Modularized PCB laser imaging device

Abstract

The invention relates to a modularized PCB laser imaging device, and belongs to the field of PCB machining, the modularized PCB laser imaging device comprises a supporting seat, a mounting groove is formed in the supporting seat, a conveying belt and a fixing block are mounted in the mounting groove, and a first support, a second support, a third support and a second guide plate are mounted on the supporting seat; the first support, the second support and the third support are each provided with an electric lifting sliding base, an electric translation sliding base and a laser machining head, a guide assembly is installed on each electric lifting sliding base, a diagonal plane is formed in each electric lifting sliding base, a connecting frame is installed on the fixing block, and protruding blocks are installed on the two sides of each connecting frame. A first magnetic block is installed on the protruding block, and a sliding groove is formed in the conveying belt. The PCB laser imaging device solves the problems that an existing PCB laser imaging device cannot shrink and clamp after being centered, cannot automatically release after being processed, and cannot concentrate a PCB production line in the same longitudinal space.

Description

Technical Field

[0001] The invention relates to a modular PCB laser imaging device, belonging to the field of PCB processing. Background Art

[0002] PCB is the basic carrier of electronic components and the core component used to support and connect various electronic components in electronic products. Through circuit connection, it provides physical support for electronic components and completes signal transmission and power supply. The production process of PCB boards involves multiple steps, including etching and pattern transfer of circuit patterns. The laser imaging device directly irradiates the photosensitive layer with a laser beam, using the high energy density and precise control capability of the laser to achieve precise transfer of the PCB pattern.

[0003] Existing PCB board processing devices still have some defects. For example, the invention patent with publication number CN110225663A discloses a fixture for PCB circuit board laser engraving tooling, including a material loading plate arranged in a horizontal direction on the top wall, and a frame fixed to the bottom of the material loading plate. It also includes two groups of fixed clamping members arranged on the two side edges facing each other of any group of the material loading plates, and movable clamping members respectively arranged on the two side edges facing each other of the other group of the material loading plates. Each group of the fixed clamping members includes a movable block arranged on the material loading plate and sliding in a horizontal direction toward one side of the other group of fixed clamping members, a first driving cylinder connected to the movable block, a pressing plate rotatably connected to the movable block, and a first rotating driving member connected to the pressing plate.

[0004] Although the above-mentioned device can realize the clamping function, when in use, the existing PCB board processing equipment is transported to the corresponding position for laser imaging processing through the conveyor belt guide structure. Although the alignment function can be realized, the alignment accuracy is low. The PCB board cannot be clamped by the automatically shrinking clamping structure after centering guidance, and the PCB board cannot be automatically released after the laser imaging processing is completed. It cannot quickly align multiple PCB boards during multi-station laser imaging processing. The existing PCB laser imaging device occupies a large amount of horizontal space as a whole and cannot be extended vertically to concentrate the PCB board production line in the same vertical space.

[0005] Therefore, we make improvements to this problem and propose a modular PCB board laser imaging device. Summary of the Invention

[0006] (1) The technical problems to be solved by the present invention are: the existing PCB laser imaging device cannot shrink and clamp after centering, cannot automatically release after processing, and cannot extend longitudinally to concentrate the PCB production line in the same longitudinal space.

[0007] (2) Technical solution In order to achieve the above-mentioned purpose of the invention, the present invention provides a modular PCB board laser imaging device, including a support base, the support base is provided with a mounting slot, the mounting slot is installed in the conveyor belt and the fixed block, the support base is installed with a first bracket, a second bracket, a third bracket and a second guide plate, the first bracket, the second bracket and the third bracket are all installed with an electric lifting slide, an electric translation slide and a laser processing head, the electric lifting slide is installed with a guide assembly, the electric lifting slide is provided with a chamfered surface, the fixed block is installed with a connecting frame, both sides of the connecting frame are provided with protrusions, the protrusions are installed with a first magnetic block, the conveyor belt is provided with a slide groove, a slider is slidably installed in the slide groove, the slider is connected to the conveyor belt by an elastic rope and a supporting spring, the slider is installed with a side plate, the side of the side plate is fixedly connected with the second magnetic block, the electric translation slide is installed with an alignment assembly, and the side of the alignment assembly is provided with a driving assembly.

