-19

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Abstract

The present invention discloses an integrated circuit packaging method with a postpositional buried core flow and a package structure. A multi-layered board is formed by firstly adding layers, then atrench body is etched to embed active and / or passive devices, and then the sealing process is performed, thereby effectively simplifying the manufacturing process. In the second aspect, the advantagesof lead bonding and flip-chip bonding are compatible to cancel to a metal wire or a tin shot in the lead bonding and the flip-chip bonding and reduce the production cost; in the third aspect, the active and / or passive devices are inlaid in the package and are in seamless connection with the package material to improve the electrical performance, improve heat dissipation performance of the chip, achieve the package volume, shorten the connection with the outside, and allow the package size to be lighter and thinner. The integrated circuit packaging method with the postpositional buried core flow and the package structure can be widely applied to various integrated circuit package.
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Description

technical field

[0001] The invention relates to the field of system level packaging, in particular to a packaging method and packaging structure of a buried core substrate. Background technique

[0002] Integrated circuit packaging: put the integrated circuit die (Die) and passive devices (resistors, capacitors, etc.) produced by the fab on a substrate that acts as a load-bearing function, lead out the pins, and then fix and package them into a package. overall.

[0003] Consumer electronics, such as computers and telecommunications equipment, are becoming increasingly integrated, driven by the need for miniaturization of increasingly complex electronic components. The overall drive for the evolution of integrated circuits involves making smaller, thinner, lighter and more powerful products in high-reliability packages. The overall requirements for this packaged product are high reliability and proper electrical performance, thinness, rigidity, flatness, good thermal perfo...

Claims

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