[0008] Among them, an extension plate is installed on the first bracket, and a film-sticking assembly is installed on the extension plate. The film-sticking assembly includes a connecting plate fixedly set on the extension plate, and a damping shaft is installed on the connecting plate. A film rolling roller is installed on the damping shaft.

[0009] Among them, the first bracket, the second bracket and the third bracket are distributed at equal intervals on the support seat, the side plates are distributed at equal intervals on the conveyor belt, and the spacing between adjacent two side plates, the spacing between the first bracket and the second bracket, and the spacing between the second bracket and the third bracket are all equal.

[0010] The heights of the electric translation slides on the first bracket, the second bracket and the third bracket are all different. The guide assembly includes a first connecting plate and a second connecting plate fixedly connected to the electric lifting slide, a first rotating rod is rotatably mounted on the first connecting plate, and a second rotating rod is rotatably mounted on the second connecting plate and the bevel surface.

[0011] Among them, a fixed shaft is fixedly provided on the second connecting plate, a first guide plate is rotatably installed on the outer side of the fixed shaft, a first vortex spring is installed between the first guide plate and the fixed shaft, a rotating block is rotatably installed on the first guide plate, and the rotating blocks are evenly spaced on the first guide plate.

[0012] The magnetic poles of the first magnetic block and the opposite side of each second magnetic block are the same, and the side plates, the second magnetic blocks and the conveyor belt are symmetrically distributed on both sides of the first magnetic block.

[0013] Among them, the driving assembly includes a motor installed on the first bracket, a connecting rod is fixedly connected to the output shaft of the motor, support blocks are installed on the second bracket and the third bracket, the connecting rod is rotatably installed in the support block, and a connecting belt is fixedly connected to the side of the connecting rod.

[0014] Among them, the alignment assembly includes a first connecting block fixedly connected to the electric translation slide, a second connecting block is fixedly arranged on the first connecting block, a baffle is rotatably connected to the outer side of the second connecting block, a second vortex spring is installed between the second connecting block and the baffle, and the baffle is fixedly connected to the connecting belt.

[0015] The positions and quantities of the baffles and the connecting belts correspond one to one, and the connecting belts are distributed at equal intervals on the connecting rod.

[0016] (3) Beneficial effects The modular PCB laser imaging device provided by the present invention has the following beneficial effects: 1. The guide assembly, conveyor belt, side plate and second magnetic block are provided to realize the function of automatic clamping and releasing the PCB board. The PCB board to be processed is placed on the second connecting plate, and the PCB board will slide along the inclined surface of the second connecting plate and the oblique cut surface of the electric lifting slide to realize the centering guiding function until the PCB board is conveyed to one side of the conveyor belt. When the conveyor belt rotates at the turning point, the first magnetic block and the second magnetic block assembly approach, thereby pushing the two groups of second magnetic blocks and the side plates outward. As the PCB board falls, the second magnetic block catches the PCB board, and the first magnetic block and the second magnetic block gradually move away, so that the two groups of side plates and the second magnetic block automatically clamp the PCB board under the action of the supporting spring. After the PCB board is conveyed to the electric lifting slide, the electric translation slide and the laser processing head, laser imaging processing can be started, which solves the problem that the existing PCB board laser imaging device cannot automatically clamp the PCB board after centering guidance.

[0017] 2. The device is provided with a third equidistantly distributed bracket and three laser processing heads with flush bottoms. When the beveled surface and the upper surface of the second connecting plate are located on the same bevel, the bottoms of the laser processing heads are located on the same plane, which not only enables the PCB board to slide onto the conveyor belt through the first rotating rod and the second rotating rod, but also ensures that the laser processing heads at three positions are processed synchronously, thereby enhancing the processing efficiency of the device. In addition, since the device first guides the PCB board to the conveyor belt in the center through a guide, and then transports it in the direction opposite to the centering guide through the conveyor belt, the overall lateral space occupied by the device is reduced, and the longitudinal space is fully utilized, so that the feeding and discharging of the device are located in the same longitudinal area, which solves the problems that the existing laser imaging equipment cannot quickly align multiple PCB boards during multi-station laser imaging processing and cannot extend longitudinally to concentrate the PCB board production line in the same longitudinal space.

[0018] 3. The convex block, the first magnetic block and the second guide plate are provided to realize the automatic release of the PCB board after the laser imaging processing. When the PCB board moves to the turning position on the other side of the conveyor belt, the first magnetic block will repel the second magnetic block again, so that the two sets of side plates and the second magnetic block move away from each other, thereby releasing the processed PCB board. This solves the problem that the existing device cannot automatically release the PCB board after the laser imaging processing is completed. The automatic clamping and automatic release structure combined with the three-station modular structure not only improves the working efficiency of the device but also improves the laser imaging processing accuracy of the device.

[0019] 4. The device is equipped with a drive assembly and an alignment assembly. The motor on the drive assembly drives the connecting rod to rotate, and the connecting rod pulls the baffle through the connecting belt, so that the baffle can resist the PCB boards conveyed on the conveyor belt, thereby ensuring that the positions of the PCB boards in the three processing areas and the corresponding laser processing heads are consistent, thereby ensuring the stability of the processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the connection structure between the support base and the first bracket of the present invention; Figure 3 This is a schematic diagram of the connection structure between the electric lifting slide and the first connecting plate of the present invention; Figure 4 for Figure 3 A magnified schematic diagram of the structure at center A; Figure 5 for Figure 3 A magnified schematic diagram of the structure at B in the middle; Figure 6 This is a schematic diagram of the connection structure between the side plate and the second magnetic block of the present invention; Figure 7 This is a schematic diagram of the connection structure between the first bracket and the motor of the present invention; Figure 8 for Figure 7 A magnified schematic diagram of the structure at C in the middle; Figure 9 This is a schematic diagram of the bottom structure of the connecting frame of the present invention; Figure 10 for Figure 9A magnified schematic diagram of the structure at D in the middle; Figure 11 This is a schematic diagram of the connection structure between the drive assembly and the alignment assembly of the present invention; Figure 12 for Figure 11 Enlarged schematic diagram of the structure at E in the middle.

[0022] Figure numerals: 1, support base; 2, mounting groove; 3, conveyor belt; 4, first bracket; 5, second bracket; 6, third bracket; 7, extension plate; 8, film laminating assembly; 801, connecting plate; 802, damping shaft; 803, film rolling roller; 9, electric lifting slide; 10, electric translation slide; 11, laser processing head; 12, guide assembly; 1201, first connecting plate; 1202, first rotating rod; 1203, second connecting plate; 1204, second rotating rod; 1205, fixed shaft; 1206, first vortex spring; 1207, first guide Plate; 1208, rotating block; 13, beveled surface; 14, fixed block; 15, connecting frame; 16, protrusion; 17, first magnetic block; 18, second guide plate; 19, slide groove; 20, slider; 21, side plate; 22, second magnetic block; 23, elastic cord; 24, support spring; 25, drive assembly; 2501, motor; 2502, support block; 2503, connecting rod; 2504, connecting belt; 26, alignment assembly; 2601, first connecting block; 2602, second connecting block; 2603, baffle; 2604, second vortex spring. DETAILED DESCRIPTION

[0023] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention.

[0024] Example 1: like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 and Figure 12As shown, this embodiment proposes a modular PCB board laser imaging device, including a support base 1, a mounting groove 2 is provided on the support base 1, a conveyor belt 3 and a fixed block 14 are installed in the mounting groove 2, a first bracket 4, a second bracket 5, a third bracket 6 and a second guide plate 18 are installed on the support base 1, the first bracket 4, the second bracket 5 and the third bracket 6 are all installed with an electric lifting slide 9, an electric translation slide 10 and a laser processing head 11, the electric lifting slide 9, the electric translation slide 10 and the laser processing head 11 on each bracket are synchronously lifted or moved left and right, and three-station processing is performed to improve the working efficiency of the device, a guide assembly 12 is installed on the electric lifting slide 9, a chamfered surface 13 is provided on the electric lifting slide 9, a connecting frame 15 is installed on the fixed block 14, protrusions 16 are installed on both sides of the connecting frame 15, a first magnetic block 17 is installed on the protrusion 16, a slide groove 19 is provided on the conveyor belt 3, and a sliding block 19 slides in the slide groove 19 A slider 20 is installed, and the slider 20 is connected to the conveyor belt 3 by an elastic rope 23 and a supporting spring 24. A side plate 21 is installed on the slider 20, and a second magnetic block 22 is fixedly connected to the side of the side plate 21. The first magnetic block 17 can abut the second magnetic block 22, so that when the corresponding side plate 21 and the second magnetic block 22 on the conveyor belt 3 move to the turning area, as the first magnetic block 17 gradually approaches and then gradually moves away from the second magnetic block 22, the two groups of second magnetic blocks 22 and the side plates 21 will first move away from each other and then approach each other, so as to automatically clamp and release the PCB board. An alignment component 26 is installed on the electric translation slide 10, and a driving component 25 is provided on the side of the alignment component 26. The driving component 25 is used to pull the alignment component 26, and the alignment component 26 abuts the PCB board, so that after the PCB board is centered on the two groups of side plates 21 and the second magnetic block 22, each PCB board is aligned with the corresponding laser processing head 11, thereby ensuring processing accuracy.

[0025] Example 2: The solution in Example 1 is further introduced below in conjunction with a specific working method, as described below: like Figure 1 As shown, as a preferred embodiment, on the basis of the above method, further, an extension plate 7 is installed on the first bracket 4, and a film-sticking component 8 is installed on the extension plate 7. The film-sticking component 8 includes a connecting plate 801 fixedly arranged on the extension plate 7, and a damping shaft 802 is installed on the connecting plate 801. The damping shaft 802 and the damping shaft 802 are provided with a film roller 803. The film roller 803 is used to attach the film to the surface of the PCB board for subsequent laser imaging processing of the circuit. When the film is pulled, the damping shaft 802 on the connecting plate 801 will provide a certain pulling force, thereby ensuring the film-sticking effect.

[0026] like Figure 2As shown, as a preferred embodiment, on the basis of the above method, further, the first bracket 4, the second bracket 5 and the third bracket 6 are evenly spaced on the support seat 1, the side panels 21 are evenly spaced on the conveyor belt 3, the spacing between adjacent side panels 21, the spacing between the first bracket 4 and the second bracket 5, and the spacing between the second bracket 5 and the third bracket 6 are all equal. Since the spacing between adjacent side panels 21 and adjacent brackets is equal, when the PCB boards on each group of side panels 21 are aligned, three stations can be processed simultaneously, thereby improving the processing efficiency of the device.

[0027] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 As shown, as a preferred embodiment, on the basis of the above method, further, the heights of the electric translation slides 10 on the first bracket 4, the second bracket 5 and the third bracket 6 are all different. When the beveled surfaces 13 on the first bracket 4, the second bracket 5 and the third bracket 6 are located on the same bevel, the lowest points of the laser processing heads 11 are in the same plane, so that the device can guide the PCB board to the surface of the conveyor belt 3 in the center, thereby enhancing the convenience of the device when used.

[0028] like Figure 3 、 Figure 4 and Figure 5 As shown, as a preferred embodiment, on the basis of the above method, further, the guide assembly 12 includes a first connecting plate 1201 and a second connecting plate 1203 fixedly connected to the electric lifting slide 9, and a first rotating rod 1202 is rotatably installed on the first connecting plate 1201, and a second rotating rod 1204 is rotatably installed on the second connecting plate 1203 and the beveled surface 13. The PCB board will first be transported to the first connecting plate 1201 through the second connecting plate 1203 and the second rotating rod 1204 on the beveled surface 13, and then gradually slide to the starting position of the conveyor belt 3 through the first rotating rod 1202 on the first connecting plate 1201, thereby realizing the centering guiding function.

[0029] like Figure 3 、 Figure 4 and Figure 5As shown, as a preferred embodiment, on the basis of the above method, further, a fixed shaft 1205 is fixedly provided on the second connecting plate 1203, and a first guide plate 1207 is rotatably installed on the outer side of the fixed shaft 1205, a first vortex spring 1206 is installed between the first guide plate 1207 and the fixed shaft 1205, and a rotating block 1208 is rotatably installed on the first guide plate 1207. The rotating blocks 1208 are evenly spaced on the first guide plate 1207, and the PCB board will realize the centering guiding function along the two gradually narrowing first guide plates 1207. The rotating block 1208 is used to reduce the side resistance of the PCB board when it slides. The first vortex spring 1206 on the fixed shaft 1205 can drive the first guide plate 1207 to rotate slightly to adapt to the centering guidance of PCB boards of different sizes.

[0030] like Figure 6 and Figure 7 As shown, as a preferred embodiment, on the basis of the above method, further, the magnetic poles of the first magnetic block 17 and the opposite side of each second magnetic block 22 are the same, and the side plates 21, the second magnetic blocks 22 and the conveyor belt 3 are symmetrically distributed on both sides of the first magnetic block 17. Since the first magnetic block 17 and the second magnetic block 22 repel each other, when the PCB board is at the starting position of the conveyor belt 3, the two groups of side plates 21 and the second magnetic blocks 22 first move away from each other and then approach each other, thereby clamping the PCB board. When the PCB board is at the end position of the conveyor belt 3, the two groups of side plates 21 and the second magnetic blocks 22 move away from each other and then approach each other again, thereby automatically clamping and releasing the PCB board.

[0031] like Figure 6 、 Figure 7 、 Figure 9 、 Figure 11 and Figure 12 As shown, as a preferred embodiment, on the basis of the above method, further, the driving component 25 includes a motor 2501 installed on the first bracket 4, and a connecting rod 2503 is fixedly connected to the output shaft of the motor 2501. Support blocks 2502 are installed on the second bracket 5 and the third bracket 6. The connecting rod 2503 is rotatably installed in the support block 2502, and a connecting belt 2504 is fixedly connected to the side of the connecting rod 2503. The support block 2502 is used to support the connecting rod 2503, and the connecting rod 2503 is driven to rotate by the motor 2501, thereby pulling the connecting belt 2504, so that the PCB boards in the three positions can be aligned subsequently.

[0032] like Figure 11 and Figure 12As shown, as a preferred embodiment, on the basis of the above method, further, the alignment component 26 includes a first connecting block 2601 fixedly connected to the electric translation slide 10, a second connecting block 2602 is fixedly provided on the first connecting block 2601, a baffle 2603 is rotatably connected to the outer side of the second connecting block 2602, a second vortex spring 2604 is installed between the second connecting block 2602 and the baffle 2603, the baffle 2603 is fixedly connected to the connecting belt 2504, and the connecting belt 2504 is used to pull the baffle 2603. When the baffle 2603 is in Figure 11 and Figure 12 When the baffle 2603 is in the middle position, the baffle 2603 will block the PCB board, thereby aligning the PCB boards in the three positions. By further pulling the connecting belt 2504, the baffle 2603 is rotated counterclockwise, so that when the device is performing laser imaging processing, the baffle 2603 will not interfere with the normal operation of the device. The second vortex spring 2604 between the second connecting block 2602 and the baffle 2603 can reset the baffle 2603.

[0033] like Figure 11 and Figure 12 As shown, as a preferred embodiment, on the basis of the above method, further, the positions and quantities of the baffles 2603 and the connecting belts 2504 correspond one to one, and the connecting belts 2504 are evenly spaced on the connecting rod 2503. The three evenly spaced connecting belts 2504 can pull the baffles 2603 on the three workstations, thereby realizing the synchronous adjustment function.

[0034] Example 3: The solutions in Example 1 and Example 2 are further introduced below in conjunction with specific working methods, as described below: Specifically, when the modular PCB laser imaging device is used: Figure 2 、 Figure 4 、 Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 and Figure 10 As shown, the support base 1 is used to support the first bracket 4, the second bracket 5 and the third bracket 6. The conveyor belt 3 with symmetrically distributed mounting grooves 2 is used to support the side panels 21 distributed evenly on its surface, so as to cooperate with the second magnetic block 22 to transport the PCB board to the processing area. The PCB board is first transported to the first connecting plate 1201 through the second connecting plate 1203 and the second rotating rod 1204 on the beveled surface 13, and then slides to the starting position of the conveyor belt 3 through the first rotating rod 1202 on the first connecting plate 1201. When the PCB board slides on the first connecting plate 1201, as shown in FIG. Figure 1 and Figure 5As shown, the PCB board will be guided along the two gradually narrowing first guide plates 1207 to achieve a centering function. The rotating block 1208 is used to reduce the side resistance of the PCB board when it slides. The first vortex spring 1206 on the fixed shaft 1205 can make the first guide plate 1207 rotate slightly and then reset, so that the device can adapt to different sizes of PCB boards for centering guidance. Because the magnetic poles of the first magnetic block 17 and the opposite side of each second magnetic block 22 are the same, the first magnetic block 17 and the second magnetic block 22 repel each other. When the PCB board is at the starting position of the conveyor belt 3, the two sets of side plates 21 and the second magnetic block 22 first move away from each other and then move closer to each other, thereby clamping the PCB board and conveying it to the three processing stations. When the PCB board is at the end position of the conveyor belt 3, the two sets of side plates 21 and the second magnetic block 22 move away from each other and then move closer to each other again, thereby automatically clamping and releasing the PCB board, as shown in FIG. Figure 1 As shown, the film roller 803 is used to attach the film to the surface of the PCB board for subsequent laser imaging processing of the circuit. When the film is pulled, the damping shaft 802 on the connecting plate 801 will provide a certain pulling force to ensure the film-sticking effect.

[0035] like Figure 2 、 Figure 3 、 Figure 5 、 Figure 6 、 Figure 9 、 Figure 11 and Figure 12 As shown, after the PCB board is transported to the position directly below the electric lifting slide 9, the electric translation slide 10 and the laser processing head 11, the laser imaging process can be started. Since the beveled surfaces 13 on the first bracket 4, the second bracket 5 and the third bracket 6 are located on the same bevel, the lowest points of the laser processing heads 11 are in the same plane, and the first bracket 4, the second bracket 5 and the third bracket 6 are equidistantly distributed, and the spacing between adjacent brackets and adjacent side panels 21 is equal, it is only necessary to keep the PCB boards on each side panel 21 in the same position to achieve synchronous processing of the stations. The driving component 25 is used to pull the alignment component 26, and the alignment component 26 abuts the PCB board, so that after the PCB board is centered on the two sets of side panels 21 and the second magnetic block 22, each PCB board is aligned with the corresponding laser processing head 11, thereby ensuring processing accuracy during synchronous processing of the three stations. Figure 11 and Figure 12 As shown, the motor 2501 drives the connecting rod 2503 to rotate, and the connecting belt 2504 is wound around the outside of the connecting rod 2503. The connecting belt 2504 pulls the baffle 2603, and the baffle 2603 is in Figure 12When in the middle position, the rear surface of baffle 2603 abuts against the PCB, thereby aligning the three PCBs with the corresponding laser processing head 11. Baffle 2603 is further pulled by connecting belt 2504, rotating counterclockwise, preventing it from blocking the PCB during laser imaging. A second vortex spring 2604 between second connecting block 2602 and baffle 2603 resets baffle 2603. Finally, the finished PCB at the end of conveyor belt 3 is guided by protrusion 16 and second guide plate 18.

[0036] The above embodiments are intended to illustrate the present invention only and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that various combinations, modifications, or equivalent substitutions of the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention and should be encompassed by the scope of the claims of the present invention.

Claims

1. A modular PCB laser imaging device, comprising a support base (1), characterized in that: The support seat (1) is provided with a mounting groove (2), a conveyor belt (3) and a fixed block (14) are installed in the mounting groove (2), a first bracket (4), a second bracket (5), a third bracket (6) and a second guide plate (18) are installed on the support seat (1), an electric lifting slide (9), an electric translation slide (10) and a laser processing head (11) are installed on the first bracket (4), the second bracket (5) and the third bracket (6), a guide assembly (12) is installed on the electric lifting slide (9), an oblique cut surface (13) is provided on the electric lifting slide (9), and a connecting frame ( 15), protrusions (16) are installed on both sides of the connecting frame (15), a first magnetic block (17) is installed on the protrusion (16), a slide groove (19) is provided on the conveyor belt (3), a slider (20) is slidably installed in the slide groove (19), the slider (20) is connected to the conveyor belt (3) through an elastic rope (23) and a support spring (24), a side plate (21) is installed on the slider (20), and a second magnetic block (22) is fixedly connected to the side of the side plate (21), an alignment component (26) is installed on the electric translation slide (10), and a driving component (25) is provided on the side of the alignment component (26).

2. The modular PCB laser imaging device according to claim 1, characterized in that: An extension plate (7) is mounted on the first bracket (4), a film-sticking assembly (8) is mounted on the extension plate (7), the film-sticking assembly (8) comprises a connecting plate (801) fixedly arranged on the extension plate (7), a damping shaft (802) is mounted on the connecting plate (801), and a film-rolling roller (803) is mounted on the damping shaft (802).

3. The modular PCB laser imaging device according to claim 1, characterized in that: The first bracket (4), the second bracket (5) and the third bracket (6) are distributed at equal intervals on the support base (1), the side plates (21) are distributed at equal intervals on the conveyor belt (3), and the spacing between adjacent side plates (21), the spacing between the first bracket (4) and the second bracket (5), and the spacing between the second bracket (5) and the third bracket (6) are all equal.

4. The modular PCB laser imaging device according to claim 1, characterized in that: The heights of the electric translation slides (10) on the first bracket (4), the second bracket (5) and the third bracket (6) are all different.

5. The modular PCB laser imaging device according to claim 1, characterized in that: The guide assembly (12) comprises a first connecting plate (1201) and a second connecting plate (1203) fixedly connected to the electric lifting slide (9); a first rotating rod (1202) is rotatably mounted on the first connecting plate (1201); and a second rotating rod (1204) is rotatably mounted on both the second connecting plate (1203) and the beveled surface (13).

6. The modular PCB laser imaging device according to claim 5, characterized in that: A fixed shaft (1205) is fixedly provided on the second connecting plate (1203), a first guide plate (1207) is rotatably installed on the outer side of the fixed shaft (1205), a first vortex spring (1206) is installed between the first guide plate (1207) and the fixed shaft (1205), a rotating block (1208) is rotatably installed on the first guide plate (1207), and the rotating blocks (1208) are distributed at equal intervals on the first guide plate (1207).

7. The modular PCB laser imaging device according to claim 1, characterized in that: The first magnetic block (17) has the same magnetic pole as the side opposite to each second magnetic block (22), and the side plate (21), the second magnetic block (22) and the conveyor belt (3) are symmetrically distributed on both sides of the first magnetic block (17).

8. The modular PCB laser imaging device according to claim 1, characterized in that: The driving assembly (25) comprises a motor (2501) mounted on a first bracket (4), a connecting rod (2503) being fixedly connected to an output shaft of the motor (2501), support blocks (2502) being mounted on both the second bracket (5) and the third bracket (6), the connecting rod (2503) being rotatably mounted in the support block (2502), and a connecting belt (2504) being fixedly connected to a side surface of the connecting rod (2503).

9. The modular PCB laser imaging device according to claim 8, characterized in that: The alignment assembly (26) includes a first connecting block (2601) fixedly connected to the electric translation slide (10), a second connecting block (2602) fixedly arranged on the first connecting block (2601), a baffle (2603) rotatably connected to the outer side of the second connecting block (2602), a second vortex spring (2604) installed between the second connecting block (2602) and the baffle (2603), and a fixed connection between the baffle (2603) and the connecting belt (2504).

10. The modular PCB laser imaging device according to claim 9, characterized in that: The positions and numbers of the baffles (2603) and the connecting belts (2504) correspond one to one, and the connecting belts (2504) are distributed at equal intervals on the connecting rod (2503).

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